Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Semiconductor device and method for producing the same

Semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Super high-density module with integrated wafer level packages

Semiconductor structure with a plastic housing and separable carrier plate

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Microelectronic elements with compliant terminal mountings and methods for making the same

Stack-type semiconductor package and manufacturing method thereof

Plating bar design for high speed package design

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Electronic package with integral electromagnetic radiation shield and methods related thereto

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

Methods of fabricating interconnects for semiconductor components

Wafer structure and bumping process

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Method of manufacturing semiconductor device

Three dimensional microstructures and methods for making three dimensional microstructures

Method of producing a semiconductor device, and wafer-processing tape

Pressure-contact type rectifier with contact friction reducer

Chip on a board

Package for high power density devices

Semiconductor device

Semiconductor device having metal interconnection structure and method for forming the same

PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Structure of circuit board and method for fabricating same

Semiconductor device with thermoplastic resin to reduce warpage

Low temperature phase change thermal interface material dam

Semiconductor device and manufacturing method of the same

Semiconductor package structure and method of manufacture

Semiconductor die structure featuring a triple pad organization

Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions

ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

External electrode forming method

Multi-strand substrate for ball-grid array assemblies and method

Adhesive for bonding circuit members, circuit board and process for its production

Dicing die-bonding film, method of fixing chipped work and semiconductor device

Paste coater and PoP automatic mounting apparatus employing the same

Wireless communication system

Combination quad flat no-lead and thin small outline package

Package using array capacitor core

Method for mounting bumps on an under metallurgy layer

Integrated circuit having bond pad with improved thermal and mechanical properties

Method for embedding dies

Chip module and method for producing a chip module

Die-attaching paste composition and method for hardening the same

Semiconductor device and mold for resin-molding semiconductor device

Electrical microfilament to circuit interface

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Thermal enhanced upper and dual heat sink exposed molded leadless package

Microelectronic devices having a curved surface and methods for manufacturing the same

Copper plating connection for multi-die stack in substrate package

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Flip chip MLP with conductive ink

High temperature package flip-chip bonding to ceramic

Structure and method for thin single or multichip semiconductor QFN packages

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

Substrate panel with plating bar structured to allow minimum kerf width

Radio frequency device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Apparatus and clocked method for pressure-sintered bonding

Method for manufacturing an electronic module, and an electronic module

Method and apparatus for mounting conductive ball

Method of fabricating electrical connection terminal of embedded chip

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and system for increasing yield of vertically integrated devices

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Method of making exposed pad ball grid array package

Method for packaging microelectronic devices

Bonding apparatus having adjacent hot-heads for liquid crystal display manufacture

Die bonding adhesive tape

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Leadless semiconductor package and method of manufacture

Semiconductor components having through wire interconnects (TWI)

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing same, and semiconductor wafer

CAPILLARY FOR A BONDING TOOL

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Interconnect assemblies and methods

Semiconductor devices with conductive clips

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Circuit under pad structure and bonding pad process

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Method of making semiconductor package having exposed heat spreader

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Protection for an integrated circuit chip containing confidential data

Dicing and die bonding adhesive tape

Flip chip hermetic seal using pre-formed material

Flip chip package and manufacturing method of the same

Intermediate connection for flip chip in packages

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Semiconductor packages having leadframe-based connection arrays

Pin-type chip tooling

Circuit substrate and method of manufacture

Semiconductor integrated circuit

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Low cost bonding pad and method of fabricating same

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Head assembly for chip mounter

Semiconductor device having align mark layer and method of fabricating the same

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Semiconductor Device with Improved Stud Bump

Flip-chip semiconductor device manufacturing method

Low Profile Stacking System and Method

Method of manufacturing optical module

Liquid epoxy resin composition

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Method of manufacturing surface mount type crystal oscillator

Semiconductor package structure and method of manufacture

Hybrid solder pad

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Packaged device and method of forming same

Alloys for flip chip interconnects and bumps

Interconnecting element between semiconductor chip and circuit support and method

Semiconductor package form within an encapsulation

Rotary chip attach

Low Profile Stacking System and Method

Carrier board structure with semiconductor chip embedded therein

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Integrated circuit package system with bump pad

