212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Integrated circuit pad with separate probing and bonding areas
#9002Relay board with bonding pads connected by wirings
#9003Connection element for a semiconductor component and method for producing the same
#9004Stress and force management techniques for a semiconductor die
#9005Wafer-level-chip-scale package and method of fabrication
#9006Reduced inductance in ball grid array packages
#9007Multi-component integrated circuit contacts
#9008Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#9009Semiconductor device
#9010Wiring substrate and semiconductor package implementing the same
#9011Packaging for high speed integrated circuits
#9012Composite metal column for mounting semiconductor device
#9013Semiconductor device and method of manufacturing the same
#9014Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
#9015Packaging for high speed integrated circuits
#9016Packaging for high speed integrated circuits
#9017Packaging for high speed integrated circuits
#9018Semiconductor package without chip carrier and fabrication method thereof
#9019Packaging for high speed integrated circuits
#9020Packaging for high speed integrated circuits
#9021Semiconductor device and manufacturing method thereof
#9022Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#9023Electrically connecting substrate with electrical device
#9024Process for making a semiconductor device having a roughened surface
#9025Fabrication method of semiconductor circuit device
#9026Method and structure for interfacing electronic devices
#9027Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#9028Method for forming bump protective collars on a bumped wafer
#9029Bumped die and wire bonded board-on-chip package
#9030Method and structure for reduction of soft error rates in integrated circuits
#9031Probing pads in kerf area for wafer testing
#9032Electronic component unit
#9033Semiconductor package and fabrication method thereof
#9034Semiconductor device
#9035Self alignment features for an electronic assembly
#9036Semiconductor device
#9037Tape wiring substrate and chip-on-film package using the same
#9038Packaging of a microchip device
#9039Package substrate and semiconductor package using the same
#9040Direct FET device for high frequency application
#9041Micro-package, multi-stack micro-package, and manufacturing method therefor
#9042Temperature dependent semiconductor module connectors
#9043Integrated circuit for driving semiconductor device and power converter
#9044Wire-bonding method and semiconductor package using the same
#9045Structure and method for producing multiple size interconnections
#9046Semiconductor package having dual interconnection form and manufacturing method thereof
#9047Semiconductor device
#9048Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#9049Semiconductor device
#9050Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#9051Parallel chip embedded printed circuit board and manufacturing method thereof
#9052Method for manufacturing semiconductor chip package
#9053Method of manufacturing a passive integrated matching network for power amplifiers
#9054Semiconductor device
#9055Method for self-assembling microstructures
#9056Method and System for Applying an Adhesive Substance on an Electronic Device
#9057Electronic assembly and method for producing an electronic assembly
#9058METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#9059Semiconductor device manufacturing method
#9060Semiconductor device and manufacturing method thereof
#9061Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#9062Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#9063Dicing die bonding film
#9064Bonding apparatus and method
#9065Semiconductor device with semiconductor device components embedded in a plastics composition
#9066Soldering a die to a substrate
#9067Semiconductor device
#9068Method of interconnecting terminals and method of mounting semiconductor devices
#9069Thermal interface material with carbon nanotubes and particles
#9070Semiconductor device advantageous in improving water resistance and oxidation resistance
#9071Semiconductor device and manufacturing method of the same
#9072Under bump metallization design to reduce dielectric layer delamination
#9073Adhesive layer forming a capacitor dielectric between semiconductor chips
#9074Anti-warp heat spreader for semiconductor devices
#9075Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#9076Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#9077Semiconductor die package and method for making the same
#9078Multi-part lead frame with dissimilar materials
#9079Semiconductor device
#9080Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9081SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DEVICE DESIGN METHOD RECORDING MEDIUM, AND SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM
#9082Circuit device and method of manufacturing the same
#9083Method of producing wire-connection structure, and wire-connection structure
#9084Assembly method for semiconductor die and lead frame
#9085Cure catalyst, composition, electronic device and associated method
#9086Circuitry component and method for forming the same
#9087Ultrathin semiconductor circuit having contact bumps
#9088Methods for bonding and micro-electronic devices produced according to such methods
#9089Method of manufacturing a semiconductor device
#9090Standoffs for centralizing internals in packaging process
#9091Three dimensional device integration method and integrated device
#9092Heat-dissipating semiconductor package and fabrication method thereof
#9093Grid array connection device and method
#9094Mounting and adhesive layer for semiconductor components
#9095Semiconductor integrated circuit device
#9096Mechanical integrity evaluation of low-k devices with bump shear
#9097Printed circuit board having embedded RF module power stage circuit
