Backside illuminated imaging sensor with reinforced pad structure

Circuit module and manufacturing method for the same

Buffer pad in solder bump connections and methods of manufacture

Chip package and fabrication method thereof

Copper pillar bump with non-metal sidewall protection structure and method of making the same

Semiconductor structure and fabrication method thereof

Semiconductor device and method of manufacturing same

Techniques for improving bond pad performance

Module comprising a semiconductor chip

Equipment and method for manufacturing semiconductor device

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Contact Metal for Hybridization and Related Methods

Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar

Chip on film type semiconductor package

Semiconductor device and manufacturing method of the same

Routing layer for mitigating stress in a semiconductor die

Methods for Lead Free Solder Interconnections for Integrated Circuits

Semiconductor device and method of forming IPD in fan-out wafer level chip scale package

Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer

Formation of alpha particle shields in chip packaging

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Sealed electric element package

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION

Semiconductor device and radio communication device

Etchant and method for manufacturing semiconductor device using same

Solder ball contact susceptible to lower stress

Semiconductor device with through silicon via and alignment mark

Die-bonded LED

Semiconductor device and a method of manufacturing the same

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods

Packaged electronic devices having die attach regions with selective thin dielectric layer

Electronic component manufacturing method

Via network structures and method therefor

Semiconductor device and a method of manufacturing the same

Method for the production of an electronic component and electronic component produced according to this method

Selective electromigration improvement for high current C4s

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Flip chip semiconductor device

Light-reflective anisotropic conductive paste and light-emitting device

Bonding apparatus and bonding method

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

Reducing warpage for fan-out wafer level packaging

Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Metallic laminate and method for preparing the same

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Packaged semiconductor assemblies and methods for manufacturing such assemblies

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

Semiconductor device and method of forming flipchip interconnect structure

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

Reduction of fluorine contamination of bond pads of semiconductor devices

Semiconductor laser mounting for improved frequency stability

IC devices having TSVS including protruding tips having IMC blocking tip ends

Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer

DEVICE INCLUDING A SEMICONDUCTOR CHIP

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Semiconductor device adapted to improve heat dissipation

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Solder bump interconnect

Systems including an I/O stack and methods for fabricating such systems

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method for manufacturing semiconductor device

Light emitting diode emitter substrate with highly reflective metal bonding

Printed circuit board and semiconductor package using the same

Solder ball for semiconductor packaging and electronic member using the same

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

Semiconductor device and method of forming stress relief layer between die and interconnect structure

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Polymer and solder pillars for connecting chip and carrier

Heat radiation material, electronic device and method of manufacturing electronic device

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

Ni plating of a BLM edge for Pb-free C4 undercut control

Extending metal traces in bump-on-trace structures

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit micro-module

Mosfet package

Electronic devices with yielding substrates

Routing method for flip chip package and apparatus using the same

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME

Bond pad structure

Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same

Semiconductor device and method of forming WLCSP structure using protruded MLP

Semiconductor device and method of confining conductive bump material with solder mask patch

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

Passivation layer for semiconductor device packaging

On-Chip RF shields with front side redistribution lines

Process for forming an anti-oxidant metal layer on an electronic device

MEMS and protection structure thereof

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Semiconductor device and a method of manufacturing the same

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY

IC device having low resistance TSV comprising ground connection

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device having a vertical interconnect structure using stud bumps

Package-on-package using through-hole via die on saw streets

Semiconductor device and method of forming stud bumps over embedded die

Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer

IC device having low resistance TSV comprising ground connection

Electrostatic chucking of an insulator handle substrate

Manufacturing method of semiconductor device and semiconductor device

Multichip Packages

COPPER-BASED METALLIZATION SYSTEM INCLUDING AN ALUMINUM-BASED TERMINAL LAYER

Flow sensors having nanoscale coating for corrosion resistance

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Light-emitting diode arrangement and method for producing the same

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and wiring board

Three-dimensional integrated circuits with protection layers

Semiconductor package and method for fabricating the same

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Semiconductor apparatus having penetration electrode and method for manufacturing the same

