Chip package and method for fabricating the same

Stacked semiconductor device and device stacking method

Layer between interfaces of different components in semiconductor devices

Composite board with semiconductor chips and plastic housing composition and method

Solder bump structure for flip chip package and method for manufacturing the same

SEMICONDUCTOR DEVICE WITH BATTERY

Bond pad structure for wire bonding

RF power transistor device with metal electromigration design and method thereof

Semiconductor device having capacitors for reducing power source noise

PACKAGE WARPAGE CONTROL

Chip-size package structure and method of the same

Semiconductor package structure and method for manufacturing the same

Adhesive compositions containing cyclic siloxanes and methods for use thereof

Method for diffusion soldering

Horn-holder pivot type bonding apparatus

Compliant wirebond pedestal

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

STACKED CONTACT BUMP

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Chip packaging process

Semiconductor packaging method

Capacitor attachment method

Semiconductor package

Method for manufacturing semiconductor device

Method for fabricating stacked semiconductor components with through wire interconnects

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device with semiconductor device components embedded in plastic package compound

System for fabricating semiconductor components with through wire interconnects

Electronic assembly and method for forming the same

METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE

Wiring board with connection electrode formed in opening and semiconductor device using the same

Chip package

Semiconductor apparatus

Semiconductor device, electronic device and fabrication method of the same

Redistribution connecting structure of solder balls

Flip-Chip Device Having Underfill in Controlled Gap

Bond pad structures with reduced coupling noise

Chip underfill in flip-chip technologies

Power semiconductor arrangement

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Chip stack package

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

Semiconductor device and heat radiation member

No lead package with heat spreader

Multi-row lead frame

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Wafer-leveled chip packaging structure and method thereof

Manufacturing method of semiconductor module including solid-liquid diffusion joining steps

Semiconductor device and manufacturing method for the same

Processed wafer via

Flip chip in package using flexible and removable leadframe

Method of resin sealing electronic part

Manufacturing method of semiconductor device

Semiconductor device and manufacturing the same

Stacked chip-based system and method

Film bonding method, film bonding apparatus, and semiconductor device manufacturing method

DC/DC converter

Semiconductor device and a manufacturing method thereof

Integrated circuit package system with L-shaped leadfingers

Integrated circuit package system with bonding lands

Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated

Cap layer for an aluminum copper bond pad

Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package

Integrated circuit architecture for reducing interconnect parasitics

Apparatus for integrated input/output circuit and verification method thereof

Semiconductor device and manufacturing method for the same

Power semiconductor modules having a cooling component and method for producing them

Redistributed solder pads using etched lead frame

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Pressure contact power semiconductor module

Semiconductor package including transformer or antenna

Single-chip and multi-chip module for proximity communication

Semiconductor apparatus containing multi-chip package structures

Apparatus and methods for high-density chip connectivity

Bonding method and apparatus

RF module including control IC without the aid of a relay pad

Low profile compliant leads

Printed board with a pin for mounting a component

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Electronic device and method of manufacturing the same

Integrated circuit package system with exposed interconnects

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Image sensor packaging structure and method of manufacturing the same

Positively radiation-sensitive resin composition

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME

Electronic assembly with detachable components

Semiconductor device having improved wire-bonding reliability and method of manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Connection structure and method for fabricating the same

Method of fabricating semiconductor memory device and semiconductor memory device driver

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Patterned gold bump structure for semiconductor chip

Semiconductor device

Power semiconductor modules and method for producing them

Semiconductor component with semiconductor chip and adhesive film, and method for its production

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Semiconductor device and method of manufacturing the same

Method of producing a semiconductor device by forming an oxide film on a resin layer

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method for forming a stud bump

Component mounting method, component mounting apparatus, and ultrasonic bonding head

Printed wiring board with component mounting pin and electronic device using the same

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Semiconductor device

Active area bonding compatible high current structures

Methods of forming metal layers using multi-layer lift-off patterns

Method for producing a surface-mountable semiconductor component

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Method for fabricating semiconductor package

Method of flip-chip mounting

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Method of fabricating wafer level package

Nanoscale metal paste for interconnect and method of use

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device

Semiconductor device

CHIP CONNECTOR

Semiconductor device having a bump formed over an electrode pad

Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Substrate and method for mounting silicon device

Solder bump on a semiconductor substrate

Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device having through contact blocks with external contact areas