#9098Printed circuit board with embedded electronic components
#9099Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#9100Semiconductor half-bridge module with low inductance
#9101Radio frequency receiver chip with improved electrostatic discharge level
#9102Method of embedding semiconductor chip in support plate
#9103Semiconductor device and method for manufacturing the same
#9104Semiconductor device and a method of manufacturing the same
#9105Semiconductor device
#9106Semiconductor device and manufacturing method of the same
#9107Packaging logic and memory integrated circuits
#9108Lead-free semiconductor package
#9109Alignment using fiducial features
#9110Semiconductor device
#9111Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip
#9112Contact Structures Comprising A Core Structure And An Overcoat
#9113Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#9114Semiconductor packages and methods of manufacturing thereof
#9115Substrate structure and the fabrication method thereof
#9116Adhesive tape for electronic components
#9117Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#9118Micro solder pot
#9119Chip-on-board assemblies
#9120Semiconductor device and circuit board
#9121Low stress chip attachment with shape memory materials
#9122Flip chip packaging using recessed interposer terminals
#9123Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
#9124CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#9125Lead frame structure with aperture or groove for flip chip in a leaded molded package
#9126Chip-package structure and fabrication process thereof
#9127Electronic component comprising a cooling surface
#9128Wafer and single chip having circuit rearranged structure and method for fabricating the same
#9129Power semiconductor module
#9130Method of soldering or brazing articles having surfaces that are difficult to bond
#9131Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
#9132Remote chip attachment
#9133Coaxial through chip connection
#9134Post-attachment chip-to-chip connection
#9135Tack & fuse chip bonding
#9136Routingless chip architecture
#9137Rigid-backed, membrane-based chip tooling
#9138Through chip connection
#9139Chip-based thermo-stack
#9140Interposers with alignment fences and semiconductor device assemblies including the interposers
#9141Non-contact ID card and manufacturing method thereof
#9142Probe card assembly and kit
#9143Protected chip stack
#9144Substrate for pre-soldering material and fabrication method thereof
#9145Integrated electronic chip and interconnect device and process for making the same
#9146Chip spanning connection
#9147Inverse chip connector
#9148Chip connector
#9149Post & penetration interconnection
#9150Triaxial through-chip connection
#9151Profiled contact
#9152Chip capacitive coupling
#9153Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#9154Electronic chip contact structure
#9155Patterned contact
#9156Method of manufacturing semiconductor device with improved design freedom of external terminal
#9157Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
#9158Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
#9159Electronic module with a conductive-pattern layer and a method of manufacturing same
#9160Contact-based encapsulation
#9161Leadless semiconductor package
#9162Bond capillary design for ribbon wire bonding
#9163Membrane-based chip tooling
#9164Microelectronic assemblies having low profile connections
#9165Superimposed displays
#9166Silicon wafer with solderable coating on its wafer rear side, and process for producing it
#9167Semiconductor device and method of manufacturing a semiconductor device
#9168Semiconductor device having reduced number of external pad portions
#9169Electronic package structures and methods
#9170Assembly structure and method for chip scale package
#9171Semiconductor device
#9172Method of wafer-level packaging using low-aspect ratio through-wafer holes
#9173Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
#9174Gate contact and runners for high density trench MOSFET
#9175Source contact and metal scheme for high density trench MOSFET
#9176Heating apparatus
#9177Wiring board and method for manufacturing the same
#9178Wiring board and manufacturing method of wiring board
#9179Method of fabricating wiring board and method of fabricating semiconductor device
#9180Semiconductor package and method for forming the same
#9181Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
#9182Method of forming overhang support for a stacked semiconductor device
#9183Method for connecting a semiconductor chip onto an interconnection support
#9184Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#9185Method of making semiconductor BGA package having a segmented voltage plane
#9186Method of assembling semiconductor devices with LEDs
#9187Method and circuit structure employing a photo-imaged solder mask
#9188Rectifier diode of electric generator
#9189Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component
#9190RFID tags and processes for producing RFID tags
#9191Epoxy bump for overhang die
#9192Semiconductor element and manufacturing method thereof
#9193Method for mounting an electronic part on a substrate using a liquid containing metal particles
#9194Stackable tier structure comprising prefabricated high density feedthrough
#9195Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#9196Integrated circuit device
#9197Power module package structure
#9198Semiconductor device
#9199Encapsulated power semiconductor assembly
#9200Redistribution layer with microstrips
#9201Semiconductor BGA package having a segmented voltage plane
#9202System for assembling electronic components of an electronic system
#9203Semiconductor device modules, semiconductor devices, and microelectronic devices
#9204Semiconductor device
#9205Method for efficiently producing removable peripheral cards
#9206Solder joints for copper metallization having reduced interfacial voids
