Three dimensional packaging optimized for high frequency circuitry

Package substrate with built-in capacitor and manufacturing method thereof

Wire bonded semiconductor device having low inductance and noise

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Solder bumps in flip-chip technologies

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Dicing die adhesive film for semiconductor

Method of manufacturing a semiconductor apparatus

Semiconductor device and method of manufacturing the same

Composite electronic component

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Semiconductor device assemblies with compliant spring contact structures

Multilayer printed wiring board

Microsystem component and method for gluing microcomponents to a substrate

Fabrication of compliant spring contact structures and use thereof

Method of making a circuitized substrate

Method of manufacturing multi-layered substrate

Gap control between interposer and substrate in electronic assemblies

Method of manufacturing a semiconductor device

Semiconductor device with terminals, and method of manufacturing the same

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of repairing an image display unit

Circuit device

Microelectronic contact structure and method of making same

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor device and method for producing the same

Semiconductor package

Apparatus for conducting heat in a flip-chip assembly

Thermal interconnect systems methods of production and uses thereof

Microelectronic assemblies having compliant layers

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Thermal enhanced low profile package structure

Device packages having a III-nitride based power semiconductor device

Semiconductor substrate

Semiconductor device having surface mountable external contact areas and method for producing the same

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Die attach adhesives with improved stress performance

Increased stand-off height integrated circuit assemblies, systems, and methods

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Method of forming a substrateless semiconductor package

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Inlet for an electronic tag

Semiconductor device and manufacturing method thereof

Bonding pad for a packaged integrated circuit

Fan out type wafer level package structure and method of the same

Electronic devices including offset conductive bumps

High density direct connect LOC assembly

Thin multiple semiconductor die package

Semiconductor device

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Semiconductor device including ROM interface pad

Process for precise arrangement of micro-bodies

Ultrasonic tool and ultrasonic bonder

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Integrated heat spreader and method for using

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor package substrate having contact pad protective layer formed thereon

Semiconductor device and fabrication method thereof

Method of fabricating a substrate with a concave surface

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Power semiconductor device and method therefor

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Method of fabricating semiconductor chip assemblies

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Fabricating process of an electrically conductive structure on a circuit board

Leadless semiconductor package and manufacturing method thereof

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Method of assembling displays on substrates

Alignment fences and devices and assemblies including the same

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Semiconductor device to be applied to various types of semiconductor package

Semiconductor device having stress relaxation sections

Chip package with dam bar restricting flow of underfill

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Chip embedded package structure and fabrication method thereof

Semiconductor device and a manufacturing method of the same

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Vertically integrated system-in-a-package

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Package structure having mixed circuit and composite substrate

Semiconductor device with extraction electrode

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Bonding wire cleaning unit and method of wire bonding using same

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Method for manufacturing an electronic module

Liquid epoxy resin composition and semiconductor device

Method of room temperature covalent bonding

Method of manufacturing a semiconductor device

Universal interconnect die

Method of manufacturing semiconductor device

Flip chip interconnection having narrow interconnection sites on the substrate

Vertically stacked semiconductor device

Methods for the electronic, homogeneous assembly and fabrication of devices

Method for fabricating flip-attached and underfilled semiconductor devices

Aluminum cap with electroless nickel/immersion gold

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

C4 joint reliability

Semiconductor device

Semiconductor device with interlocking clip

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Method for producing a wire connection

Use of electrical power multiplication for power smoothing in power distribution

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Method of forming an interconnection element

ELECTRICAL CONTACT

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Flip-chip adaptor package for bare die

System and method to increase die stand-off height

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Method of producing a package for semiconductor chips

Method of making a flexible substrate containing self-assembling microstructures

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Integrated device and electronic system

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Stacked semiconductor package

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Forming solder balls on substrates

Method, device and system for bonding a semiconductor element

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Wiring board manufacturing method

Semiconductor device and a method for manufacturing the same

Temperature dependent semiconductor module connectors

Forming a barrier layer in interconnect joints and structures formed thereby

Method for producing a semiconductor device and resulting device

Front-end processing of nickel plated bond pads

Radio frequency identification (RFID) tag lamination process using liner

Radio frequency identification (RFID) tag lamination process

Semiconductor package fabrication

Wafer-processing tape

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Semiconductor device with via hole for electric connection

