Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure

Semiconductor device and method of manufacturing the same

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

Integrated circuit device

Chip package and package process thereof

Method for producing semiconductor device and semiconductor device

Methods and apparatus for high-density chip connectivity

Ternary alloy column grid array

Two layer substrate ball grid array design

Encapsulated chip scale package having flip-chip on lead frame structure and method

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method of packaging and interconnection of integrated circuits

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Method of packaging and interconnection of integrated circuits

Semiconductor power component with a vertical current path through a semiconductor power chip

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Semiconductor device

MOSFET package

MOSFET package

High current semiconductor device system having low resistance and inductance

Bi-directional switch, and use of said switch

Semiconductor connection component

Power semiconductor packaging method and structure

Integrated circuit device

3D IC method and device

Tin-silver solder bumping in electronics manufacture

Semiconductor device and a manufacturing method of the same

Semiconductor package with contact support layer and method to produce the package

Method and apparatus for flip-chip bonding

Method And Device For Enhancing Solderability

Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly

Semiconductor device, laminated semiconductor device, and wiring substrate

Bonded structure and bonding method

Tier structure with tier frame having a feedthrough structure

Semiconductor device with improved contacts

Printed circuit board and electronic apparatus including printed circuit board

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Stack structure with semiconductor chip embedded in carrier

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Semiconductor device electronic component, circuit board, and electronic device

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Semiconductor assembly and packaging for high current and low inductance

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Packaged integrated circuit having a heat spreader and method therefor

Solder composition for electronic devices

Display device having an anisotropic-conductive adhesive film

Chip packaging structure without leadframe

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit with low-stress under-bump metallurgy

Chip-sized flip-chip semiconductor package and method for making the same

Power plane design and jumper wire bond for voltage drop minimization

Semiconductor device

Fluxless bumping process

Metal pad or metal bump over pad exposed by passivation layer

No flow underfill device and method

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Methods of bonding two semiconductor devices

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Semiconductor device and method of manufacturing the same

Flip chip package with reduced thermal stress

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

Self-assembled interconnection particles

Semiconductor package with ferrite shielding structure

Integrated circuit chip and integrated device

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Semiconductor device having capacitors for reducing power source noise

Semiconductor device and manufacturing method thereof

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Packaged integrated circuit with enhanced thermal dissipation

IC with on-die power-gating circuit

Method and system for customized radio frequency shielding using solder bumps

Method for modifying surface of substrate and method for manufacturing semiconductor device

Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device

Electrical connections in substrates

Methods for forming flexible column die interconnects and resulting structures

Method of forming solder bump with reduced surface defects

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Self alignment features for an electronic assembly

Forming of conductive bumps for an integrated circuit

Method of forming a connecting conductor and wirings of a semiconductor chip

Method for forming high reliability bump structure

Semiconductor device and a method of manufacturing the same

Process for exposing solder bumps on an underfill coated semiconductor

Circuit board structure integrated with semiconductor chip and method of fabricating the same

Method and apparatus for attaching microelectronic substrates and support members

Method of manufacturing electronic circuit device

IC chip mounting method

Device, system and electric element

Integrated circuit pad with separate probing and bonding areas

Relay board with bonding pads connected by wirings

Connection element for a semiconductor component and method for producing the same

Method and apparatus for attaching microelectronic substrates and support members

Stress and force management techniques for a semiconductor die

Wafer-level-chip-scale package and method of fabrication

Reduced inductance in ball grid array packages

Wafer level package and its manufacturing method

Multi-component integrated circuit contacts

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Electronic component and electronic configuration

Packaging for high speed integrated circuits

Composite metal column for mounting semiconductor device

Stacked semiconductor package having adhesive/spacer structure and insulation

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus

Process for making a semiconductor device having a roughened surface

Fabrication method of semiconductor circuit device

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

Method for forming bump protective collars on a bumped wafer

Method for mounting electronic element on a circuit board

Semiconductor device and method of manufacturing thereof

Bumped die and wire bonded board-on-chip package

Method and structure for reduction of soft error rates in integrated circuits

Electronic component unit

Semiconductor device and electronic apparatus of multi-chip packaging

Self alignment features for an electronic assembly

Semiconductor device

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Semiconductor power module with SiC power diodes and method for its production

Tape wiring substrate and chip-on-film package using the same

Electronic parts packaging structure and method of manufacturing the same

Package substrate and semiconductor package using the same

Micro-package, multi-stack micro-package, and manufacturing method therefor

Integrated circuit for driving semiconductor device and power converter

Wire-bonding method and semiconductor package using the same

Structure and method for producing multiple size interconnections

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Semiconductor package having dual interconnection form and manufacturing method thereof

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

Seedless wirebond pad plating

Ball grid array package enhanced with a thermal and electrical connector

Surface mount package

Method of manufacturing a passive integrated matching network for power amplifiers

Electronic assembly and method for producing an electronic assembly

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Chip and multi-chip semiconductor device using the chip, and method for manufacturing same

Bonding apparatus and method

Semiconductor device with semiconductor device components embedded in a plastics composition