Method of room temperature covalent bonding

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

Forming through-silicon-vias for multi-wafer integrated circuits

Materials, structures and methods for microelectronic packaging

Semiconductor module

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

Semiconductor die package and method for making the same

Multilayer printed wiring board

Multilayer pillar for reduced stress interconnect and method of making same

Increasing dielectric strength by optimizing dummy metal distribution

Dummy metal design for packaging structures

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Achieving mechanical and thermal stability in a multi-chip package

Method for the production of an electronic component and electronic component produced according to this method

Semiconductor device having separated heatsink and chip mounting portion

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

Integrated circuit chip and fabrication method

Method of manufacturing semiconductor device

Method of forming adaptive interconnect structure having programmable contacts

Semiconductor packages and methods of fabricating the same

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN

SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device having a copper plug

Through hole via filling using electroless plating

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Anti-reflection structures for CMOS image sensors

ADHESIVE COMPOSITION

Fabrication of through-silicon vias on silicon wafers

Fabrication of through-silicon vias on silicon wafers

Ultrasonic wire bonding method for a semiconductor device

Light-emitting diode package and wafer-level packaging process of light-emitting diode

Semiconductor device package

BALL GRID ARRAY METHOD AND STRUCTURE

Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer

Chip pad resistant to antenna effect and method

Method of forming a ring-shaped metal structure

Solder paste, joining method using the same and joined structure

Method of fabricating a TSV for 3D packaging of semiconductor device

Light emitting semiconductor element bonded to a base by a silver coating

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE

Metallic thermal joint for high power density chips

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

SEMICONDUCTOR DEVICE

Semiconductor apparatus

Metal paste with co-precursors

Apparatus for thermal melting process and method of thermal melting process

Electronic assemblies including mechanically secured protruding bonding conductor joints

Semiconductor device and method of manufacturing the same

Semiconductor device for battery power voltage control

Semiconductor device with wireless communication

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

Compliant interconnects in wafers

Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die

Method for producing a semiconductor component with insulated semiconductor mesas

Semiconductor component with a semiconductor via

Aluminum enhanced palladium CMP process

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Semiconductor device and a method of manufacturing the same

System and method for integrated waveguide packaging

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

Soft error rate mitigation by interconnect structure

Mechanisms for resistivity measurement of bump structures

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Methods for wafer bonding, and for nucleating bonding nanophases

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

4D Device, process and structure

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Semiconductor device and semiconductor package having the same

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Solder interconnect pads with current spreading layers

Semiconductor device including chip with complementary I/O cells

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Integrated circuit device having through via and method for preparing the same

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

Semiconductor device and method of forming passive devices

Semiconductor package

Wafer level packaged GaN power device and the manufacturing method thereof

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

PACKAGE CARRIER

Connecting and bonding adjacent layers with nanostructures

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

Adding cap to copper passivation flow for electroless plating

Grain refinement by precipitate formation in Pb-free alloys of tin

Ni plating of a BLM edge for Pb-free C4 undercut control

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

BONDING WIRE FOR SEMICONDUCTOR

Method for manufacturing a substrate for a semiconductor package

Packaging or mounting a component

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM

Contact pad

Composite nanometal paste of two-metallic-component type, bonding method, and electronic part

Sintering materials and attachment methods using same

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor structure and method for making same

Flexible electronic devices and related methods

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

Etching composition for an under-bump metallurgy layer

Laser ashing of polyimide for semiconductor manufacturing

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the same

Electronic device and electronic apparatus

Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

Bonding wire for semiconductor device

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Grounded seal ring structure in semiconductor devices

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Semiconductor package device with a heat dissipation structure and the packaging method thereof

Substrateless power device packages

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Joining method and device produced by this method and joining unit

Apparatus for mounting semiconductor chip

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE

Semiconductor package and method of manufacturing the same

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Bond pad for wafer and package for CMOS imager

Method For Low Temperature Bonding And Bonded Structure

Method and system for bonding electrical devices using an electrically conductive adhesive

Incident radiation detector packaging

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

Chip-to-chip multi-signaling communication system with common conductive layer

Method of producing a chip package, and chip package

Integrated circuit device and structure

Semiconductor device and method of manufacturing the same

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device for semiconductor package having through silicon vias of different heights

Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same

Under-bump metallization (UBM) structure and method of forming the same

Conductive pillar structure

Pad structure having contact bars extending into substrate and wafer having the pad structure

Bonding apparatus and bonding method

Bonding apparatus

Semiconductor device and the method of manufacturing the same