BGA package substrate and method of fabricating same

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Semiconductor package having passive component disposed between semiconductor device and substrate

Method for manufacturing semiconductor device having a pair of heat sinks

Semiconductor devices having post passivation interconnections and a buffer layer

Printed circuit board including embedded chips and method of fabricating the same using plating

Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same

NANO IC packaging

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Flexible substrate for package

Tape for tape carrier package

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Semiconductor device

System and method for mounting electrical devices

Organic semiconductor device and its manufacturing method

Wire bonds having pressure-absorbing balls

Coupler resource module

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Method of forming pad and fuse in semiconductor device

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same

Method and system for 3D alignment in wafer scale integration

Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate

Method of manufacturing a semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Bare die socket

Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby

Plating apparatus and plating method

Packaging for electronic modules

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Method for fabricating thermally enhanced semiconductor package

Semiconductor device and method for manufacturing the same

Semiconductor device and fabrication method thereof

Method of forming a bonding pad structure

Semiconductor device and fabrication method thereof

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

Microelectronic package having stacked semiconductor devices and a process for its fabrication

Power semiconductor device

Semiconductor device

Methods of vertically stacking wafers using porous silicon

Semiconductor device package

Stacked-type semiconductor device

Method for wafer stacking using copper structures of substantially uniform height

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device and method of fabricating the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

Method for attaching chips in a flip-chip arrangement

Semiconductor device and manufacturing method of the same

Semiconductor device and radio communication device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Semiconductor device and manufacturing method therefor

Electronic device including a substrate structure and a process for forming the same

Connection ball positioning method and device for integrated circuits

Method for constructing contact formations

Hot-Melt Underfill Composition and Methos of Application

Wafer structure, chip structure, and fabricating process thereof

Manufacturing method of semiconductor device

Method and system for performing die attach using a flame

Methods of forming semiconductor packages

Thermally controlled fluidic self-assembly

Module

Resin casting mold and method of casting resin

Power semiconductor package

Bonding pad structure

Ball limiting metallurgy split into segments

Circuit device with circuit board and semiconductor chip mounted thereon

Semiconductor device and manufacturing method therefor

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Arrangement of input/output pads on an integrated circuit

System for implementing a configurable integrated circuit

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Methods of making and using a floating lead finger on a lead frame

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Use of a down-bond as a controlled inductor in integrated circuit applications

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

RFID tag and method of manufacturing the same

RFID tag and method of manufacturing the same

Method of manufacturing a semiconductor device

Method of manufacturing wiring substrate to which semiconductor chip is mounted

PCB, manufacturing method thereof and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Methods for fabricating thin complaint spring contacts

Microelectronic devices having underfill materials with improved fluxing agents

Solder bump composition for flip chip

Method for re-routing lithography-free microelectronic devices

Package structure with embedded chip and method for fabricating the same

Semiconductor device package

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Electrical or electronic component and method of producing same

Fabrication of stacked die and structures formed thereby

Compact system module with built-in thermoelectric cooling

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD

Electronic component with a housing package

Housing for power semiconductor modules

Cornerbond assembly comprising three-dimensional electronic modules

Protection of an integrated capacitor

Display, method of manufacturing display and apparatus for manufacturing display

B-stageable underfill encapsulant and method for its application

Semiconductor device having a bonding pad structure including an annular contact

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Multi-chip module

Method of making wafer level ball grid array

Flip chip package with anti-floating structure

Apparatus and method for manufacturing semiconductor device

Flip chip device

Method for solder bumping, and solder-bumping structures produced thereby

Test system for semiconductor components having conductive spring contacts

Method for fabricating semiconductor components with conductive spring contacts

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Metallization structure over passivation layer for IC chip

Multi-chip module having bonding wires and method of fabricating the same

Heat dissipating semiconductor package and fabrication method thereof

Semiconductor package structure and method for fabricating the same

High density package interconnect wire bond strip line and method therefor

Semiconductor device

Circuit boards, electronic devices, and methods of manufacturing thereof

Flash preventing substrate and method for fabricating the same

Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Electrical-interference-isolated transistor structure

Semiconductor package having improved adhesion and solderability

Electronic component and a panel

Forming of high aspect ratio conductive structure using injection molded solder

Method of packaging flip chip and method of forming pre-solders on substrate thereof

