SEMICONDUCTOR DEVICE

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Microchannel heat sink manufactured from graphite materials

Method for gluing a circuit component to a circuit substrate

Electronic component mounting method

Interconnect circuitry, multichip module, and methods of manufacturing thereof

Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

Manufacturing method for semiconductor device and semiconductor device

System and method for solder bumping using a disposable mask and a barrier layer

PACKAGE WARPAGE CONTROL

Clipless and wireless semiconductor die package and method for making the same

Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Wafer-level processing of chip-packaging compositions including bis-maleimides

Face down type semiconductor device and manufacturing process of face down type semiconductor device

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Package structure and manufacturing method thereof

Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same

Methods including fluxless chip attach processes

Super high-density module with integrated wafer level packages

Forced heat transfer apparatus for heating stacked dice

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Low stress stacked die packages

Dual die package with high-speed interconnect

Electrical ground method for ball stack package

Light emitting diode

Multichip leadframe package

Test pads on flash memory cards

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Package method for flash memory card and structure thereof

Electronic part mounting method

System, apparatus, and method for advanced solder bumping

Electronic micromodule and method for manufacturing the same

System and method for flip chip substrate pad

Object and bonding method thereof

Nanostructure-based package interconnect

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Compliant terminal mountings with vented spaces and methods

Electrical connection methods employing corresponding, insulator-coated members of interconnection elements

Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

Low temperature bumping process

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

Chip packaging structure without leadframe

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Structure with semiconductor chips embeded therein

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device and method for producing the same

Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency

Semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Super high-density module with integrated wafer level packages

Techniques for packaging multiple device components

Semiconductor structure with a plastic housing and separable carrier plate

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Microelectronic elements with compliant terminal mountings and methods for making the same

Stack-type semiconductor package and manufacturing method thereof

Plating bar design for high speed package design

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Electronic package with integral electromagnetic radiation shield and methods related thereto

Compliant terminal mountings with vented spaces and methods

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Three-dimensional integrated circuit structure

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Method for mounting chip component and circuit board

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

Method for fabricating a probing pad of an integrated circuit chip

Methods of fabricating interconnects for semiconductor components

Wafer structure and bumping process

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Method for manufacturing IC-embedded substrate

Wire bonding system and method of use

Stackable molded packages and methods of making the same

Method of manufacturing semiconductor device

Three dimensional microstructures and methods for making three dimensional microstructures

Method of producing a semiconductor device, and wafer-processing tape

Pressure-contact type rectifier with contact friction reducer

Chip on a board

Wafer-level flipchip package with IC circuit isolation

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Semiconductor device

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Semiconductor device having metal interconnection structure and method for forming the same

PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Structure of circuit board and method for fabricating same

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device with thermoplastic resin to reduce warpage

Low temperature phase change thermal interface material dam

Semiconductor device and manufacturing method of the same

Device package

Semiconductor package structure and method of manufacture

Semiconductor die structure featuring a triple pad organization

Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions

ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE

HEAT FIXTURE FOR WIRE BONDING

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

External electrode forming method

Multi-strand substrate for ball-grid array assemblies and method

Adhesive for bonding circuit members, circuit board and process for its production

Dicing die-bonding film, method of fixing chipped work and semiconductor device

DIE BONDING APPARATUS AND METHOD OF OPERATING THE SAME

Paste coater and PoP automatic mounting apparatus employing the same

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Telemetry system for use with microstimulator

Wireless communication system

Combination quad flat no-lead and thin small outline package

Inhibiting underfill flow using nanoparticles

Package using array capacitor core

Integrated circuit having bond pad with improved thermal and mechanical properties

Method for embedding dies

Chip module and method for producing a chip module

Die-attaching paste composition and method for hardening the same

Electronic member fabricating method and ic chip with adhesive material

Printed circuit board having embedded electronic components and manufacturing method thereof

Semiconductor device and mold for resin-molding semiconductor device

Electrical microfilament to circuit interface

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Integrated circuit chip with external pads and process for fabricating such a chip

Thermal enhanced upper and dual heat sink exposed molded leadless package

Microelectronic devices having a curved surface and methods for manufacturing the same

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Flip chip MLP with conductive ink

High temperature package flip-chip bonding to ceramic

Structure and method for thin single or multichip semiconductor QFN packages

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

Substrate panel with plating bar structured to allow minimum kerf width

Radio frequency device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Apparatus and clocked method for pressure-sintered bonding