Soldering a die to a substrate

Semiconductor device

Method of interconnecting terminals and method of mounting semiconductor devices

Thermal interface material with carbon nanotubes and particles

Semiconductor device and manufacturing method of the same

Under bump metallization design to reduce dielectric layer delamination

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Semiconductor die package and method for making the same

Semiconductor device and package, and method of manufacturer therefor

Semiconductor device

Bonding apparatus and method

Assembly method for semiconductor die and lead frame

Apparatus and method to operate on one or more attach sites in die package assembly

Cure catalyst, composition, electronic device and associated method

Circuitry component and method for forming the same

Ultrathin semiconductor circuit having contact bumps

Methods for bonding and micro-electronic devices produced according to such methods

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Three dimensional device integration method and integrated device

Stacked die in die BGA package

Manufacturing method for packaged semiconductor device

Grid array connection device and method

Mounting and adhesive layer for semiconductor components

Semiconductor integrated circuit device

Mechanical integrity evaluation of low-k devices with bump shear

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor half-bridge module with low inductance

Method of embedding semiconductor chip in support plate

Semiconductor device and method for manufacturing the same

Interconnect vias and associated methods of formation

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method of the same

Intrinsic thermal enhancement for FBGA package

Packaging logic and memory integrated circuits

Lead-free semiconductor package

Alignment using fiducial features

Reliable integrated circuit and package

Semiconductor device

Conductive interconnect structures and formation methods using supercritical fluids

Contact Structures Comprising A Core Structure And An Overcoat

Semiconductor wafer package and manufacturing method thereof

Breakable interconnects and structures formed thereby

Signal isolation in a package substrate

Semiconductor device and manufacturing method thereof

Substrate structure and the fabrication method thereof

Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Micro solder pot

Electronic board, method of manufacturing the same, and electronic device

Electronic board, method of manufacturing the same, and electronic device

Semiconductor device and circuit board

Low stress chip attachment with shape memory materials

Flip chip packaging using recessed interposer terminals

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Electronic component comprising a cooling surface

Wafer and single chip having circuit rearranged structure and method for fabricating the same

Power semiconductor module

Method of soldering or brazing articles having surfaces that are difficult to bond

Positioning flowable solder for bonding integrated circuit elements

Bond head link assembly for a wire bonding machine

Wiring board, method for manufacturing same, and semiconductor package

Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same

Remote chip attachment

Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier

Coaxial through chip connection

Post-attachment chip-to-chip connection

Tack & fuse chip bonding

Routingless chip architecture

Semiconductor device and method for manufacturing the same

Rigid-backed, membrane-based chip tooling

Through chip connection

Packaging method and package using the same

Chip-based thermo-stack

Probe card assembly and kit

Protected chip stack

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Substrate for pre-soldering material and fabrication method thereof

Integrated electronic chip and interconnect device and process for making the same

Chip spanning connection

Inverse chip connector

Chip connector

Post & penetration interconnection

Stack circuit member and method

Triaxial through-chip connection

Profiled contact

Chip capacitive coupling

Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump

Electronic chip contact structure

Patterned contact

Die stacking recessed pad wafer design

Electronic module with a conductive-pattern layer and a method of manufacturing same

Contact-based encapsulation

Bond capillary design for ribbon wire bonding

Membrane-based chip tooling

METHOD FOR FORMING BUMPS

Capping copper bumps

Nickel bonding cap over copper metalized bondpads

Microelectronic assemblies having low profile connections

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Silicon wafer with solderable coating on its wafer rear side, and process for producing it

Semiconductor device having reduced number of external pad portions

Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method

Assembly structure and method for chip scale package

Semiconductor device

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Source contact and metal scheme for high density trench MOSFET

Heating apparatus

Wiring board and method for manufacturing the same

Wiring board and manufacturing method of wiring board

Method of fabricating wiring board and method of fabricating semiconductor device

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Surface mount type semiconductor device and method of manufacturing the same

Method of forming overhang support for a stacked semiconductor device

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method of making semiconductor BGA package having a segmented voltage plane

Method for attaching dice to a package and arrangement of dice in a package

Semiconductor device and manufacturing method thereof

Method and circuit structure employing a photo-imaged solder mask

Nanotube materials for thermal management of electronic components

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

RFID tags and processes for producing RFID tags

Integrated-circuit die having redundant signal pads and related integrated circuit, system, and method

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Stackable tier structure comprising prefabricated high density feedthrough

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Semiconductor device having capacitive insulation means and communication terminal using the device

Power module package structure

Encapsulated power semiconductor assembly

Redistribution layer with microstrips

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Image sensitive electronic device packages

Semiconductor device

Method for efficiently producing removable peripheral cards

Solder joints for copper metallization having reduced interfacial voids

Circuit arrangement placed on a substrate and method for producing the same

Light emitting apparatus and method of manufacturing the same

Semiconductor bond pad structures and methods of manufacturing thereof

Soldering method, electronic part, and part-exchanging method

Multi-chip die bonder and method