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Electronic parts packaging structure and method of manufacturing the same

Method of manufacturing a device-incorporated substrate

Wireless communication system

Manufacturing method of chip integrated substrate

Bonding structure and fabrication thereof

Three-dimensional device fabrication method

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device

Methods for fabricating stiffeners for flexible substrates

Methods and apparatus for addition of electrical conductors to previously fabricated device

Wafer-level underfill process making use of sacrificial contact pad protective material

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Printed circuit board having a bond wire shield structure for a signal transmission line

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Fabricating stacked chips using fluidic templated-assembly

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor device and fabrication method for the same

Semiconductor device and the method of producing the same

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Method for fabricating semiconductor package having conductive bumps on chip

Semiconductor package and fabrication method thereof

Semiconductor device and method of fabricating the same

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Liquid metal thermal interface material system

Semiconductor package and manufacturing method thereof

MSD raised metal interface features

Press pack power semiconductor module

Power semiconductor device

Solder interconnect structure and method using injection molded solder

Method for mounting a semiconductor chip onto a substrate

Epoxy-solder thermally conductive structure for an integrated circuit

Roller wire brake for wire bonding machine

Method of making a circuitized substrate

Method for fabricating semiconductor components with conductive vias

Semiconductor package substrate with embedded chip and fabrication method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Attachment of flip chips to substrates

Bond pad for ball grid array package

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Microelectronic packages with solder interconnections

Substrate package structure and packaging method thereof

Bond pad structure for gold wire bonding to copper low K dielectric silicon devices

Wire bond interconnection

Semiconductor device

Semiconductor chip and tab package having the same

Microelectronic assemblies incorporating inductors

Simplified multichip packaging and package design

Method and apparatus for polymer dielectric surface recovery by ion implantation

Method and device for mounting electric component

Ultrasonic head

Resonator, ultrasonic head, and ultrasonic bonder using the same

Plating apparatus

Method of forming external electrode

Package for a semiconductor device

Forming an intermediate layer in interconnect joints and structures formed thereby

Method for removing resin mask layer and method for manufacturing solder bumped substrate

Wafer alignment method

High surface area aluminum bond pad for through-wafer connections to an electronic package

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Structure of embedded active components and manufacturing method thereof

Film adhesive and semiconductor package using the same

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Transponder incorporated into an electronic device

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Semiconductor device, method and apparatus for fabricating the same

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Solder for fabricating solder bumps and pumping process

Integrated circuit package and assembly thereof

Power module, and phase leg assembly

Probe arrays and method for making

Multi-chip package and method of fabricating the same

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Semiconductor device and method of fabricating the same

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same

Method for forming solder bumps of increased height

Manipulation of micrometer-sized electronic objects with liquid droplets

Method of fabricating a high Q factor integrated circuit inductor

Process for fabricating chip embedded package structure

Overmolded lens over LED die

Micro-machined structure production using encapsulation

Method for mounting an electronic element on a wiring board

Power amplifier module

Methods and systems for rise-time improvements in differential signal outputs

Die attach material for TBGA or flexible circuitry

Semiconductor chip capable of implementing wire bonding over active circuits

Module substrate and disk apparatus

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF

Socket grid array

Heat dissipating packages structure and method for fabricating the same

Heater for annealing trapped charge in a semiconductor device

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Flip-chip component

Multi-chip semiconductor package

Multi-chip package

Bump formation method and bump forming apparatus for semiconductor wafer

Semiconductor system with fine pitch lead fingers

Liquid metal droplet generator

Adhesion apparatus

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Active area bonding compatible high current structures

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Injection molded metal bonding tray for integrated circuit device fabrication

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Wire positioning and mechanical attachment for a radio-frequency indentification device

Semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device with crack-resistant multilayer copper wiring

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Staggered wirebonding configuration

Semiconductor wafer with electrically connected contact and test areas

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Chip package with grease heat sink

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Multi chip package

Electronic device package and electronic equipment

IC chip package with isolated vias

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Microcomputer chip with function capable of supporting emulation

Structured semiconductor element for reducing charging effects

Interconnect including a pliable surface and use thereof

Neo-wafer device comprised of multiple singulated integrated circuit die