Connection for off-chip electrostatic discharge protection

Semiconductor device having a copper plug

Die stacking system and method

Semiconductor device

Chip package and fabrication method thereof

SEMICONDUCTOR DEVICE

Embedded integrated circuit package system and method of manufacture thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Integrated circuit packaging system with protective coating and method of manufacture thereof

Lead frame and method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

FORMING A PROTECTIVE LAYER ON A MOLD AND MOLD HAVING A PROTECTIVE LAYER

Joining of parts via magnetic heating of metal-aluminum powders

Multi-chip module for battery power control

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Self locking and aligning clip structure for semiconductor die package

Low cost lead-free preplated leadframe having improved adhesion and solderability

Molded leadframe substrate semiconductor package

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Embedded chip package process

Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

Maintaining integrity of preloaded content in non-volatile memory during surface mounting

Power semiconductor module and method for operating a power semiconductor module

ELECTRONIC CIRCUIT WITH AN INDUCTOR

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

Printed wiring board and manufacturing method thereof

SEMICONDUCTOR DEVICE

Method for manufacturing a semiconductor component

Semiconductor device with interface peeling preventing rewiring layer

Back side metallization with superior adhesion in high-performance semiconductor devices

Flip-chip package covered with tape

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Flip chip interconnection with double post

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Semiconductor device with overlapped lead terminals

STACKED SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element

Mechanical coupling in a multi-chip module using magnetic components

Thermally enhanced low parasitic power semiconductor package

Package process and package structure

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

True CSP power MOSFET based on bottom-source LDMOS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and method for manufacturing same

Plating apparatus

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Method for forming a current distribution structure

Manufacturing method of semiconductor device

Fabrication method of semiconductor device having conductive bumps

Method for connecting integrated circuit chip to power and ground circuits

3D smart power module

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Fabrication method of semiconductor integrated circuit device

Method of fabricating a high-temperature compatible power semiconductor module

Method for integrating an electronic component into a printed circuit board

Component and method for producing a component

Device and manufacturing method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Assembly of multi-chip modules using sacrificial features

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of manufacturing same

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Embedded die package and process flow using a pre-molded carrier

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Integrated circuit packaging system with a leaded package and method of manufacture thereof

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Layered chip package

Method for manufacturing packaging structure

LOW COST DIE PLACEMENT

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Thermally improved semiconductor QFN/SON package

Resin-sealed semiconductor device and method of manufacturing the same

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via

Stackable wafer level package and fabricating method thereof

Method of attaching a solder ball and method of repairing a memory module

Printed wiring board and method for manufacturing the same

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

Protection layer for adhesive material at wafer edge

Process for producing a contact area of an electronic component

Wafer level integration module with interconnects

3D multiple die stacking

Robust FBEOL and UBM structure of C4 interconnects

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Delamination resistance of stacked dies in die saw

Semiconductor package

Protection layer for preventing UBM layer from chemical attack and oxidation

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate and package with micro BGA configuration

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Double-side mountable MEMS package

Method for manufacturing a microelectronic package comprising at least one microelectronic device

Non-volatile memory with reduced mobile ion diffusion

Semiconductor device and method of forming integrated passive device

Device package substrate and method of manufacturing the same

Fabrication for electroplating thick metal pads

Method of manufacturing a printed wiring board

Semiconductor wafer coat layers and methods therefor

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

BONDING WIRE

SEMICONDUCTOR DEVICE

Bonding metallurgy for three-dimensional interconnect

Mobility measuring apparatus, method therefor, and resistivity measuring apparatus and method therefor

Power semiconductor module

Semiconductor device and method of manufacturing the same

3-D MULTI-WAFER STACKED SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Die Package

Enhanced copper posts for wafer level chip scale packaging

Semiconductor device and manufacturing method therefor

Structure, method and system for assessing bonding of electrodes in FCB packaging

Semiconductor Chip with Stair Arrangement Bump Structures

Edge mounted integrated circuits with heat sink

Method for fabricating a semiconductor and semiconductor package

Semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

Wafer level packaged integrated circuit

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Method of manufacturing a through-hole electrode substrate

