Compliant electrical contacts

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Method and system for 3D alignment in wafer scale integration

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Device packages having stable wirebonds

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Novel method for copper wafer wire bonding

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Routing design to minimize electromigration damage to solder bumps

Device package

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Integrated circuit device having encapsulant dam with chamfered edge

Semiconductor device

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus

Apparatus and method for filling a ball grid array template

Electronic device manufacture

Semiconductor manufacturing method for die bonding

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Thermal enhanced package for block mold assembly

High-density inter-die interconnect structure

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor package and semiconductor module

IC chip package structure and underfill process

Structure and manufacturing method of a chip scale package

Spaced, bumped component structure

Display apparatus

Semiconductor chip electrical connection structure

Semiconductor device and method of manufacturing a semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Package structure and fabrication method thereof

Chip on board leadframe for semiconductor components having area array

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Semiconductor device with sense structure

Packaging designs for LEDs

Method and apparatus for forming a low profile wire loop

Ribbon bonding tool and process

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

System-in-package wireless communication device comprising prepackaged power amplifier

Method of making a compliant interconnect assembly

Method of manufacturing semiconductor device and method of treating electrical connection section

Semiconductor device and manufacturing method thereof

Methods relating to forming interconnects

Under bump metallurgy in integrated circuits

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Electronic component, electro-optical device, and electronic apparatus

Flip-chip package structure with direct electrical connection of semiconductor chip

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Semiconductor device and method for producing the same

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor package using flexible film and method of manufacturing the same

Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Semiconductor integrated circuit and method of manufacturing the same

Apparatus of clamping semiconductor devices using sliding finger supports

Printed-circuit board and circuit unit incorporating the circuit board

Contact maker for power semiconductor modules and disc cells

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Wafer-processing tape and method of producing the same

Semiconductor apparatus and manufacturing method

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Multi-function card device

Wire loop, semiconductor device having same and wire bonding method

Wire clamping plate

Semiconductor device and manufacturing method therefor

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for cutting semiconductor substrate

Assembly comprising functional devices and method of making same

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Method of manufacturing a cavity package

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Flip chip package structure

Semiconductor interconnect having dome shaped conductive spring contacts

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Method for manufacturing semiconductor device having a pair of heat sinks

Printed circuit board including embedded chips and method of fabricating the same using plating

NANO IC packaging

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Flexible substrate for package

Tape for tape carrier package

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Semiconductor device

System and method for mounting electrical devices

Electrical contact

Interconnection device and system

Method of forming contact pads

Method and system for 3D alignment in wafer scale integration

Method of manufacturing a semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Bare die socket

Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby

Plating apparatus and plating method

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Method for fabricating thermally enhanced semiconductor package

Semiconductor device and method for manufacturing the same

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Microelectronic package having stacked semiconductor devices and a process for its fabrication

Semiconductor device

Semiconductor device package

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device and method of fabricating the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

Semiconductor device and manufacturing method of the same

Semiconductor device and radio communication device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Electronic device including a substrate structure and a process for forming the same

Connection ball positioning method and device for integrated circuits

Hot-Melt Underfill Composition and Methos of Application

Method of marking a low profile packaged semiconductor device

Method and system for performing die attach using a flame

Package that integrates passive and active devices with or without a lead frame

Module

Power semiconductor package

Bonding pad structure

Ball limiting metallurgy split into segments

Semiconductor device and manufacturing method therefor

PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Methods of making and using a floating lead finger on a lead frame

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

RFID tag and method of manufacturing the same

RFID tag and method of manufacturing the same

Method of manufacturing wiring substrate to which semiconductor chip is mounted

PCB, manufacturing method thereof and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Methods for fabricating thin complaint spring contacts

Microelectronic devices having underfill materials with improved fluxing agents

Solder bump composition for flip chip

Package structure with embedded chip and method for fabricating the same

Electrical or electronic component and method of producing same

Compact system module with built-in thermoelectric cooling

Electronic component with a housing package

Cornerbond assembly comprising three-dimensional electronic modules

Display, method of manufacturing display and apparatus for manufacturing display

B-stageable underfill encapsulant and method for its application

Multi-chip module

Method of making wafer level ball grid array

Flip chip package with anti-floating structure

Apparatus and method for manufacturing semiconductor device

Flip chip device

Method for solder bumping, and solder-bumping structures produced thereby

Test system for semiconductor components having conductive spring contacts

Method for fabricating semiconductor components with conductive spring contacts

Metallization structure over passivation layer for IC chip

Multi-chip module having bonding wires and method of fabricating the same

Heat dissipating semiconductor package and fabrication method thereof

High density package interconnect wire bond strip line and method therefor

Semiconductor device

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Electrical-interference-isolated transistor structure

Semiconductor package having improved adhesion and solderability

Electronic component and a panel

Forming of high aspect ratio conductive structure using injection molded solder

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Method of manufacturing a device-incorporated substrate

Wireless communication system

Three-dimensional device fabrication method

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device

Methods for fabricating stiffeners for flexible substrates

Wafer-level underfill process making use of sacrificial contact pad protective material

Coolant cooled type semiconductor device

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Semiconductor device and the method of producing the same

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Method for fabricating semiconductor package having conductive bumps on chip

Semiconductor package and fabrication method thereof

Semiconductor device and method of fabricating the same

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

MSD raised metal interface features

Press pack power semiconductor module

Power semiconductor device

Solder interconnect structure and method using injection molded solder

Method for mounting a semiconductor chip onto a substrate

Epoxy-solder thermally conductive structure for an integrated circuit

Roller wire brake for wire bonding machine

Method of making a circuitized substrate

Semiconductor package substrate with embedded chip and fabrication method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Bond pad for ball grid array package

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Microelectronic packages with solder interconnections

Wire bond interconnection

Semiconductor device

Semiconductor die attachment for high vacuum tubes

Semiconductor chip and tab package having the same

Microelectronic assemblies incorporating inductors

Simplified multichip packaging and package design

Ultrasonic head

Resonator, ultrasonic head, and ultrasonic bonder using the same

Plating apparatus

Package for a semiconductor device

Forming an intermediate layer in interconnect joints and structures formed thereby

Method for removing resin mask layer and method for manufacturing solder bumped substrate

High surface area aluminum bond pad for through-wafer connections to an electronic package

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Film adhesive and semiconductor package using the same

Semiconductor device, method and apparatus for fabricating the same

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Solder for fabricating solder bumps and pumping process

Power module, and phase leg assembly

Probe arrays and method for making

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

ESD protection apparatus for an electrical device

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Overmolded lens over LED die

Method for mounting an electronic element on a wiring board

Methods and systems for rise-time improvements in differential signal outputs

Die attach material for TBGA or flexible circuitry

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF

Heat sinking structure

Heat dissipating packages structure and method for fabricating the same

Heater for annealing trapped charge in a semiconductor device

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Flip-chip component

Multi-chip semiconductor package

Multi-chip package

Semiconductor system with fine pitch lead fingers

Liquid metal droplet generator

Active area bonding compatible high current structures

Injection molded metal bonding tray for integrated circuit device fabrication

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Method for wafer level stack die placement

Integration type semiconductor device and method for manufacturing the same

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device with crack-resistant multilayer copper wiring

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Staggered wirebonding configuration

Semiconductor wafer with electrically connected contact and test areas

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Electronic device package and electronic equipment

IC chip package with isolated vias

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound