Electronic assembly with detachable components

Power composite integrated semiconductor device and manufacturing method thereof

Connection structure and method for fabricating the same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Semiconductor device

Multi-chip module for battery power control

Semiconductor device and method of manufacturing the same

Component mounting method, component mounting apparatus, and ultrasonic bonding head

Printed wiring board with component mounting pin and electronic device using the same

Methods of forming metal layers using multi-layer lift-off patterns

Method of flip-chip mounting

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Solder bump confinement system for an integrated circuit package

Method of fabricating wafer level package

Nanoscale metal paste for interconnect and method of use

METHOD OF INSPECTING LAMINATED ASSEMBLY AND METHOD OF INSPECTING HEAT SPREADER MODULE

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

CHIP CONNECTOR

Semiconductor device having a bump formed over an electrode pad

Plurality of devices attached by solder bumps

Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Substrate and method for mounting silicon device

Solder bump on a semiconductor substrate

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device

Module part

Stacked integrated circuit package system with face to face stack configuration

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Semiconductor device and manufacturing method thereof

Integrated circuit package system with leadfinger support

Interdigitated conductive lead frame or laminate lead frame for GaN die

Capacitor and manufacturing method thereof

Electronic module with stacked semiconductors

Bond capillary design for ribbon wire bonding

Component mounting method and component mounting apparatus

Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation

Solder composition and method of bump formation therewith

Method for forming multi-layer bumps on a substrate

Fabrication of an integrated circuit package

Method of packaging semiconductor die without lead frame or substrate

Composite interconnect structure using injection molded solder technique

Method of manufacturing semiconductor device

Thermal enhanced package

Probe For Semiconductor Devices

Power semiconductor component having chip stack

Semiconductor device having tin-based solder layer and method for manufacturing the same

Bonding pad structure

Wafer level chip scale package having a gap and method for manufacturing the same

Solder wall structure in flip-chip technologies

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Multi-chips module package and manufacturing method thereof

Semiconductor device

Wafer level package having floated metal line and method thereof

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Methods for fabricating stiffeners for flexible substrates

Tooling for coupling multiple electronic chips

Semiconductor apparatus manufacturing method

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Apparatus for solder crack deflection

Composite integrated device and methods for forming thereof

Semiconductor interconnect having adjacent reservoir for bonding and method for formation

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Semiconductor memory card

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit package system

Semiconductor device having flange structure

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device, method of manufacturing the same, and camera module

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Multi-chip stack package and fabricating method thereof

Electronic component and method for its assembly

Method of forming a microelectronic package and microelectronic package formed according to the method

Interconnection pattern design

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP

Semiconductor package and fabricating method thereof

Substrate and semiconductor device

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device having alignment post electrode and method of manufacturing the same

WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME

Thermally enhanced semiconductor package and method of producing the same

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadless lead-frame

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Semiconductor chip with bond area

Method and device for contacting semiconductor chips

Strip for integrated circuit packages having a maximized usable area

Back-to-front via process

Semiconductor device package and method for manufacturing same

Adhesion method using gray-scale photolithography

Method for fabricating semiconductor package with build-up layers formed on chip

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Semiconductor device having a plurality of semiconductor constructs

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Method for manufacturing mold type semiconductor device

Thermally balanced via

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Electrical connections made with dissimilar metals

Electronic device and method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Electronic circuit package

Integrated circuit package-in-package system

Multi-chip package system

Circuit board and electronic assembly

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Method for gluing a circuit component to a circuit substrate

Method and system to define multiple metrology criteria for defect screening of electrical connections

Interconnect circuitry, multichip module, and methods of manufacturing thereof

System and method for solder bumping using a disposable mask and a barrier layer

PACKAGE WARPAGE CONTROL

Clipless and wireless semiconductor die package and method for making the same

Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Face down type semiconductor device and manufacturing process of face down type semiconductor device

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Package structure and manufacturing method thereof

Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same

Methods including fluxless chip attach processes

Super high-density module with integrated wafer level packages

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Low stress stacked die packages

Dual die package with high-speed interconnect

Electrical ground method for ball stack package

Multichip leadframe package

Test pads on flash memory cards

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Electronic part mounting method

