Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Adhesive composition and sheet having an adhesive layer of the composition

Method for forming solder contacts on mounted substrates

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

Method of producing image display unit

Method for forming improved bump structure

Method for applying a structure of joining material to the back surfaces of semiconductor chips

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

Underfill aiding process for a tape

Methods for magnetically directed self assembly

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Encapsulation of a chip module

Method for manufacture of wafer level package with air pads

Semiconductor device having a semiconductor chip, and method for the production thereof

Chip packaging process

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor insulation structure

Method for producing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate

Power semiconductor module with overcurrent protective device

Semiconductor package with position member

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Apparatus and method for providing bypass capacitance and power routing in QFP package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Semiconductor assembly for improved device warpage and solder ball coplanarity

Method and apparatus for manufacturing IC chip packaged device

Low stress conductive polymer bump

Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device

Apparatus for block assembly process

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

Bump structure and its forming method

Electronic apparatus

Semiconductor module having a coupling substrate, and methods for its production

Integrated circuit package system

Semiconductor package having an interfacial adhesive layer

Flexible substrate for package of die

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Ultrasonic horn

Wiring board, semiconductor device, and method of manufacturing the same

Method of manufacturing a semiconductor device including a bump forming process

Semiconductor device and a manufacturing method of the same

Microelectronic packages and methods therefor

Wiring board and capacitor

Power semiconductor module

Hard disk drive and wireless data terminal using the same

Contact carriers (tiles) for populating larger substrates with spring contacts

Optical imaging device for optical proximity communication

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Wiring board

Semiconductor chip and semiconductor device

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Ultra-thin wafer system and method of manufacture thereof

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor package

Semiconductor device for radio frequency applications and method for making the same

Method of forming a molded array package device having an exposed tab and structure

Semiconductor device and radiation detector employing it

Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die

Integrated circuit package system with multi-surface die attach pad

Attachment system incorporating a recess in a structure

Semiconductor device and method for manufacturing the same

Method of assembly for multi-flip chip on lead frame on overmolded IC package

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method for separating package of WLP

Methods for protecting metal surfaces

Contacts to microdevices

Semiconductor device with improved design freedom of external terminal

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Modular bonding pad structure and method

Stackable device, device stack and method for fabricating the same

Component with chip through-contacts

Semiconductor IC-embedded substrate and method for manufacturing same

Integrated circuit solder bumping system

Power semiconductor module with MOS chip

Molded semiconductor package

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

LSI design support apparatus and LSI design support method

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Semiconductor device and a method of manufacturing the same

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Method of electrically connecting a microelectronic component

Semiconductor manufacturing method

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Wire sweep resistant semiconductor package and manufacturing method therefor

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Display device and manufacturing method of the same

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Integrated circuit protruding pad package system

Integrated circuit package system with adhesive restraint

Electronic assembly that includes pads having a bowl shaped upper section

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Monitoring deformation and time to logically constrain a bonding process

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

INDUCTIVE STRUCTURE

Flexible assembly of stacked chips

Fan out type wafer level package structure and method of the same

Semiconductor package with a support structure and fabrication method thereof

Multiple chip semiconductor package

Apparatuses and methods for high speed bonding

Semiconductor chip having bond pads

Electronic device and manufacturing method therefor

Semiconductor device having metallic plate with groove

Semiconductor package having plate interconnections

Semiconductor chip having bond pads and multi-chip package

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Semiconductor package film having reinforcing member and related display module

System in package (SIP) structure

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Semiconductor component and method of assembling the same

Power semiconductor device and method therefor

Component mounting method and component-mounted body

Semiconductor device and automotive AC generator

Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Multi-chip stack structure

Metal duplex method

Manufacturing method of electronic device

Support with solder ball elements and a method for populating substrates with solder balls

Chip structure and chip package structure

Flip-chip packaging process using copper pillar as bump structure

Semiconductor device and method for fabricating the same

Metal duplex method

Protective barrier layer for semiconductor device electrodes

Semiconductor device and manufacturing method thereof

Interconnection structure used in a pad region of a semiconductor substrate

Electronic device and method of manufacturing same

Semiconductor chip package and method of manufacturing the same

Semiconductor device having a probing region

High density interconnect assembly comprising stacked electronic module

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Low height vertical sensor packaging

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Resin mold type semiconductor device

