Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Method of fabricating a semiconductor device employing electroless plating

Hybrid module and method of manufacturing the same

Method for precision assembly of integrated circuit chip packages

Structure and method for self protection of power device

Driving circuit for a liquid crystal display device, method of manufacturing the same and display device having the same

Probe card assembly and kit

Stacked semiconductor device and method of manufacturing the same

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

Wiring board and semiconductor device

SEMICONDUCTOR PACKAGES HAVING IMMUNITY AGAINST VOID DUE TO ADHESIVE MATERIAL AND METHODS OF FABRICATING THE SAME

Multi-chip semiconductor package and method for fabricating the same

Package structure with circuits directly connected to semiconductor chip

METHODS AND APPARATUSES TO PRODUCE INLAYS WITH TRANSPONDERS

Method for fabrication of a conductive bump structure of a circuit board

Semiconductor device manufacturing method and manufacturing apparatus

Modular board device, high frequency module, and method of manufacturing the same

Bumping electronic components using transfer substrates

Stress free package and laminate-based isolator package

Thermal interconnect systems methods of production and uses thereof

Techniques for forming interconnects

PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

IC package reducing wiring layers on substrate and its chip carrier

SEMICONDUCTOR DEVICE

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Chip having side pad, method of fabricating the same and package using the same

Semiconductor device

Semiconductor device manufacturing method, semiconductor device, and wiring board

Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection

Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging

Zigzag-stacked package structure

STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Memory card and manufacturing method of the same

Semiconductor device including isolation layer

Pre-molded clip structure

SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT

SYSTEM AND METHOD FOR SOLDER BONDING

Low temperature bonding material comprising metal particles and bonding method

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Electrically conductive interconnect system and method

Semiconductor package and method of manufacturing the same

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor device and package including the same

Bump structure with annular support

System-in-package packaging for minimizing bond wire contamination and yield loss

Semiconductor device and programming method

Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Under bump metallurgy structure of a package and method of making same

MOSFET package

Semiconductor device and electronic device having the same

Printed circuit board

Power MOSFET wafer level chip-scale package

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Electric power semiconductor device

Highly conductive composition for wafer coating

INJECTION MOLDED SOLDER BALL METHOD

Semiconductor device and method for producing the same

Method and apparatus for providing thermal management on high-power integrated circuit devices

Ball grid array structures having tape-based circuitry

Semiconductor package, manufacturing method thereof and IC chip

Microelectronic component assemblies with recessed wire bonds and methods of making same

High power semiconductor package

Method for reduction of soft error rates in integrated circuits

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

METHOD FOR CHIP TO PACKAGE INTERCONNECT

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME

Method for fabricating semiconductor package

Method of making a semiconductor device having multiple die redistribution layer

Assembly of thin die coreless package

System and method for controlling an electrochemical etch process

B-stageable die attach adhesives

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

CHIP STACK WITH PRECISION ALIGNMENT, HIGH YIELD ASSEMBLY AND THERMAL CONDUCTIVITY

Dual molded multi-chip package system

Semiconductor device package having pseudo chips

Flip-chip packages allowing reduced size without electrical shorts and methods of manufacturing the same

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Method to reduce UBM undercut

Semiconductor components having through interconnects

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Wafer level package with die receiving through-hole and method of the same

Methods of forming stepped bumps and structures formed thereby

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Reducing underfill keep out zone on substrate used in electronic device processing

Package with a marking structure and method of the same

RF module package for releasing stress

RF module package

Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device

Wafer level package with die receiving through-hole and method of the same

Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages

Laterally Interconnected IC Packages and Methods

Multi-chips package and method of forming the same

Semiconductor package having leadframe with exposed anchor pads

Power device package

Structure of super thin chip scale package and method of the same

Stacked Printed Devices on a Carrier Substrate

Sensor module package structure and method of the same

Integrated circuits and interconnect structure for integrated circuits

Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Transfer assembly for manufacturing electronic devices

Bonding method and bonding material using metal particle

Methods of connecting an antenna to a transponder chip

Circuit board structure having embedded semiconductor element and fabrication method thereof

Semiconductor chip and method of manufacturing semiconductor chip

Fabrication for electroplating thick metal pads

Semiconductor device and method of forming passive devices

Thinned die integrated circuit package

Breakable interconnects and structures formed thereby

Chip mounting with flowable layer

Flip chip mounting method by no-flow underfill

Flip chip mounting method by no-flow underfill having level control function

Multilayer printed circuit board

Multilayer printed circuit board

Circuit board structure with embedded electronic components

Multilayer printed circuit board

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

System in package integrating a plurality of semiconductor chips

Voltage regulator integrated with semiconductor chip

Mounting structure for semiconductor element

Semiconductor device and method of protecting passivation layer in a solder bump process