#9207Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof
#9208Semiconductor bond pad structures and methods of manufacturing thereof
#9209Soldering method, electronic part, and part-exchanging method
#9210Multi-chip die bonder and method
#9211Panel and semiconductor device having a composite plate with semiconductor chips
#9212Self assembly of elements for displays
#9213Integrated circuit with substantially perpendicular wire bonds
#9214Die-wafer package and method of fabricating same
#9215Semiconductor device
#9216Offset solder bump method and apparatus
#9217Semiconductor device
#9218System and method for die attach using a backside heat spreader
#9219Method of bonding a microelectronic die to a substrate and arrangement to carry out method
#9220Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#9221Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
#9222Semiconductor chip with coil element over passivation layer
#9223CHIP PACKAGE STRUCTURE
#9224Chip structure with bevel pad row
#9225Chip structure with arrangement of side pads
#9226Semiconductor device and method of manufacturing the same
#9227Semiconductor device and manufacturing method thereof
#9228Microelectronic assemblies having compliant layers
#9229Semiconductor device packages with substrates for redistributing semiconductor device electrodes
#9230Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device
#9231LED package structure and method making of the same
#9232Leadframeless package structure and method
#9233Backside method for fabricating semiconductor components with conductive interconnects
#9234Light emitting device package and method for manufacturing the same
#9235Adherence of a solid-state image-sensing device to a substrate
#9236Low range bonding tool
#9237Mask and method for electrokinetic deposition and patterning process on substrates
#9238Thermal management of systems having localized regions of elevated heat flux
#9239NANO IC
#9240Method of reducing process steps in metal line protective structure formation
#9241Ball film for integrated circuit fabrication and testing
#9242Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
#9243Semiconductor device and fabrication method thereof
#9244Electrical/optical integration scheme using direct copper bonding
#9245Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
#9246Method for manufacturing electronic component-embedded printed circuit board
#9247Method and system for solder die attach
#9248Method of bonding solder pads of flip-chip package
#9249Semiconductor device and method of fabricating the same
#9250Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device
#9251Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof
#9252Semiconductor device including wire bonding pads and pad layout method
#9253Packaging structure and method
#9254Flip chip interconnect solder mask
#9255Semiconductor device chip and semiconductor device chip package
#9256Handling and positioning of metallic plated balls for socket application in ball grid array packages
#9257Composite multi-layer substrate and module using the substrate
#9258Semiconductor device with sealed semiconductor chip
#9259Semiconductor device and manufacturing method of the same
#9260Semiconductor component in a housing with mechanically inforcing flat conductor webs
#9261Technique for defining a wettable solder joint area for an electronic assembly substrate
#9262Wire loop, semiconductor device having same and wire bonding method
#9263Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate
#9264Method for making a flat-top pad
#9265Method of manufacturing a device having a contacting structure
#9266Solder ball pad surface finish structure of circuit board and fabrication method thereof
#9267Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
#9268Intermediate semiconductor device structures
#9269Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame
#9270Transparent member, optical device using transparent member and method of manufacturing optical device
#9271Surface protection film and method for producing the same
#9272Au alloy bonding wire
#9273Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
#9274Stencil and method for depositing material onto a substrate
#9275Device with area array pads for test probing
#9276Terminal pad structures and methods of fabricating same
#9277Semiconductor device with passivation layer covering wiring layer
#9278Contact structure on chip and package thereof
#9279Method of making the semiconductor device, circuit board, and electronic instrument
#9280Semiconductor device and fabrication method thereof
#9281Chip-scale package
#9282Semiconductor device with substrate having penetrating hole having a protrusion
#9283Wirebonded device packages for semiconductor devices having elongated electrodes
#9284Large die package and method for the fabrication thereof
#9285Stacked type semiconductor device
#9286Bondwire utilized for coulomb counting and safety circuits
#9287Semiconductor light-emitting device and method for manufacturing the device
#9288Method of manufacturing self-supporting contacting structures
#9289Working method of metal material and semiconductor apparatus fabricated by the method
#9290Conductive bump structure for semiconductor device and fabrication method thereof
#9291Multi-chip module and method of manufacture
#9292Post bump passivation for soft error protection
#9293Flip chip method
#9294Multiple etch-stop layer deposition scheme and materials
#9295Alignment key structure in a semiconductor device and method of forming the same
#9296Semiconductor package with controlled solder bump wetting and fabrication method therefor
#9297Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
#9298Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
#9299Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
#9300Semiconductor device