Technique for defining a wettable solder joint area for an electronic assembly substrate

Wire loop, semiconductor device having same and wire bonding method

Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Fabrication method of under bump metallurgy structure

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Transparent member, optical device using transparent member and method of manufacturing optical device

Surface protection film and method for producing the same

Growth of carbon nanotubes to join surfaces

Au alloy bonding wire

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Metrology system and method for stacked wafer alignment

Stencil and method for depositing material onto a substrate

Bumpless semiconductor device

Device with area array pads for test probing

Semiconductor device with passivation layer covering wiring layer

Contact structure on chip and package thereof

Method of making the semiconductor device, circuit board, and electronic instrument

Semiconductor device and fabrication method thereof

Method for fabricating structure of polymer-matrix conductive film

Semiconductor device with substrate having penetrating hole having a protrusion

Wirebonded device packages for semiconductor devices having elongated electrodes

Large die package and method for the fabrication thereof

Stacked type semiconductor device

Stack type surface acoustic wave package, and method for manufacturing the same

Bondwire utilized for coulomb counting and safety circuits

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

Semiconductor light-emitting device and method for manufacturing the device

Spot heat wirebonding

Method of manufacturing self-supporting contacting structures

Working method of metal material and semiconductor apparatus fabricated by the method

Conductive bump structure for semiconductor device and fabrication method thereof

Methods of forming wire bonds for semiconductor constructions

Multi-chip module and method of manufacture

Post bump passivation for soft error protection

Flip chip method

Multiple etch-stop layer deposition scheme and materials

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Package substrate with built-in capacitor and manufacturing method thereof

Bond pad structures and semiconductor devices using the same

Conductive ball mounting apparatus

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Semiconductor package board using a metal base

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Dicing die adhesive film for semiconductor

Method of manufacturing a semiconductor apparatus

Semiconductor device and method of manufacturing the same

Composite electronic component

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Multilayer printed wiring board

Microsystem component and method for gluing microcomponents to a substrate

Fabrication of compliant spring contact structures and use thereof

Method of making a circuitized substrate

Pressure contract spring for contact arrangement in power semiconductor module

Method of manufacturing multi-layered substrate

Gap control between interposer and substrate in electronic assemblies

Method of manufacturing a semiconductor device

Chip-scale package

Semiconductor device with terminals, and method of manufacturing the same

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of repairing an image display unit

Circuit device

Microelectronic contact structure and method of making same

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor device including an under electrode and a bump electrode

Semiconductor device and method for producing the same

Semiconductor package

Apparatus for conducting heat in a flip-chip assembly

Thermal interconnect systems methods of production and uses thereof

Microelectronic assemblies having compliant layers

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Thermal enhanced low profile package structure

Device packages having a III-nitride based power semiconductor device

Semiconductor substrate

Semiconductor device having surface mountable external contact areas and method for producing the same

Method for forming a metal layer in multiple steps

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Die attach adhesives with improved stress performance

Bumping process and bump structure

Increased stand-off height integrated circuit assemblies, systems, and methods

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Thin passivation layer on 3D devices

Underfill dispense at substrate aperture

System for providing a redistribution metal layer in an integrated circuit

Method of forming a substrateless semiconductor package

Semiconductor device with self-aligning contactless interface

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Inlet for an electronic tag

Semiconductor device and manufacturing method thereof

Bonding pad for a packaged integrated circuit

Fan out type wafer level package structure and method of the same

Electronic devices including offset conductive bumps

Semiconductor package accomplishing fan-out structure through wire bonding

Integrated circuit system for bonding

Thermally enhanced semiconductor package and fabrication method thereof

Semiconductor device

High density direct connect LOC assembly

Thin multiple semiconductor die package

Semiconductor device

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Process for precise arrangement of micro-bodies

Ultrasonic tool and ultrasonic bonder

Conductive ball mounting apparatus

Intermetallic Spring Structure

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Integrated heat spreader and method for using

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Semiconductor device and fabrication method thereof

Method of fabricating a substrate with a concave surface

Multilayer circuit board and method of manufacturing the same

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Method of fabricating semiconductor chip assemblies

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Fabricating process of an electrically conductive structure on a circuit board

Semiconductor wafer coat layers and methods therefor

Integrated circuit edge protection method and apparatus

Leadless semiconductor package and manufacturing method thereof

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Semiconductor device and an image sensing device

Alignment fences and devices and assemblies including the same

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Semiconductor device having stress relaxation sections

Chip package with dam bar restricting flow of underfill

Method for mounting semiconductor chips on a substrate and corresponding assembly

Semiconductor device

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Electronic component mounting package and package assembled substrate

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Semiconductor device and method of manufacturing thereof

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Chip embedded package structure and fabrication method thereof

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Vertically integrated system-in-a-package

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Package structure having mixed circuit and composite substrate

Semiconductor device with extraction electrode

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Bonding wire cleaning unit and method of wire bonding using same

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Method for manufacturing an electronic module

Liquid epoxy resin composition and semiconductor device

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Method of room temperature covalent bonding

Method of manufacturing a semiconductor device

Universal interconnect die

Stacked die-in-die BGA package with die having a recess

Method of manufacturing semiconductor device

Flip chip interconnection having narrow interconnection sites on the substrate

Vertically stacked semiconductor device

Schottky diode device with aluminum pickup of backside cathode

Circuit board and the manufacturing method

Methods for the electronic, homogeneous assembly and fabrication of devices

Integrated circuit for communications modules

Semiconductor structure with RF element

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Die attach methods and apparatus

Aluminum cap with electroless nickel/immersion gold

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device having a functional surface

Wafer level chip scale package having a gap and method for manufacturing the same

C4 joint reliability

Semiconductor device

Semiconductor device with interlocking clip

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Shield and semiconductor die assembly

Semiconductor device

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

System for tracking elements using tags

Method for producing a wire connection

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Signal transmission arrangement and method

Method of forming an interconnection element

ELECTRICAL CONTACT

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Method for Manufacturing Gold Bumps

Flip-chip adaptor package for bare die

System and method to increase die stand-off height

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Method of producing a package for semiconductor chips

Method of making a flexible substrate containing self-assembling microstructures

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Microelectronic component assemblies with recessed wire bonds and methods of making same

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Integrated device and electronic system

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Stacked semiconductor package

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

RFID tag, module component, and RFID tag fabrication method

Forming solder balls on substrates

Method, device and system for bonding a semiconductor element

Method to accommodate increase in volume expansion during solder reflow

Bonding pads having slotted metal pad and meshed via pattern

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Wiring board manufacturing method

Semiconductor device and a method for manufacturing the same

Temperature dependent semiconductor module connectors

Forming a barrier layer in interconnect joints and structures formed thereby

Low capacitance solder bump interface structure

Method for producing a semiconductor device and resulting device

Front-end processing of nickel plated bond pads

Semiconductor package fabrication

Wafer-processing tape

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Configuration for testing the bonding positions of conductive drops and test method for using the same

Semiconductor device and method of manufacturing the same

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Semiconductor device with via hole for electric connection

Copper interconnection with conductive polymer layer and method of forming the same

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Semiconductor device, semiconductor body and method of manufacturing thereof

Semiconductor package and method for manufacturing the same

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Semiconductor device