SEMICONDUCTOR DEVICE

Optical module and method of manufacturing the same

Semiconductor die package using leadframe and clip and method of manufacturing

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method for producing and cleaning surface-mountable bases with external contacts

Damascene patterning of barrier layer metal for C4 solder bumps

PROCESSING METHOD FOR SEMICONDUCTOR STRUCTURE

Method and apparatus for attaching solder balls to substrate

Dispensing device and mounting system

Micro-electronic package structure and method for fabricating the same

Method of forming a leaded molded array package

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Method of manufacturing a semiconductor device

INTEGRATED CIRCUIT PACKAGE SYSTEM

Reversible leadless package and methods of making and using same

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Semiconductor device and method for manufacturing the same

FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD

Package and package module of the package

Integrated circuit package system with downset lead

Bonding pad with high bonding strength to solder ball and bump

Semiconductor device

Semiconductor device

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Integrated circuit package system using heat slug

Method for fabricating semiconductor package

Semiconductor package including a semiconductor die having redistributed pads

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Semiconductor package that includes stacked semiconductor die

Chip stack package and manufacturing method thereof

Wafer level package having redistribution interconnection layer and method of forming the same

Semiconductor device and method of manufacturing the same

Integrated circuit package system with multi-planar paddle

Etched leadframe flipchip package system

Thermally enhanced power semiconductor package system

Semiconductor device

Semiconductor chip having bond pads

Stackable power semiconductor package system

Integrated circuit package system with integrated circuit support

SEMICONDUCTOR STRUCTURE

Semiconductor device and fabrication method for the same

Wire bonding method

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Method for pressure bonding and method for manufacturing semiconductor device

Joining method and joining device

Electrical interconnection structure formation

Small chips with fan-out leads

Bonding a non-metal body to a metal surface using inductive heating

Semiconductor device, fabrication method therefor, and film fabrication method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Packaging methods

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Photosensitive composition

Liquid epoxy resin composition

Liquid epoxy resin composition

Mm-wave antenna using conventional IC packaging

Constant voltage diode

Universal wafer carrier for wafer level die burn-in

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

Fine pitch interconnect and method of making

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Reduction of macro level stresses in copper/low-K wafers

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-stack chip package with wired bonded chips

Electrode package for semiconductor device

Power semiconductor module

Lead arrangement and chip package using the same

Low profile semiconductor package

Power module having at least two substrates

Method for forming multi-layer bumps on a substrate

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Method for producing through-contacts and a semiconductor component with through-contacts

Semiconductor package with redistributed pads

Method of making stacked die package

Method of manufacturing flash memory cards

Fabrication method for a chip packaging structure

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Device for making an in-mold circuit

Semiconductor device including a particular dummy terminal

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Electronic assembly having graded wire bonding

Junction structure for a terminal pad and solder, and semiconductor device having the same

Void-free circuit board and semiconductor package having the same

Electronic component, module, module assembling method, module identification method and module environment setting method

Semiconductor device with inclined through holes

Semiconductor device and manufacturing method of the same

Printed wiring board

Semiconductor device with solder balls having high reliability

Semiconductor device featuring electrode terminals forming superior heat-radiation system

Contact pad structure for flip chip semiconductor die

Semiconductor device and manufacturing method thereof

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Back-face and edge interconnects for lidded package

Package device with electromagnetic interference shield

Multilayered circuit substrate with semiconductor device incorporated therein

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Packaging for high speed integrated circuits

Integrated circuit packaging

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Method and apparatus for attaching a workpiece to a workpiece support

Heat treatment for a panel and apparatus for carrying out the heat treatment method

Method for mounting electronic component

Bond Surface Conditioning System for Improved Bondability

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Semiconductor device packaging for avoiding metal contamination

Semiconductor component and method for production of a semiconductor component

Method for manufacturing a semiconductor device

Methods and apparatuses for fluidic self assembly

Plastic packaged device with die interface layer

Semiconductor device and method for producing the same

Semiconductor package with controlled solder bump wetting

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Closed loop thermally enhanced flip chip BGA

Chip-packaging composition of resin and cycloaliphatic amine hardener

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Integrated chip device in a package

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Semiconductor component and methods to produce a semiconductor component

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Thin package system with external terminals

Semiconductor devices with multiple heat sinks