Semiconductor device and manufacturing method of the same

Stacked die package with stud spacers

Stacked-die packages with silicon vias and surface activated bonding

METHOD FOR FABRICATING A CIRCUIT

Single mask via method and device

High surface area aluminum bond pad for through-wafer connections to an electronic package

Mounting method for semiconductor parts on circuit substrate

Semiconductor device

Heat dissipating chip structure and fabrication method thereof and package having the same

Microelectronic assemblies having compliancy and methods therefor

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of Manufacturing a Semiconductor Packages and Packages Made

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

Microelectronic packages having improved input/output connections and methods therefor

IC package encapsulating a chip under asymmetric single-side leads

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Multi-chip package

Process for making contact with and housing integrated circuits

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Wiring structure of printed wiring board and method for manufacturing the same

Printed wiring board

Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof

Semiconductor device and electronic device

Electric component having microtips and ductile conducting bumps

Top layers of metal for high performance IC's

Method for fabricating a circuit component

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

Method of manufacturing wafer level chip size package

Semiconductor package, manufacturing method thereof and IC chip

Semiconductor package for fine pitch miniaturization and manufacturing method thereof

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Printed circuit board

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Flip-chip mounting substrate

Three-dimensional integrated circuits with protection layers

DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Circuit device with at least partial packaging and method for forming

Three-dimensional package and method of making the same

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor assembly for improved device warpage and solder ball coplanarity

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LAYER OF SEMICONDUCTOR CHIP DIRECTLY CONTACTED WITH SUBSTRATE AND METHOD OF FABRICATING THE SAME

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Lead-frame circuit package

Method for the production of a soldered joint

Integrated Circuit Packaging Using Electrochemically Fabricated Structures

Printed circuit board

Manufacturing process of a carrier

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

Semiconductor device and fabrication method thereof

Semiconductor device

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Stacked die in die BGA package

Semiconductor package and method of manufacturing the same

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Method of bonding wire of semiconductor package

Structure and process for WL-CSP with metal cover

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device and method of manufacturing the same

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Function element and function element mounting structure

Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure

Packaged integrated circuit with enhanced thermal dissipation

High power semiconductor package and method of making the same

Semiconductor device

Semiconductor device with hollow structure

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

LDO regulator with ground connection through package bottom

Semiconductor component including a semiconductor chip and a passive component

Electrical/optical integration scheme using direct copper bonding

Amplifier chip mounted on a lead frame

Articles and assembly for magnetically directed self assembly and methods of manufacture

Fabrication method of semiconductor package and structure thereof

Semiconductor wafer

Test structure

Method for manufacturing an electrode and electrode component mounted body

METHOD OF MAKING A SOCKET TO PERFORM TESTING ON INTEGRATED CIRCUITS AND SOCKET MADE

Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device and manufacturing method of the same

Electroplating method for a semiconductor device

Semiconductor chip package and method for fabricating the same

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

Reverse build-up process for fine bump pitch approach

Microchip assembly including an inductor and fabrication method

Method of fabricating an electronic device

METHOD FOR FORMING RFID TAGS

Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Resin-sealed electronic device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Semiconductor device and method of manufacturing the same

Post passivation interconnection process and structures

Microcircuit package having ductile layer

Semiconductor device and manufacturing method thereof

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Intergrated Circuits Device Having a Reinforcement Structure

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

System-in-package (SiP) and method of manufacturing the same

Semiconductor device having elastic solder bump to prevent disconnection

Stress decoupling structures for flip-chip assembly

Stacked die package

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

Solid-state imaging device

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Light emitting device having a mirror portion

Producing SiC packs on a wafer plane

Flip-chip mounting resin composition and bump forming resin composition

Method of disposing and arranging dummy patterns

Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device

Adhesive composition, adhesive sheet and production process for semiconductor device

Gold/silicon eutectic die bonding method

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Silica nanoparticles thermoset resin compositions

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Rotation joint and semiconductor device having the same

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

Semiconductor device with no base member and method of manufacturing the same

Solder bump structure and method of manufacturing same

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

Semiconductor die with reduced bump-to-pad ratio

Systems and methods to passivate on-die redistribution interconnects

Chip and manufacturing method and application thereof

Semiconductor module with at least two substrates

SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION

Semiconductor Device And Production Method For Semiconductor Device

Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate

Top layers of metal for integrated circuits

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Method for manufacturing semiconductor device with reduced damage to metal wiring layer

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Use of palladium in IC manufacturing with conductive polymer bump

Method for manufacturing semiconductor device

Wire and solder bond forming methods

Wire and solder bond forming methods

WAFER SCALE THIN FILM PACKAGE

Method of packaging a semiconductor device and a prefabricated connector

Method of packaging a device using a dielectric layer

System that prevents reduction in data retention

Lithographic apparatus and method

Semiconductor device and method for manufacturing same

Self-aligned through vias for chip stacking

Method of packaging a device having a multi-contact elastomer connector contact area and device thereof

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Wafer level package with die receiving cavity and method of the same