Method of manufacturing semiconductor device and semiconductor device

Method for integrating an electronic component or similar into a substrate

Semiconductor component and method of manufacture

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Method to create flexible connections for integrated circuits

Trace design to minimize electromigration damage to solder bumps

Chip scale package with heat spreader

High frequency arrangement

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device and unit equipped with the same

Semiconductor package having improved adhesiveness and ground bonding

Dual row leadframe and fabrication method

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device

Ball mounting method

Accurate relative alignment and epoxy-free attachment of optical elements

Semiconductor device with micro connecting elements and method for producing the same

Semiconductor component sealed on five sides by polymer sealing layer

Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates

Semiconductor package and method for manufacturing the same

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Tools and methods for forming conductive bumps on microelectronic elements

Method of forming a wear-resistant dielectric layer

Current sensor

Semiconductor device

Semiconductor devices and in-process semiconductor devices having conductor filled vias

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Substrate for an FBGA semiconductor component

Semiconductor chip having solder bumps and dummy bumps

Contact structure and method for manufacturing the same

Fine pitch low cost flip chip substrate

Ground arch for wirebond ball grid arrays

Semiconductor device and process for fabrication thereof

Thin-film semiconductor component and production method for said component

Stable electroless fine pitch interconnect plating

Multilayer printed wiring board and method of manufacturing the same

Implantable, tissue conforming drug delivery device

Methods of adhering microfeature workpieces, including a chip, to a support member

Method for interconnecting semiconductor components with substrates and contact means

Method for fabricating semiconductor packages with semiconductor chips

Manufacturing method of semiconductor device

Semiconductor device and process for producing the same

Semiconductor module for making electrical contact with a connection device via a rewiring device

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

High performance IC package and method

Integrated circuits and interconnect structure for integrated circuits

Dissociated fabrication of packages and chips of integrated circuits

Interposers with flexible solder pad elements

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Semiconductor device and fabrication method thereof

Antenna designs for radio frequency identification tags

Compliant electrical contacts

Method of embedding semiconductor element in carrier and embedded structure thereof

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Chip-stacked semiconductor package and method for fabricating the same

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Novel method for copper wafer wire bonding

Bump structure of semiconductor device and method of manufacturing the same

Routing design to minimize electromigration damage to solder bumps

Chip scale package and method for manufacturing the same

Electronic device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Integrated circuit device having encapsulant dam with chamfered edge

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Apparatus and method for filling a ball grid array template

Molding tool and a method of forming an electronic device package

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Integrated circuit die connection methods and apparatus

High-density inter-die interconnect structure

Semiconductor device and method of fabricating the same

Structure and manufacturing method of a chip scale package

Semiconductor device

Spaced, bumped component structure

Semiconductor device and method of manufacturing a semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Package structure and fabrication method thereof

Chip on board leadframe for semiconductor components having area array

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Method and apparatus for forming a low profile wire loop

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

System-in-package wireless communication device comprising prepackaged power amplifier

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Substrate bump formation

Semiconductor device and manufacturing method thereof

Methods relating to forming interconnects

Under bump metallurgy in integrated circuits

Interconnection structure through passive component

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Flip-chip package structure with direct electrical connection of semiconductor chip

Semiconductor device and method for producing the same

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Fabrication method for chip size package and non-chip size package semiconductor devices

Low profile ball-grid array package for high power

Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Apparatus of clamping semiconductor devices using sliding finger supports

Printed-circuit board and circuit unit incorporating the circuit board

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Die paddle clamping method for wire bond enhancement

Semiconductor apparatus and manufacturing method

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Semiconductor chip stack package having dummy chip

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Multi-function card device

Wire clamping plate

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Integrated die bumping process

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Electronic parts packaging structure

Electronic device

BGA package substrate and method of fabricating same

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Semiconductor devices having post passivation interconnections and a buffer layer

Printed circuit board including embedded chips and method of fabricating the same using plating

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same

Method of manufacturing a semiconductor device

Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby

Plating apparatus and plating method

Packaging for electronic modules

Arrangement for energy conditioning

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Power semiconductor device

Semiconductor device package

Semiconductor integrated circuit device and method of manufacturing the same

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method therefor

Method for constructing contact formations

Wafer structure, chip structure, and fabricating process thereof

Method of marking a low profile packaged semiconductor device

Manufacturing method of semiconductor device

Method and system for performing die attach using a flame

Package that integrates passive and active devices with or without a lead frame

Methods of forming semiconductor packages

Power semiconductor package

Ball limiting metallurgy split into segments

Semiconductor device and manufacturing method therefor

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Methods of making and using a floating lead finger on a lead frame

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Method of manufacturing a semiconductor device

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Solder bump composition for flip chip

Method for re-routing lithography-free microelectronic devices

Package structure with embedded chip and method for fabricating the same

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Fabrication of stacked die and structures formed thereby

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD

Electronic component with a housing package

Housing for power semiconductor modules

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Multi-chip module

Method of making wafer level ball grid array

Flip chip package with anti-floating structure

Method for solder bumping, and solder-bumping structures produced thereby

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Metallization structure over passivation layer for IC chip

High density package interconnect wire bond strip line and method therefor

Semiconductor device

Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Semiconductor device and a method of manufacturing the same

Semiconductor package having improved adhesion and solderability

Forming of high aspect ratio conductive structure using injection molded solder

Method of packaging flip chip and method of forming pre-solders on substrate thereof

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Wireless communication system

Manufacturing method of chip integrated substrate

Three-dimensional device fabrication method

Methods for fabricating stiffeners for flexible substrates

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Fabricating stacked chips using fluidic templated-assembly

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor device and the method of producing the same

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Electronic component device

Semiconductor package and manufacturing method thereof

MSD raised metal interface features

Press pack power semiconductor module

Solder interconnect structure and method using injection molded solder

Epoxy-solder thermally conductive structure for an integrated circuit

Method of making a circuitized substrate

Method for fabricating semiconductor components with conductive vias

Bond pad for ball grid array package

Doped alloys for electrical interconnects, methods of production and uses thereof

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Microelectronic packages with solder interconnections

Semiconductor device

Semiconductor die attachment for high vacuum tubes

Microelectronic assemblies incorporating inductors

Method and apparatus for polymer dielectric surface recovery by ion implantation

Methods for aligning semiconductor fabrication molds and semiconductor substrates

Method and device for mounting electric component

Plating apparatus

Package for a semiconductor device

Forming an intermediate layer in interconnect joints and structures formed thereby

Method for removing resin mask layer and method for manufacturing solder bumped substrate

High surface area aluminum bond pad for through-wafer connections to an electronic package

Electronic device and manufacturing method of the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Solder for fabricating solder bumps and pumping process

Power module, and phase leg assembly

Probe arrays and method for making

Multi-chip package and method of fabricating the same

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same

Semiconductor chip package having an adhesive tape attached on bonding wires

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Method for mounting an electronic element on a wiring board

Power amplifier module

Die attach material for TBGA or flexible circuitry

Module substrate and disk apparatus

REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF

Socket grid array

Integrated circuit package system with heat slug

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Multi-chip package

Liquid metal droplet generator

Injection molded metal bonding tray for integrated circuit device fabrication

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Wire positioning and mechanical attachment for a radio-frequency indentification device

Semiconductor device

Semiconductor package device and method for fabricating the same

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Staggered wirebonding configuration

Semiconductor wafer with electrically connected contact and test areas

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Multi chip package

IC chip package with isolated vias

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having through electrode and method of manufacturing the same