Device mounting substrate and image display device

Wafer-level package having test terminal

Integrated circuit card and a method for manufacturing the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

System and method for increasing yield from semiconductor wafer electroplating

Low profile small outline leadless semiconductor device package

Methods of refining lead-containing materials

Underfill method

Method for separating electronic component from organic board

LOCAL MULTILAYERED METALLIZATION

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Junction-isolated vias

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Process for manufacturing sawing type leadless semiconductor packages

Semiconductor device and a manufacturing method of the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Laser processing method and laser beam processing machine

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Planar microspring integrated circuit chip interconnection to next level

Semiconductor device

Arrangement of an electrical component placed on a substrate, and method for producing the same

Semiconductor device having a plastic housing and external connections and method for producing the same

Magnetic self-assembly for integrated circuit packages

Stack semiconductor package formed by multiple molding and method of manufacturing the same

Stacked integrated circuits package system with dense routability and high thermal conductivity

Chip-packaging with bonding options having a plurality of package substrates

Die structure of package and method of manufacturing the same

MOSFET package

Semiconductor package with passive device integration

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

CHIP STRUCTURE AND WAFER STRUCTURE

Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

Semiconductor device and method for producing same

Semiconductor device, magnetic sensor, and magnetic sensor unit

Semiconductor light emitting device

Low stress conductive adhesive

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

Methods of fabricating integrated circuit devices having self-aligned contact structures

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Methods for assembling semiconductor devices and interposers

Method of manufacturing semiconductor device

Radio frequency module and fabrication method thereof

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Semiconductor device with a protected active die region and method therefor

Integrated circuit with staggered differential wire bond pairs

Manufacturing method for electronic device

Semiconductor flip chip package having substantially non-collapsible spacer

Chip scale package having flip chip interconnect on die paddle

Semiconductor chip package and method of manufacture

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Encapsulation method for semiconductor device having center pad

Semiconductor package having double layer leadframe

Semiconductor device, electrode member and electrode member fabrication method

Embedded chip printed circuit board and method of manufacturing the same

Anodic bonding process for ceramics

Semiconductor device package, method of manufacturing the same, and semiconductor device

Electrical contact

Ta-TaN selective removal process for integrated device fabrication

Encapsulation of circuit components to reduce thermal cycling stress

Microfeature devices and methods for manufacturing microfeature devices

Dual metal stud bumping for flip chip applications

Method of manufacturing semiconductor device and semiconductor device

Method for integrating an electronic component or similar into a substrate

Method of manufacturing an electronic device

Semiconductor component and method of manufacture

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Wirebond crack sensor for low-k die

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

High frequency semiconductor device

Method of manufacturing an ink-jet assembly

Input and output circuit of an integrated circuit chip

Bonding apparatus

Resin sealing method for electronic part and mold used for the method

Semiconductor device with chip-on-board structure

Semiconductor device with a number of bonding leads and method for producing the same

Semiconductor device

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

Semiconductor chip capable of implementing wire bonding over active circuits

Copper bonding wire for semiconductor packaging

Semiconductor device and manufacturing method thereof

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Method to create flexible connections for integrated circuits

Trace design to minimize electromigration damage to solder bumps

Substrate assembly with direct electrical connection as a semiconductor package

Chip scale package with heat spreader

High frequency arrangement

Package structure with chip embedded in substrate

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device and unit equipped with the same

Semiconductor device with semiconductor chip mounted in package

Dual row leadframe and fabrication method

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device and manufacturing process therefor

Semiconductor device

Ball mounting method

Accurate relative alignment and epoxy-free attachment of optical elements

Apparatus and method for bonding wires

Wire bonding method

Semiconductor device with micro connecting elements and method for producing the same

Semiconductor component sealed on five sides by polymer sealing layer

Semiconductor package and method for manufacturing the same

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Tools and methods for forming conductive bumps on microelectronic elements

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Method of forming a wear-resistant dielectric layer

Bond pad structure for integrated circuit chip

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Component arrangement for series terminal for high-voltage applications

