Soft error rate mitigation by interconnect structure

Thermosetting die-bonding film

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD

Mechanisms for resistivity measurement of bump structures

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Semiconductor chip and semiconductor device

Surface mount semiconductor device

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

Semiconductor device and method of manufacturing the same

Solder joint flip chip interconnection

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Semiconductor devices having electrodes

Clip interconnect with encapsulation material locking feature

TCP-type semiconductor device and method of testing thereof

Compensation network for RF transistor

WIRE FEEDING APPARATUS FOR WIRE BONDERS

Micro-fluidic injection molded solder (IMS)

Method and device for discharging a fixed amount of liquid

Methods for wafer bonding, and for nucleating bonding nanophases

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

Semiconductor packages and methods of manufacturing the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

4D Device, process and structure

IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM

Integrated circuit package strip with stiffener

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING ELONGATED FASTENERS

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Pressure application apparatus and pressure application method

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Memory device, laminated semiconductor substrate and method of manufacturing the same

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor device having conductive vias and semiconductor package having semiconductor device

Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Semiconductor device and manufacturing method thereof

Contact Array for Substrate Contacting

Integrated circuit manufacturing method and integrated circuit

Wafer level chip package and a method of fabricating thereof

Solder interconnect pads with current spreading layers

Semiconductor device including chip with complementary I/O cells

Semiconductor device and method of forming the same

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

Integrated circuit device having through via and method for preparing the same

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Electronic devices

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

Semiconductor package

BATCH FABRICATED 3D INTERCONNECT

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

LED PACKAGE

Wafer level packaged GaN power device and the manufacturing method thereof

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

PACKAGE CARRIER

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Connecting and bonding adjacent layers with nanostructures

Method of manufacturing a printed circuit board with an embedded electronic component

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method Of Manufacturing Semiconductor Package Board

Method for manufacturing magnetic memory chip device

SEMICONDUCTOR DEVICE

Package structure having a semiconductor component embedded therein and method of fabricating the same

Input/output core design and method of manufacture therefor

LEAD-FREE HIGH TEMPERATURE COMPOUND

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor structure and a method of manufacturing a semiconductor structure

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package with bonding wires of reduced loop inductance

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package having recessed sidewalls

Microelectronic package with terminals on dielectric mass

Electric part package and manufacturing method thereof

Semiconductor packages and methods of packaging semiconductor devices

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

Wafer level semiconductor package and manufacturing methods thereof

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Conductive pads defined by embedded traces

Grain refinement by precipitate formation in Pb-free alloys of tin

Ni plating of a BLM edge for Pb-free C4 undercut control

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Semiconductor device

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing semiconductor device

Wiring method and device

BONDING WIRE FOR SEMICONDUCTOR

Apparatus for manufacturing a hierarchical structure

Method for manufacturing a substrate for a semiconductor package

Packaging or mounting a component

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM

Semiconductor device manufacturing method and semiconductor device

Contact pad

Multi-chip stacking method to reduce voids between stacked chips

Laser assisted transfer welding process

Composite nanometal paste of two-metallic-component type, bonding method, and electronic part

BONDING SHEET

Sintering materials and attachment methods using same

In-package microelectronic apparatus, and methods of using same

Quad flat package with exposed paddle

Light emitting device with electrode having recessed concave portion

Semiconductor chip and semiconductor device including the same

Silicon structure having bonding pad

System for relieving stress and improving heat management in a 3D chip stack

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

Semiconductor structure and method for making same

Method for wafer bonding using gold and indium

Flexible electronic devices and related methods

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

Dual lead frame semiconductor package and method of manufacture

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Anisotropic conductive adhesive

Etching composition for an under-bump metallurgy layer

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Wire bonding apparatus and method using the same

Thermal compressive bonding with separate die-attach and reflow processes

Electronic element unit and reinforcing adhesive agent

Laser ashing of polyimide for semiconductor manufacturing

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Apparatus, system, and method for wireless connection in integrated circuit packages

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Manufacturing light emitting diode (LED) packages

Pattern layout in semiconductor device

Electronic component and electronic device

Multilayered printed circuit board and method for manufacturing the same

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF

Electronic device and electronic apparatus

Semiconductor module

Semiconductor packages

Power package module with low and high power chips and method for fabricating the same

