Semiconductor Package for Higher Power Transistors

Semiconductor module including a switch and non-central diode

Packaging structure

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

POLYMER CORE WIRE

Embedded printed circuit board and method of manufacturing the same

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Methods and apparatus for measuring analytes using large scale FET arrays

Chip packaging method and structure thereof

Fixture to constrain laminate and method of assembly

Stacked die assemblies including TSV die

Method of making a light emitting device having a molded encapsulant

Apparatus and method for mounting semiconductor light-emitting element

Integrated circuit with intra-chip clock interface and methods for use therewith

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Flexible distributed LED-based light source and method for making the same

Metal can impedance control structure

Device and method for manufacturing a device

Stacked multi-die packages with impedance control

Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE

Stacked chip assembly having vertical vias

Chip assembly having via interconnects joined by plating

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

Method for depackaging prepackaged integrated circuit die and a product from the method

Ball grid array semiconductor package and method of manufacturing the same

Impedance controlled packages with metal sheet or 2-layer RDL

Semiconductor device and method of forming composite bump-on-lead interconnection

Method for fabricating a neo-layer using stud bumped bare die

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Wire bond through-via structure and method

Microsprings partially embedded in a laminate structure and methods for producing same

Multi-function and shielded 3D interconnects

Anti-tamper microchip package based on thermal nanofluids or fluids

Semiconductor device package and method of making a semiconductor device package

Semiconductor device with parasitic bipolar transistor

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Electronic device comprising a chip disposed on a pin

Resin composition and semiconductor device produced by using the same

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Interposer with microspring contacts

Printed wiring board

Soldering entities to a monolithic metallic sheet

Method of making a high frequency device package

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Method for reducing UBM undercut in metal bump structures

Copper bonding compatible bond pad structure and method

Apparatus for restricting moisture ingress

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Apparatus and methods for high-density chip connectivity

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Semiconductor chip device with polymeric filler trench

Simulated wirebond semiconductor package

Semiconductor device and method of manufacturing the same

Chip assembly with a coreless substrate employing a patterned adhesive layer

Semiconductor device and manufacturing method thereof

Compliant printed circuit area array semiconductor device package

Semiconductor package and method for manufacturing the same

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Die structure, die arrangement and method of processing a die

SEMICONDUCTOR CHIP, STACKED CHIP SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND FABRICATING METHOD THEREOF

Embedded ball grid array substrate and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor device

Semiconductor device

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device having pad structure with stress buffer layer

Semiconductor chip with redundant thru-silicon-vias

Method for manufacturing electronic component, and electronic component

Semiconductor module and method for production thereof

Semiconductor device having a pin mounted heat sink

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Package structure for DC-DC converter

Power semiconductor chip package

Apparatus and method configured to lower thermal stresses

Semiconductor packages having increased input/output capacity and related methods

DICING DIE BOND FILM

Systems and methods for enabling ESD protection on 3-D stacked devices

Programmable anti-fuse wire bond pads

Liquid electrical interconnect and devices using same

Power semiconductor package

Control device of semiconductor device

Manufacturing method for semiconductor device carrier and semiconductor package using the same

Fabrication method of semiconductor integrated circuit device

Multi-chip package with offset die stacking

Layered chip package and method of manufacturing same

Compliant printed circuit wafer level semiconductor package

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Die edge contacts for semiconductor devices

Ramp-stack chip package with static bends

Semiconductor device and manufacturing method of semiconductor device

Embedded package and method for manufacturing the same

SEMICONDUCTOR DEVICE

Alignment marks in substrate having through-substrate via (TSV)

LED PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

MULTI-CHIP PACKAGES

Contacting means and method for contacting electrical components

Method of manufacturing semiconductor device and wire bonding apparatus

Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes

Self-filleting die attach paste

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING EXPOSING A DICING LINE ON A WAFER

Method for manufacturing semiconductor device

Leadless array plastic package with various IC packaging configurations

METHOD FOR MANUFACTURING CHIP PACKAGE

Process for assembling two parts of a circuit

Method of manufacturing semiconductor device

Method for manufacturing semiconductor devices

Method of manufacturing light-emitting device

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

Stretchable electronic device

Semiconductor apparatus, inspection method thereof and electric device

Bond pad for semiconductor die

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same

Bumpless build-up layer package with pre-stacked microelectronic devices

Semiconductor device and method for manufacturing the same

Semiconductor storage device and a method of manufacturing the semiconductor storage device

Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component

Method and system for routing electrical connections of semiconductor chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF

Structures embedded within core material and methods of manufacturing thereof

Package structure

Semiconductor device and method for manufacturing thereof

Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Low-cost 3D face-to-face out assembly

Package substrate having main dummy pattern located in path of stress

Stress reduction in chip packaging by using a low-temperature chip-package connection regime

Pillar bumps and process for making same

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

Semiconductor die terminal

Semiconductor device

Semiconductor package for forming a leadframe package

Singulation method for semiconductor package with plating on side of connectors

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, method for manufacturing same, and semiconductor apparatus

Cylindrical embedded capacitors

Semiconductor device

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Wiring board and method of manufacturing a semiconductor device