Method for manufacturing an electronic module, and an electronic module

Method and apparatus for mounting conductive ball

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Wafer street buffer layer

Method and system for increasing yield of vertically integrated devices

Method for bonding substrates and device for bonding substrates

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Method of making exposed pad ball grid array package

Electronic circuit device and method of manufacturing the same

Liquid metal thermal interface material system

Die bonding adhesive tape

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor element, production process thereof, semiconductor laser and production process thereof

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Chip package structure

Leadless semiconductor package and method of manufacture

Semiconductor components having through wire interconnects (TWI)

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing same, and semiconductor wafer

Light emitting device

CAPILLARY FOR A BONDING TOOL

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Programmed material consolidation methods employing machine vision

Interconnect assemblies and methods

Conductive ball arraying apparatus

Semiconductor device structures that include sacrificial, readily removable materials

Semiconductor device having high frequency components and manufacturing method thereof

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Semiconductor device manufacturing method

Circuit under pad structure and bonding pad process

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

System and method for separating and packaging integrated circuits

Method of making semiconductor package having exposed heat spreader

Bonding structure with buffer layer and method of forming the same

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Protection for an integrated circuit chip containing confidential data

Dicing and die bonding adhesive tape

Flip chip hermetic seal using pre-formed material

Flip chip package and manufacturing method of the same

Intermediate connection for flip chip in packages

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Pin-type chip tooling

Circuit substrate and method of manufacture

Semiconductor integrated circuit

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Wiring board, electronic component mounting structure, and electronic component mounting method

Multilayer circuit board and method for manufacturing the same

Head assembly for chip mounter

Inductive Heating of Microelectronic Components

Power semiconductor module with capacitors connected parallel to one another

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Semiconductor device having align mark layer and method of fabricating the same

Methods for fabricating protective layers on semiconductor device components

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Semiconductor Device with Improved Stud Bump

Flip-chip semiconductor device manufacturing method

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Low Profile Stacking System and Method

Method of manufacturing optical module

Liquid epoxy resin composition

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Apparatuses and methods for forming wireless RF labels

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Semiconductor package structure and method of manufacture

Hybrid solder pad

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Power semiconductor circuit with busbar system

Packaged device and method of forming same

Alloys for flip chip interconnects and bumps

Interconnecting element between semiconductor chip and circuit support and method

Semiconductor package form within an encapsulation

Rotary chip attach

Stackable semiconductor package and method for its fabrication

Low Profile Stacking System and Method

Carrier board structure with semiconductor chip embedded therein

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Integrated circuit package system with bump pad

SEMICONDUCTOR DEVICE

Flip-chip light emitting diode device without sub-mount

Optical module and method of manufacturing the same

Semiconductor die package using leadframe and clip and method of manufacturing

Method and device to elongate a solder joint

Circuit board and its manufacturing method

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method and device for connecting chips

Method for producing and cleaning surface-mountable bases with external contacts

Damascene patterning of barrier layer metal for C4 solder bumps

PROCESSING METHOD FOR SEMICONDUCTOR STRUCTURE

Method and apparatus for attaching solder balls to substrate

Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same

Dispensing device and mounting system

Micro-electronic package structure and method for fabricating the same

Integrated circuit package system with heat sink

Method of forming a leaded molded array package

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Manufacturing method of wiring board and manufacturing method of semiconductor device

Method of manufacturing a semiconductor device

Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls

SOLDER BALL EXCELLENT IN MICRO-ADHESION PREVENTING PROPERTIES AND WETTING PROPERTIES AND METHOD FOR PREVENTING THE MICRO-ADHESION OF SOLDER BALLS

INTEGRATED CIRCUIT PACKAGE SYSTEM

Reversible leadless package and methods of making and using same

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Power converter

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Wafer level chip scale packaging structure and method of fabricating the same

Semiconductor device and method for manufacturing the same

FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD

Package and package module of the package

Integrated circuit package system with downset lead

Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips

Bonding pad with high bonding strength to solder ball and bump

Chip structure and manufacturing method of the same

EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF

Semiconductor device

Semiconductor device

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Integrated circuit package system using heat slug

Method for fabricating semiconductor package

Semiconductor package including a semiconductor die having redistributed pads

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same