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

Bonding wire for semiconductor device

Semiconductor device and method for manufacturing the same

DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Crack arrest vias for IC devices

Interconnect assemblies and methods of making and using same

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF

No flow underfill

Grounded seal ring structure in semiconductor devices

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Substrateless power device packages

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadframe package with recessed cavity for LED

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Joining method and device produced by this method and joining unit

Method of operating a clamping system of a wire bonding machine

Apparatus for mounting semiconductor chip

Chip Package

Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE

SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor package and method of manufacturing the same

Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

Semiconductor device and method of forming the same

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

Power/ground layout for chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer

Device with semiconductor die attached to a leadframe

Chip package and manufacturing method thereof

Bond pad for wafer and package for CMOS imager

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate

Light emitting device and method for manufacturing same

Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)

ANISOTROPIC CONDUCTIVE PARTICLES

System and method for packaging electronic devices

Method For Low Temperature Bonding And Bonded Structure

Method and system for bonding electrical devices using an electrically conductive adhesive

TAPE APPLYING APPARATUS

Apparatus for thermal control of semiconductor chip assembly and underfill

Process for realizing a connecting structure

Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics

METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES

Copper alloy bonding wire for semiconductor

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Chip-to-chip multi-signaling communication system with common conductive layer

Method of producing a chip package, and chip package

Integrated circuit device and structure

Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package

Semiconductor device and method of manufacturing the same

Microelectronic assemblies having compliancy and methods therefor

Package unit and stacking structure thereof

Semiconductor device for semiconductor package having through silicon vias of different heights

Semiconductor packages and methods of fabricating the same

Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same

Copper pillar bump with cobalt-containing sidewall protection

Conductive pillar structure

Semiconductor device

Leadframe package structure and manufacturing method thereof

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Semiconductor package

Bonding apparatus and bonding method

Bonding apparatus

Semiconductor device and the method of manufacturing the same

Method and system for forming conductive bumping with copper interconnection

Thermal compressive bond head

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Method of fabricating stacked chips in a semiconductor package

Semiconductor multi-project or multi-product wafer process

Semiconductor device comprising thin-film terminal with deformed portion

Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same

Manufacturing of a device including a semiconductor chip

Package systems having a eutectic bonding material and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufacturing methods thereof

Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor assembly and semiconductor package including a solder channel

Semiconductor device and semiconductor package having the same

Method for manufacturing semiconductor device, and semiconductor device

Semiconductor package and method of fabricating the same

PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME

Electronic component device, method of manufacturing the same and wiring substrate

MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

Semiconductor device including shielding layer and fabrication method thereof

Massively parallel interconnect fabric for complex semiconductor devices

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER

Wiring board and method for manufacturing the same

Flexible semiconductor package and method for fabricating the same

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Semiconductor die package including low stress configuration

Off-chip VIAS in stacked chips

Semiconductor device packages stacked together having a redistribution layer

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Metal wiring structures for uniform current density in C4 balls

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

Electronic Package and Method of Making an Electronic Package

Delamination resistant device package having raised bond surface and mold locking aperture

Semiconductor device having a pad and plurality of interconnects

Sheet-molded chip-scale package

Method for producing display device

LED package

Transferring an antenna to an RFID inlay substrate

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Method of Contacting a Semiconductor Substrate

Multilayered printed circuit board and method for manufacturing the same

Brace for wire bond

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Manufacturing method of semiconductor device

PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT

Embedded printed circuit board and method of manufacturing the same

MULTI-CHIP PACKAGE

Semiconductor device and manufacturing method thereof

Wafer-level packaging method using composite material as a base

Integrated circuit packaging system with warpage control and method of manufacture thereof

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element

Semiconductor structure and method for making same

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Semiconductor structure and method for making same

Semiconductor device and manufacturing method of the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Semiconductor power module and method of manufacturing the same

Semiconductor package including cap

Method and system for improving reliability of a semiconductor device

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Semiconductor device

Lead frame, semiconductor device, and method of manufacturing semiconductor device

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and a method of manufacturing the same

Semiconductor package with integrated metal pillars and manufacturing methods thereof

SEMICONDUCTOR PACKAGE WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device