Semiconductor package with plated connection

Substrate for an FBGA semiconductor component

Semiconductor chip having solder bumps and dummy bumps

Contact structure and method for manufacturing the same

Fine pitch low cost flip chip substrate

Semiconductor device and method of manufacturing the same

Ground arch for wirebond ball grid arrays

Stacked die package system

Three-dimensional circuit module and method of manufacturing the same

Chip package and producing method thereof

Semiconductor device and process for fabrication thereof

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

Thin-film semiconductor component and production method for said component

Method and system for transferring dies between surfaces

Stable electroless fine pitch interconnect plating

Multilayer printed wiring board and method of manufacturing the same

Implantable, tissue conforming drug delivery device

Methods of adhering microfeature workpieces, including a chip, to a support member

Method for interconnecting semiconductor components with substrates and contact means

Method for fabricating semiconductor packages with semiconductor chips

Manufacturing method of semiconductor device

Package or pre-applied foamable underfill for lead-free process

Semiconductor device and process for producing the same

Semiconductor module for making electrical contact with a connection device via a rewiring device

Semiconductor apparatus

Semiconductor device and method of making the same

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Semiconductor device

High performance IC package and method

Structure and method for bonding an IC chip

Integrated circuits and interconnect structure for integrated circuits

Dissociated fabrication of packages and chips of integrated circuits

Semiconductor device and method of manufacturing the same

Interposers with flexible solder pad elements

Semiconductor device

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Semiconductor device and fabrication method thereof

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Capillary holder

Antenna designs for radio frequency identification tags

Compliant electrical contacts

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Fabrication of stacked microelectronic devices

Method and system for 3D alignment in wafer scale integration

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Chip-stacked semiconductor package and method for fabricating the same

Device packages having stable wirebonds

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Novel method for copper wafer wire bonding

Semiconductor device and method of manufacturing thereof

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Bump structure of semiconductor device and method of manufacturing the same

Routing design to minimize electromigration damage to solder bumps

Chip scale package and method for manufacturing the same

Device package

Electronic device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Integrated circuit device having encapsulant dam with chamfered edge

Circuit board and semiconductor device

Semiconductor device

Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus

Apparatus and method for filling a ball grid array template

Transducer assembly, capillary and wire bonding method using the same

Molding tool and a method of forming an electronic device package

Electronic device manufacture

Semiconductor manufacturing method for die bonding

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Thermal enhanced package for block mold assembly

High-density inter-die interconnect structure

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Electronic assembly having a substrate laminated within a backplate cavity

Semiconductor package and semiconductor module

Semiconductor device and method of fabricating the same

Rotating rectifier assembly with inner mounted diodes

IC chip package structure and underfill process

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Spaced, bumped component structure

Display apparatus

Semiconductor chip electrical connection structure

Semiconductor device and method of manufacturing a semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Semiconductor package with crossing conductor assembly and method of manufacture

Package structure and fabrication method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Bilayer aluminum last metal for interconnects and wirebond pads

Chip on board leadframe for semiconductor components having area array

Semiconductor device and method of manufacturing the same

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Packaging designs for LEDs

Method and apparatus for forming a low profile wire loop

Ribbon bonding tool and process

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

System-in-package wireless communication device comprising prepackaged power amplifier

Method of making a compliant interconnect assembly

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Substrate bump formation

Semiconductor device and manufacturing method thereof

Methods relating to forming interconnects

Fabrication of stacked microelectronic devices

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Interconnection structure through passive component

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Electronic component, electro-optical device, and electronic apparatus

Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Electronic device package and method of manufacturing the same

Semiconductor device and method for producing the same

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Fabrication method for chip size package and non-chip size package semiconductor devices

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Semiconductor integrated circuit and method of manufacturing the same

Apparatus of clamping semiconductor devices using sliding finger supports

Printed-circuit board and circuit unit incorporating the circuit board

Contact maker for power semiconductor modules and disc cells

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Wafer-processing tape and method of producing the same

Semiconductor apparatus and manufacturing method

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Multi-function card device

Wire loop, semiconductor device having same and wire bonding method

Wire clamping plate

Semiconductor device and manufacturing method therefor

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Integrated die bumping process

Method for cutting semiconductor substrate

Assembly comprising functional devices and method of making same

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Silicon direct bonding method

Method of manufacturing a cavity package

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor package and fabrication method of the same

Semiconductor device package and manufacturing method thereof

Electronic parts packaging structure

Flip chip package structure

Diode

Semiconductor interconnect having dome shaped conductive spring contacts