Die pad for semiconductor packages and methods of making and using same

Semiconductor device and power conversion apparatus using the same

Light emitting diode and method for manufacturing the same

Stack type package module and method for manufacturing the same

Quinolinols as fluxing and accelerating agents for underfill compositions

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Bumping process and structure thereof

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Chip package structure and method for manufacturing bumps

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Stacked chip package using photosensitive polymer and manufacturing method thereof

Radiant energy heating for die attach

Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods

Lithographic type microelectronic spring structures with improved contours

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Pad open structure

Chip package and bump connecting structure thereof

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Method for forming a double embossing structure

Wafer structure with a multi-layer barrier in an UBM layer network device with power supply

Semiconductor packages for surface mounting and method of producing same

Ball grid array interface structure and method

Alpha particle shields in chip packaging

Lead-containing solder bumps

Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Lead-containing solder paste

Lead-containing anodes

Stacked chip package using warp preventing insulative material and manufacturing method thereof

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Copper bump barrier cap to reduce electrical resistance

Wafer integrated rigid support ring

Semiconductor device package

Wiring board construction including embedded ceramic capacitors(s)

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Quad flat pack (QFP) package and flexible power distribution method therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Reversible-multiple footprint package and method of manufacturing

Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature

Power semiconductor device having lines within a housing

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

Approach to high temperature wafer processing

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for producing semiconductor device and semiconductor device

Methods and apparatus for high-density chip connectivity

Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system

Ternary alloy column grid array

Bonding program

Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate

RFID inlays and methods of their manufacture

Structure for circuit assembly

Encapsulated chip scale package having flip-chip on lead frame structure and method

Printed circuit board and method thereof and a solder ball land and method thereof

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method of packaging and interconnection of integrated circuits

Semiconductor die package

Semiconductor power component with a vertical current path through a semiconductor power chip

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Semiconductor device

MOSFET package

MOSFET package

Leadframe package with dual lead configurations

High current semiconductor device system having low resistance and inductance

Semiconductor connection component

Power semiconductor packaging method and structure

3D IC method and device

Tin-silver solder bumping in electronics manufacture

Manufacturing method of semiconductor device

Semiconductor device and a manufacturing method of the same

Multichip packages with exposed dice

Semiconductor package with contact support layer and method to produce the package

Method and apparatus for flip-chip bonding

Method and device for attaching a chip in a housing

Method And Device For Enhancing Solderability

Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly

Bonding apparatus

Bonding pattern discrimination device

Bonding pattern discrimination program

Tier structure with tier frame having a feedthrough structure

Semiconductor device with improved contacts

Semiconductor device and method of manufacturing the same

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Multi-chip semiconductor device package

Thin IC package for improving heat dissipation from chip backside

Semiconductor module

Semiconductor device and a manufacturing method of the same

Semiconductor device electronic component, circuit board, and electronic device

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Semiconductor assembly and packaging for high current and low inductance

Insulated gate semiconductor device and manufacturing method thereof

Mounting structure, electro-optical device, and electronic apparatus

Apparatuses and methods facilitating functional block deposition

Solder composition for electronic devices

Display device having an anisotropic-conductive adhesive film

Chip packaging structure without leadframe

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit with low-stress under-bump metallurgy

Application of autonomic self healing composites to integrated circuit packaging

Semiconductor device and method of manufacturing the same

Semiconductor device

Radio frequency over-molded leadframe package

Semiconductor device

SEMICONDUCTOR DEVICE

Fluxless bumping process

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Method for manufacturing semiconductor device

Metal pad or metal bump over pad exposed by passivation layer

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Method of making a stacked die package

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Laminated electronic component and method for producing the same

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Output match transistor

Semiconductor power device and RF signal amplifier

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Semiconductor device and method of manufacturing the same

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Semiconductor device-composing substrate and semiconductor device

Semiconductor package with ferrite shielding structure

Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Packaged integrated circuit with enhanced thermal dissipation

IC with on-die power-gating circuit

Semiconductor package and manufacturing method thereof

Semiconductor device

Method of making an electronic assembly

Wire bonding method and device of performing the same

Packaging method

Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device

Methods for forming flexible column die interconnects and resulting structures

Method of forming solder bump with reduced surface defects

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Self alignment features for an electronic assembly

Method for forming high reliability bump structure

Semiconductor device and a method of manufacturing the same

Process for exposing solder bumps on an underfill coated semiconductor

Circuit board structure integrated with semiconductor chip and method of fabricating the same

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack

Packaging method for segregating die paddles of a leadframe

IC chip mounting method