Interconnecting element between semiconductor chip and circuit support and method

Semiconductor package form within an encapsulation

Rotary chip attach

Low Profile Stacking System and Method

Semiconductor device having a heat spreader exposed from a seal resin

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Integrated circuit package system with bump pad

SEMICONDUCTOR DEVICE

Flip-chip light emitting diode device without sub-mount

Semiconductor die package using leadframe and clip and method of manufacturing

Method and device to elongate a solder joint

Circuit board and its manufacturing method

Method and device for connecting chips

Method for producing and cleaning surface-mountable bases with external contacts

Semiconductor assembly having substrate with electroplated contact pads

Damascene patterning of barrier layer metal for C4 solder bumps

Method and apparatus for attaching solder balls to substrate

Wafer redistribution structure with metallic pillar and method for fabricating the same

Method of forming a leaded molded array package

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Manufacturing method of wiring board and manufacturing method of semiconductor device

Method of manufacturing a semiconductor device

SOLDER BALL EXCELLENT IN MICRO-ADHESION PREVENTING PROPERTIES AND WETTING PROPERTIES AND METHOD FOR PREVENTING THE MICRO-ADHESION OF SOLDER BALLS

INTEGRATED CIRCUIT PACKAGE SYSTEM

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Wafer level chip scale packaging structure and method of fabricating the same

Semiconductor device and method for manufacturing the same

Package and package module of the package

Integrated circuit package system with downset lead

Bonding pad with high bonding strength to solder ball and bump

Microelectronic connection component

Chip structure and manufacturing method of the same

EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF

Semiconductor device

Semiconductor device

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Wafer level package having redistribution interconnection layer and method of forming the same

Etched leadframe flipchip package system

Semiconductor device

Semiconductor chip having bond pads

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Method for pressure bonding and method for manufacturing semiconductor device

Joining method and joining device

Electrical interconnection structure formation

Small chips with fan-out leads

Bonding a non-metal body to a metal surface using inductive heating

Method of fabricating multi layer MEMS and microfluidic devices

Semiconductor device, fabrication method therefor, and film fabrication method

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Packaging methods

Photosensitive composition

Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same

Liquid epoxy resin composition

Liquid epoxy resin composition

Semiconductor device integrated with optoelectronic components

Mm-wave antenna using conventional IC packaging

Constant voltage diode

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Method for making stacked integrated circuits (ICs) using prepackaged parts

WIRE EMBEDDED BRIDGE

Printed circuit board, electronic device, and manufacturing method for printed circuit board

Method for forming multi-layer bumps on a substrate

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device

Manufacturing method for magnetic sensor and lead frame therefor

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Method for producing through-contacts and a semiconductor component with through-contacts

Method of making stacked die package

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Device for making an in-mold circuit

Junction structure for a terminal pad and solder, and semiconductor device having the same

Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same

Semiconductor package and substrate structure thereof

Electronic component, module, module assembling method, module identification method and module environment setting method

Semiconductor device with inclined through holes

Semiconductor device and manufacturing method of the same

Printed wiring board

Semiconductor device with solder balls having high reliability

Semiconductor device featuring electrode terminals forming superior heat-radiation system

Contact pad structure for flip chip semiconductor die

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Back-face and edge interconnects for lidded package

Multilayered circuit substrate with semiconductor device incorporated therein

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Integrated circuit package system including high-density small footprint system-in-package

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

Packaging for high speed integrated circuits

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Method for mounting electronic component

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Semiconductor device packaging for avoiding metal contamination

Semiconductor component and method for production of a semiconductor component

Semiconductor device and method for producing the same

Semiconductor package with controlled solder bump wetting

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Integrated chip device in a package

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Housed DRAM chip for high-speed applications

Production process for manufacturing such semiconductor package

Electronic module and method of assembling the same

Thin package system with external terminals

Semiconductor device with a dummy electrode

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Light emitting diode chip with reflective layer thereon

Adhesive composition and sheet having an adhesive layer of the composition

Method for forming solder contacts on mounted substrates

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

Method of producing image display unit

Method for forming bumps

Wafer structure with electroless plating metal connecting layer and method for fabricating the same

Etchant and method for forming bumps

Method for forming improved bump structure

Method of improving power distribution in wirebond semiconductor packages

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Circuit board structure of integrated optoelectronic component

Method for manufacturing semiconductor module using interconnection structure

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

Method for manufacture of wafer level package with air pads

Semiconductor device having a semiconductor chip, and method for the production thereof

Chip packaging process

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Chip scale power LDMOS device