Printed wiring board and method for manufacturing the same

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Semiconductor device, semiconductor body and method of manufacturing thereof

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Device mounting substrate and image display device

Wafer-level package having test terminal

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

Low profile small outline leadless semiconductor device package

Methods of refining lead-containing materials

Method for separating electronic component from organic board

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Process for manufacturing sawing type leadless semiconductor packages

Semiconductor device and a manufacturing method of the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Arrangement of an electrical component placed on a substrate, and method for producing the same

Semiconductor device having a plastic housing and external connections and method for producing the same

Magnetic self-assembly for integrated circuit packages

Stack semiconductor package formed by multiple molding and method of manufacturing the same

Chip-packaging with bonding options having a plurality of package substrates

Die structure of package and method of manufacturing the same

MOSFET package

Semiconductor package with passive device integration

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

Semiconductor device and method for producing same

Semiconductor light emitting device

Low stress conductive adhesive

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Methods for assembling semiconductor devices and interposers

Method of manufacturing semiconductor device

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Inductor formed in an integrated circuit

Semiconductor device with a protected active die region and method therefor

Manufacturing method for electronic device

Semiconductor flip chip package having substantially non-collapsible spacer

Chip scale package having flip chip interconnect on die paddle

Semiconductor chip package and method of manufacture

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Encapsulation method for semiconductor device having center pad

Semiconductor package having double layer leadframe

Semiconductor device, electrode member and electrode member fabrication method

Systems and methods for power smoothing in power distribution

Electrical contact

Dual metal stud bumping for flip chip applications

Method of manufacturing semiconductor device and semiconductor device

Method for integrating an electronic component or similar into a substrate

Method of manufacturing an electronic device

Semiconductor component and method of manufacture

Method of manufacturing semiconductor device

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

Method of manufacturing an ink-jet assembly

Bonding apparatus

Resin sealing method for electronic part and mold used for the method

Semiconductor device with a number of bonding leads and method for producing the same

Semiconductor device

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

Copper bonding wire for semiconductor packaging

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Method to create flexible connections for integrated circuits

Trace design to minimize electromigration damage to solder bumps

Substrate assembly with direct electrical connection as a semiconductor package

Chip scale package with heat spreader

High frequency arrangement

Package structure with chip embedded in substrate

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device and unit equipped with the same

Semiconductor device with semiconductor chip mounted in package

Dual row leadframe and fabrication method

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device and manufacturing process therefor

Ball mounting method

Accurate relative alignment and epoxy-free attachment of optical elements

Apparatus and method for bonding wires

Wire bonding method

Semiconductor device with micro connecting elements and method for producing the same

Tools and methods for forming conductive bumps on microelectronic elements

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Bond pad structure for integrated circuit chip

Semiconductor device

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Component arrangement for series terminal for high-voltage applications

Semiconductor package with plated connection

Substrate for an FBGA semiconductor component

Semiconductor device and method of manufacturing the same

Ground arch for wirebond ball grid arrays

Three-dimensional circuit module and method of manufacturing the same

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor device and process for fabrication thereof

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

Method and system for transferring dies between surfaces

Stable electroless fine pitch interconnect plating

Method for interconnecting semiconductor components with substrates and contact means

Method for fabricating semiconductor packages with semiconductor chips

Manufacturing method of semiconductor device

Package or pre-applied foamable underfill for lead-free process

Semiconductor device and process for producing the same

Semiconductor module for making electrical contact with a connection device via a rewiring device

Semiconductor device and method of making the same

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Semiconductor device

High performance IC package and method

Structure and method for bonding an IC chip

Integrated circuits and interconnect structure for integrated circuits

Dissociated fabrication of packages and chips of integrated circuits

Semiconductor device and method of manufacturing the same

Interposers with flexible solder pad elements

Semiconductor device and fabrication method thereof

Wire bonding method

Capillary holder