Semiconductor device

Module part

Stacked integrated circuit package system with face to face stack configuration

Semiconductor device package and methods for producing same

Circuit board structure embedded with semiconductor chips

Microelectronic devices and methods for manufacturing microelectronic devices

Stacked semiconductor device

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Bare chip embedded PCB

Semiconductor device and manufacturing method thereof

Integrated circuit package system with leadfinger support

Semiconductor device with visible indicator and method of fabricating the same

Capacitor and manufacturing method thereof

Electronic module with stacked semiconductors

Semiconductor device having an antenna with anisotropic conductive adhesive

Method of reeling a series of RFID tags and RFID tag roll

Magnetic alignment of integrated circuits to each other

Bond capillary design for ribbon wire bonding

Method for setting capillary contact position data and wire bonding apparatus using the same

WIRE BONDING METHOD AND APPARATUS

Component mounting method and component mounting apparatus

Ground shields for semiconductors

Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation

Solder composition and method of bump formation therewith

Direct write# system

Method for forming multi-layer bumps on a substrate

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

Method for manufacturing a surface mount device

Fabrication of an integrated circuit package

Flip-chip semiconductor device and method for fabricating the same

Method of packaging semiconductor die without lead frame or substrate

Composite interconnect structure using injection molded solder technique

Method of manufacturing semiconductor device

Thermal enhanced package

Hybrid multilayer substrate and method for manufacturing the same

Probe For Semiconductor Devices

Semiconductor device and method of manufacturing thereof

Low temperature co-fired ceramic module and method of manufacturing the same

Structure and method for bond pads of copper-metallized integrated circuits

Semiconductor device having tin-based solder layer and method for manufacturing the same

Bonding pad structure

Wafer level chip scale package having a gap and method for manufacturing the same

Thin integrated circuit device packages for improved radio frequency performance

Semiconductor package

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Multi-chips module package and manufacturing method thereof

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor device

Method of manufacturing semiconductor device including bonding pad and fuse elements

Semiconductor device including fuse elements and bonding pad

Wafer level package having floated metal line and method thereof

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Method of manufacturing semiconductor device

Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

Methods for fabricating stiffeners for flexible substrates

Tooling for coupling multiple electronic chips

Method for making flip chip on leadframe package

Semiconductor apparatus manufacturing method

Methods for fabricating fences on interposer substrates

Hybrid mounted device and method of manufacturing the same

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Apparatus for solder crack deflection

Semiconductor device and method for fabricating the same

Composite integrated device and methods for forming thereof

Semiconductor interconnect having adjacent reservoir for bonding and method for formation

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Semiconductor device, interposer chip and manufacturing method of semiconductor device

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor memory card

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

CHIP CARD MODULE

Padless die support integrated circuit package system

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Semiconductor device, method of manufacturing the same, and camera module

Method for manufacturing an electronic module in an installation base

Circuit board and package structure thereof

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Multi-chip stack package and fabricating method thereof

Electronic component and method for its assembly

Method of forming a microelectronic package and microelectronic package formed according to the method

Glass material for radio-frequency applications

Dicing/die bonding film and method of manufacturing the same

Interconnection pattern design

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP

Semiconductor package and fabricating method thereof

Integrated circuit having second substrate to facilitate core power and ground distribution

Substrate and semiconductor device

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

Semiconductor device having alignment post electrode and method of manufacturing the same

WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME

Carbon nanotube circuit component structure

Thermally enhanced semiconductor package and method of producing the same

Semiconductor package

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package structure and fabrication method thereof

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadless lead-frame

Semiconductor package structure and fabrication method thereof

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Semiconductor device and fabrication method thereof

Semiconductor chip with bond area

Strip for integrated circuit packages having a maximized usable area

Stacked module and manufacturing method thereof

Back-to-front via process

METHOD OF FORMING PAD OF SEMICONDUCTOR DEVICE

Semiconductor device package and method for manufacturing same

Manufacturing method for electronic device

Method for fabricating a flip chip system in package

Method for fabricating semiconductor device and apparatus for fabricating the same

Packaged semiconductor device with dual exposed surfaces and method of manufacturing

Printed circuit board and method of manufacturing semiconductor package using the same

Method for fabricating semiconductor package with build-up layers formed on chip

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Semiconductor device having a plurality of semiconductor constructs

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Method for manufacturing mold type semiconductor device

Thermally balanced via

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Semiconductor device

Pad layout

Electrical connections made with dissimilar metals

Electronic device and method of manufacturing the same

Circuit module

Connecting module having passive components

Semiconductor device and a method of manufacturing the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Contact spring application to semiconductor devices

Integrated circuit package-in-package system

Multi-chip package system

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Solid image-pickup device with flexible circuit substrate

Semiconductor device

Semiconductor light-emitting device and method for manufacturing the device

Semiconductor light-emitting device and method for manufacturing the device