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

SQUEEGEE MODULE

Multilevel interconnection system

Method of manufacturing semiconductor package

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Flip chip bonder head for forming a uniform fillet

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor memory device and semiconductor memory card

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

Compliant printed circuit semiconductor package

IMPLEMENTING MULTIPLE DIFFERENT TYPES OF DIES FOR MEMORY STACKING

Semiconductor device production method and semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Mechanisms for forming copper pillar bumps using patterned anodes

Image sensor package with dual substrates and the method of the same

Electronic packaging apparatus and electronic packaging method

Manufacturing method of printed circuit board embedded chip

Process for making conductive post with footing profile

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION

Method for producing a semiconductor element

TRANSFERRING ANTENNA STRUCTURES TO RFID COMPONENTS

Component arrangement and method for production thereof

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD

Repairable semiconductor device and method

Method of manufacturing and assembling semiconductor chips with offset pads

Stacking method and stacking carrier

Stitch bump stacking design for overall package size reduction for multiple stack

VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

Thermal enhancement for multi-layer semiconductor stacks

Impedance controlled electrical interconnection employing meta-materials

Semi-conductor chip with compressible contact structure and electronic package utilizing same

Stacked Semiconductor Device And Method Of Fabricating The Same

Chip scale package with electronic component received in encapsulant, and fabrication method thereof

MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING

Semiconductor device and method of producing same

Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner

Capillary and ultrasonic transducer for ultrasonic bonding

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Through hole vias at saw streets including protrusions or recesses for interconnection

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

Process for chip capacitive coupling

Semiconductor package and method of attaching semiconductor dies to substrates

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS

Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board

Side wettable plating for semiconductor chip package

Systems and Methods for Heat Dissipation Using Thermal Conduits

Stacked assembly including plurality of stacked microelectronic elements

Three-dimensional integrated circuits with protection layers

Chip scale package and fabrication method thereof

Package substrate for bump on trace interconnection

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Electronic component and method for manufacturing the same

Semiconductor integrated circuit device

Semiconductor device

Semiconductor device having a conductive layer reliably formed under an electrode pad

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Flip chip package utilizing trace bump trace interconnection

Electrical contact alignment posts

Flexible micro-system and fabrication method thereof

Self-aligning structures and method for integrated chips

Package-on-package with fan-out WLCSP

Semiconductor device and semiconductor circuit substrate

Semiconductor device and method for producing such a device

Bottom source power MOSFET with substrateless and manufacturing method thereof

Compact semiconductor package with integrated bypass capacitor

Package and fabrication method of the same

DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SENSOR APPARATUS

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

Gas delivery system for reducing oxidation in wire bonding operations

Printed wiring board and a method of manufacturing a printed wiring board

ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD

In-plane silicon heat spreader and method therefor

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Method of manufacturing component embedded printed circuit board

ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Alpha particle blocking wire structure and method fabricating same

Method and system for bonding 3D semiconductor device

Semiconductor device and manufacturing method thereof

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Embedded wafer-level bonding approaches

Ultra-thin quad flat no-lead (QFN) package

Semiconductor device having a semiconductor chip, and method for the production thereof

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques

Circuit Device

LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME

Film for flip chip type semiconductor back surface

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor device with die stack arrangement including staggered die and efficient wire bonding

Three-dimensional integrated circuit structure having improved power and thermal management

Chip package and fabricating method thereof

Electronic device and method for production

Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure

Method of forming a memory device

Solder interconnect on IC chip

Semiconductor device and method of designing a wiring of a semiconductor device

Routable array metal integrated circuit package fabricated using partial etching process

Chip having a driving integrated circuit

Semiconductor device

SEMICONDUCTOR PACKAGE

Semiconductor device cover mark

Microelectronic packages with nanoparticle joining

Package structure

Reinforced Wafer-Level Molding to Reduce Warpage

Semiconductor device, lead frame assembly, and method for fabricating the same

Semiconductor encapsulation and method thereof

Semiconductor device packages having electromagnetic interference shielding and related methods

Semiconductor device comprising a passive component of capacitors and process for fabrication

Wafer level chip scale package

Semiconductor integrated circuit chip and layout method for the same

Power semiconductor device

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Optical connection through single assembly overhang flip chip optics die with micro structure alignment

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Method and apparatus for manufacturing three-dimensional integrated circuit

Method for forming terminal of stacked package element and method for forming stacked package

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

Forming low stress joints using thermal compress bonding

Micro-machined structure production using encapsulation

Device and manufacturing method of the same

SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY

Microelectronic elements with post-assembly planarization

RESIN SUPPLY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor device with conductive vias between saw streets

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Methods of forming semiconductor elements using micro-abrasive particle stream

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

Semiconductor device

Integrated circuit package with open substrate and method of manufacturing thereof

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Doping minor elements into metal bumps

Multi-die stacking using bumps with different sizes

Method and package for circuit chip packaging

Chip scale package and fabrication method thereof

Mold design and semiconductor package

Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device

BONDING STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGE

TAPE CARRIER SUBSTRATE