Method for producing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate

Semiconductor chip and method of manufacturing semiconductor chip

Semiconductor device and fabrication method thereof

Power semiconductor module with overcurrent protective device

Conductor substrate, semiconductor device and production method thereof

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Semiconductor assembly for improved device warpage and solder ball coplanarity

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Low stress conductive polymer bump

Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Hybrid module and method of manufacturing the same

SEMICONDUCTORS AND METHODS OF MAKING

Semiconductor chip having a bump with conductive particles and method of manufacturing the same

Bump structure and its forming method

Intermetallic solder with low melting point

Wafer level laser marking system for ultra-thin wafers using support tape

Electronic apparatus

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor module having a coupling substrate, and methods for its production

Semiconductor packaging process and carrier for semiconductor package

Semiconductor package having an interfacial adhesive layer

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Microelectronic packages and methods therefor

Wiring board and capacitor

Chip embedded packaging structure

Contact carriers (tiles) for populating larger substrates with spring contacts

Method and apparatus for facilitating proximity communication and power delivery

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Wiring board

Semiconductor chip and semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Ultra-thin wafer system and method of manufacture thereof

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Semiconductor package

Semiconductor device for radio frequency applications and method for making the same

Semiconductor device and radiation detector employing it

Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices

Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die

Attachment system incorporating a recess in a structure

Semiconductor device and method for manufacturing the same

Method for separating package of WLP

Methods for protecting metal surfaces

Contacts to microdevices

Semiconductor device with improved design freedom of external terminal

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Component with chip through-contacts

Semiconductor device having shield structure

Packaged die on PCB with heat sink encapsulant and methods

Semiconductor IC-embedded substrate and method for manufacturing same

Bumpless chip package and fabricating process thereof

Integrated circuit solder bumping system

Power semiconductor module with MOS chip

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Semiconductor device with a resin-sealed optical semiconductor element

Electric contact and method for producing the same and connector using the electric contacts

Semiconductor device and a method of manufacturing the same

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Method of electrically connecting a microelectronic component

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Method of forming a semiconductor device

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Chip package structure and bumping process

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Chip package structure and bumping process

Electronic assembly that includes pads having a bowl shaped upper section

Semiconductor apparatus integrating an electrical device under an electrode pad

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

Flexible assembly of stacked chips

Semiconductor package with a support structure and fabrication method thereof

Multiple chip semiconductor package

Semiconductor chip having bond pads

Semiconductor device having metallic plate with groove

Semiconductor chip having bond pads and multi-chip package

Semiconductor package film having reinforcing member and related display module

Structure of IC packaging and method forming the same

Semiconductor component and method of assembling the same

Power semiconductor device and method therefor

Component mounting method and component-mounted body

Semiconductor device and automotive AC generator

Bonding structure with buffer layer and method of forming the same

METHODS OF FABRICATING AND USING SHAPED SPRINGS

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

Integrated die bumping process

Multi-chip stack structure

Metal duplex method

Support with solder ball elements and a method for populating substrates with solder balls

Chip structure and chip package structure

Flip-chip packaging process using copper pillar as bump structure

Metal duplex method

Protective barrier layer for semiconductor device electrodes

Semiconductor device and manufacturing method thereof

Electronic device and method of manufacturing same

Semiconductor chip package and method of manufacturing the same

Encapsulated electronic part packaging structure

Semiconductor device having a probing region

Low height vertical sensor packaging

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Die pad for semiconductor packages and methods of making and using same

Stack type package module and method for manufacturing the same

Quinolinols as fluxing and accelerating agents for underfill compositions

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Method of fabricating a chip

Bumping process and structure thereof

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Chip package structure and method for manufacturing bumps

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Methods for forming through-wafer interconnects and structures resulting therefrom

Stacked chip package using photosensitive polymer and manufacturing method thereof

Radiant energy heating for die attach

Multi-chip package type semiconductor device

Microfeature workpieces, carriers, and associated methods

Wafer-level package and IC module assembly method for the wafer-level package

Conductive through via process for electronic device carriers

Device transferring method, and device arraying method

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Chip package and bump connecting structure thereof

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Method for forming a double embossing structure

Ball grid array interface structure and method

Alpha particle shields in chip packaging

Lead-containing solder bumps

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Lead-containing solder paste

Lead-containing anodes

Stacked chip package using warp preventing insulative material and manufacturing method thereof

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Copper bump barrier cap to reduce electrical resistance

Wafer integrated rigid support ring

Wiring board construction including embedded ceramic capacitors(s)

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Quad flat pack (QFP) package and flexible power distribution method therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Semiconductor device with reduced thickness of the semiconductor substrate