System, apparatus, and method for advanced solder bumping

System and method for flip chip substrate pad

Object and bonding method thereof

Nanostructure-based package interconnect

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Compliant terminal mountings with vented spaces and methods

Electrical connection methods employing corresponding, insulator-coated members of interconnection elements

Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

System to wirebond power signals to flip-chip core

Chip packaging structure without leadframe

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Super high-density module with integrated wafer level packages

Techniques for packaging multiple device components

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Microelectronic elements with compliant terminal mountings and methods for making the same

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Electronic package with integral electromagnetic radiation shield and methods related thereto

Compliant terminal mountings with vented spaces and methods

Semiconductor device

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Method for mounting chip component and circuit board

Carbon nanotubes solder composite for high performance interconnect

Methods of fabricating interconnects for semiconductor components

Wafer structure and bumping process

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Method of manufacturing mounting substrate

Ribbon bonding in an electronic package

Wire bonding system and method of use

Method of manufacturing semiconductor device

Method of producing a semiconductor device, and wafer-processing tape

Chip on a board

Wafer-level flipchip package with IC circuit isolation

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Semiconductor device

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Semiconductor device and manufacturing method of the same

Structure of circuit board and method for fabricating same

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device with thermoplastic resin to reduce warpage

Semiconductor package structure and method of manufacture

ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

Adhesive for bonding circuit members, circuit board and process for its production

Paste coater and PoP automatic mounting apparatus employing the same

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Wireless communication system

Combination quad flat no-lead and thin small outline package

Method for mounting bumps on an under metallurgy layer

Integrated circuit having bond pad with improved thermal and mechanical properties

Space-efficient package for laterally conducting device

Method for embedding dies

Chip module and method for producing a chip module

Die-attaching paste composition and method for hardening the same

Printed circuit board having embedded electronic components and manufacturing method thereof

Semiconductor device and mold for resin-molding semiconductor device

Electrical microfilament to circuit interface

METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE

Semiconductor component having plate, stacked dice and conductive vias

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Thermal enhanced upper and dual heat sink exposed molded leadless package

Microelectronic devices having a curved surface and methods for manufacturing the same

Copper plating connection for multi-die stack in substrate package

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

High temperature package flip-chip bonding to ceramic

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Method for manufacturing an electronic module, and an electronic module

Method and apparatus for mounting conductive ball

Method of fabricating electrical connection terminal of embedded chip

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Interconnect structure of an integrated circuit and manufacturing method thereof

Method and system for increasing yield of vertically integrated devices

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Sensor component and panel used for the production thereof

Method for packaging microelectronic devices

Electronic circuit device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor element, production process thereof, semiconductor laser and production process thereof

Mounting flexible circuits onto integrated circuit substrates

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Chip package structure

Leadless semiconductor package and method of manufacture

Semiconductor components having through wire interconnects (TWI)

Semiconductor device and method for manufacturing same, and semiconductor wafer

Light emitting device

LIGHT EMITTING DEVICE AND MANUFACTURE METHOD THEREOF

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Interconnect assemblies and methods

Semiconductor devices with conductive clips

Conductive ball arraying apparatus

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Semiconductor device manufacturing method

Circuit under pad structure and bonding pad process

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

System and method for separating and packaging integrated circuits

Individualized low parasitic power distribution lines deposited over active integrated circuits

Dicing and die bonding adhesive tape

Flip chip hermetic seal using pre-formed material

Intermediate connection for flip chip in packages

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor packages having leadframe-based connection arrays

Pin-type chip tooling

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Low cost bonding pad and method of fabricating same

Two-step high bottleneck type capillary for wire bonding device

Power module

Wiring board, electronic component mounting structure, and electronic component mounting method

Multilayer circuit board and method for manufacturing the same

Inductive Heating of Microelectronic Components

Structure of bumps forming on an under metallurgy layer and method for making the same

Semiconductor device having align mark layer and method of fabricating the same

Methods for fabricating protective layers on semiconductor device components

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Semiconductor Device with Improved Stud Bump

Low Profile Stacking System and Method

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Output amplifier structure with bias compensation

Semiconductor package structure and method of manufacture

Hybrid solder pad

Semiconductor device and method of manufacturing the same

Power semiconductor circuit with busbar system

Alloys for flip chip interconnects and bumps