Arrangement for solder bump formation on wafers

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

Fabrication method of package structure

ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME

Integrated circuit with pins at multiple edges of a chip

Wafer-level molded structure for package assembly

Solder joint reliability in microelectronic packaging

Semiconductor device, and power conversion device using semiconductor device

Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm

Semiconductor package with its surface edge covered by resin

Semiconductor chip with contoured solder structure opening

Methods and structures for controlling wafer curvature

Integrated circuits having TSVs including metal gettering dielectric liners

Interconnect layouts for electronic assemblies

Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Front side copper post joint structure for temporary bond in TSV application

Self-aligned protection layer for copper post structure

Flip-Chip Package Structure

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer

Semiconductor device packaging structure

Off-chip vias in stacked chips

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor chip assembly with post/base heat spreader, signal post and cavity

Semiconductor apparatus with improved efficiency of thermal radiation

Power semiconductor device

Chip structure with bumps and testing pads

Method of joining a chip on a substrate

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film

Printed wiring board and method for manufacturing the same

Method for producing flexible integrated circuits which may be provided contiguously

Bonding method and bonding apparatus

Method of manufacturing semiconductor package

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Photosensitive adhesive

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Silicon carrier optoelectronic packaging

3D optoelectronic packaging

Electronic component

Electronic component and manufacturing method thereof

Semiconductor device

Semiconductor device having a wafer level chip size package structure

Layered chip for use in soldering

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Electronic part and method of manufacturing the same

3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport

Chip package and method for forming the same

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

Semiconductor apparatus and fabrication method thereof

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

Electronic device and method of manufacturing the same

Stacked packaging improvements

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Chip package with heavily doped region and fabrication method thereof

Electronic part and method of manufacturing the same

Chip package with heavily doped regions and fabrication method thereof

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal

Package structure

Die package and method of manufacturing the same

Chip package and fabrication method thereof

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

Flexible contactless wire bonding structure and methodology for semiconductor device

Semiconductor device layer structure and method of fabrication

Semiconductor device having semiconductor chip and metal plate

DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE

Semiconductor memory device and semiconductor memory card

Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method

Electronic component and manufacturing method thereof

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS

Room temperature metal direct bonding

Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Flip chip cavity package

Method for forming an electronic module having backside seal

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

Semiconductor device

Semiconductor device

Integrated circuit

Method of manufacturing semiconductor component, and semiconductor component

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Electronic device and manufacturing method therefor

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures

Method and package for circuit chip packaging

Semiconductor device

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Device including a ring-shaped metal structure and method

Electrically interconnected stacked die assemblies

Ball-grid-array package, electronic system and method of manufacture

Variable feature interface that induces a balanced stress to prevent thin die warpage

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Embedded semiconductor die package and method of making the same using metal frame carrier

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Wafer level package having cylindrical capacitor and method of fabricating the same

Support device for resonator

Method for bonding two electronic components

Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier

Structure and process for the formation of TSVs

Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

Method of manufacturing a semiconductor device

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

Edge connect wafer level stacking

Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME

Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Die stacking with an annular via having a recessed socket

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

MEMS and a protection structure thereof

Bond pad design for reducing the effect of package stress

Structures and methods for improving solder bump connections in semiconductor devices

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP

Semiconductor package requiring reduced manufacturing processes

Semiconductor devices having stress relief layers and methods for fabricating the same

Method of manufacturing a semiconductor device

Semiconductor device having an interposer

Semiconductor device including first and second carriers

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device and manufacturing method thereof

Metal trace fabrication for optical element

Method of manufacturing a printed wiring board

Method for manufacturing electronic device

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Method for insertion bonding and device thus obtained

Method for producing substrate for mounting device and method for producing a semiconductor module

Method of forming electrical connections

Semiconductor package

Low temperature wafer level processing for MEMS devices

System-in packages

Semiconductor device and programming method

Component arrangement and method for producing a component arrangement

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Stacked semiconductor chips

Multi-die package

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

METALLURGY FOR COPPER PLATED WAFERS

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Semiconductor package and package-on-package semiconductor device

Semiconductor device and method of forming wafer level ground plane and power ring

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Manufacturing method of semiconductor device and semiconductor device

Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

POWER SEMICONDUCTOR DEVICE