212369 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Shape being other than a cuboid at the active surface
SEMICONDUCTOR PACKAGE
#2BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDUCED CRACKING AND METHODS OF MAKING THE SAME
#3PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP
#4INTEGRATED CIRCUIT PACKAGES AND METHODS
#5SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#6Package and method of forming same
#7DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#8SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE
#9Fluidic assembly encapsulating light emitting diodes
#10Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
#11Display device and method of manufacturing the same
#12Structure of micro light-emitting device and method of transferring micro light-emitting device
#13Semiconductor device and method of forming protective layer around cavity of semiconductor die
#14Electronic circuit connection method and electronic circuit
#15Display device and method of manufacturing the same
#16Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier
#17Encapsulated light emitting diodes for selective fluidic assembly
#18Semiconductor die singulation and structures formed thereby
#19Semiconductor device and method of forming embedded wafer level chip scale packages
#20Light-emitting diode and application therefor
#21Method for encapsulating emissive elements for fluidic assembly
#22Encapsulated emissive element for fluidic assembly
#23Elastic wave device
#24Negative fillet for mounting an integrated device die to a carrier
#25Encapsulated fluid assembly emissive elements
#26Semiconductor die singulation and structures formed thereby
#27Deformable closed-loop multi-layered microelectronic device
#28Method for transferring and placing a semiconductor device on a substrate
#29Terminal structure of a power semiconductor device
#30High-frequency circuit
#31Semiconductor packages having an electric device with a recess
#32Semiconductor die singulation and structures formed thereby
#33Semiconductor device and method of forming embedded wafer level chip scale packages
#34Semiconductor device that transfers an electric signal with a set of inductors
#35Connection pads for a fingerprint sensing device
#36Chip package and method for forming the same
#37Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#38Method of forming a transistor with an active area layout having both wide and narrow area portions and a gate formed over the intersection of the two
#39Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#40Kerf preparation for backside metallization
#41Preventing artifacts due to underfill in flip chip imager assembly
#42Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#43Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#44Method for manufacturing semiconductor light emitting device
#45Processes and structures for IC fabrication
#46Gas sensor package
#47Light-reflective anisotropic conductive adhesive agent, and light emitting device
#48Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#49LED package
#50Semiconductor packages having an electric device with a recess
#51Chip package and method for forming the same
#52Electronic component and electronic component cooling method
#53Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#54Method for preparing semiconductor devices applied in flip chip technology
#55Semiconductor device and method of forming embedded wafer level chip scale packages
#56Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
#57Encapsulating sheet-covered semiconductor element and semiconductor device
#58Electronic components assembly
#59Processes and structures for IC fabrication
#60Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#61Layout method to minimize context effects and die area
#62Semiconductor device and manufacturing method of the same
#63Light-reflective anisotropic conductive adhesive agent, and light emitting device
#64MEMS component and a semiconductor component in a common housing having at least one access opening
#65Light emitting diode (LED) devices, systems, and methods
#66Method and structure for wafer to wafer bonding in semiconductor packaging
#67Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#68ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE
#69SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#70Housing for an infrared radiation micro device and method for fabricating such housing
#71Substrate bonding with metal germanium silicon material
#72Semiconductor device and method for manufacturing the same
#73Stacked assembly including plurality of stacked microelectronic elements
#74Semiconductor device
#75Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#76Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure
#77ELECTRICAL CONTACT CONFIGURATION OF MICRO-ELECTROMECHANICAL COMPONENT AND FABRICATION METHOD
#78WIREBONDING PROCESS
#79GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#80METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE
#81Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers
#82Integrated-circuit package for proximity communication
#83ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES
#84Integrated circuit packaging system with cap layer and method of manufacture thereof
#85Edge mounted integrated circuits with heat sink
#86Method for manufacturing semiconductor device
#87Self-assembly of chips on a substrate
#88Processes and structures for IC fabrication
#89Methods for interconnecting bonding pads between components
#90Semiconductor package and method for producing the same
#91Processes and structures for IC fabrication
#92Processes for IC fabrication
#93Method of manufacturing an electronic device
#94Semiconductor package and manufacturing method of the semiconductor package
#95Light emitting element and fabricating method thereof
#96Semiconductor device having recess with varying width and method of manufacturing the same
#97Semiconductor device and manufacturing method of the same
#98Substrate bonding with metal germanium silicon material
#99Semiconductor device and method for manufacturing the same
#100Semiconductor device and manufacturing method thereof
#101SEMICONDUCTOR MODULE
#102Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
#103SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#104Electronic component assembly
#105Securing integrated circuit dice to substrates
#106Stacked semiconductor package with localized cavities for wire bonding
#107Method and apparatus for facilitating proximity communication and power delivery
#108Resin sealing structure for electronic component and resin sealing method for electronic component
#109Integrated circuit and method of fabricating the same
#110Semiconductor package and method of manufacturing the same
#111Semiconductor device having low dielectric constant film and manufacturing method thereof
#112Semiconductor device and manufacturing method thereof
#113Method of manufacturing wiring substrate and method of manufacturing semiconductor device
#114Semiconductor device
#115SEMICONDUCTOR DEVICE
#116SEMICONDUCTOR DEVICE
#117Flip chip bonded semiconductor device with shelf and method of manufacturing thereof
#118Method and system for providing an aligned semiconductor assembly
#119Method of packaging an LED array module
#120Method for manufacturing a stacked semiconductor package, and stacked semiconductor package
#121Integrated circuit package system including die having relieved active region
#122Alignment features for proximity communication
#123Integrated-circuit package for proximity communication
#124Multi-wavelength light-emitting module
#125Method of fabricating stacked assembly including plurality of stacked microelectronic elements
#126Semiconductor apparatus having side surface wiring
#127Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching
#128Semiconductor device package having a semiconductor element with a roughened surface
#129Silicon chip having inclined contact pads and electronic module comprising such a chip
#130SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE
#131Optical semiconductor device and method for fabricating the same
#132Semiconductor device and method of manufacturing semiconductor device
#133Semiconductor chip and method of producing the same
#134Method for manufacturing electronic component, and electronic component
#135Method for fabricating resin-molded semiconductor device having posts with bumps
#136System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#137Methods for packaging and sealing an integrated circuit die
#138Method and apparatus for precisely aligning integrated circuit chips
#139Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#140Integrated circuit package, panel and methods of manufacturing the same
#141Semiconductor package and method of manufacturing the same
#142Semiconductor package and method for producing the same
#143GaAs integrated circuit device and method of attaching same
#144SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#145Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
#146Semiconductor device with surface-mountable external contacts and method for manufacturing the same
#147Method for fabricating a chip scale package using wafer level processing
#148Semiconductor die structure featuring a triple pad organization
#149Electronic member fabricating method and ic chip with adhesive material
#150Light emitting device
#151Methods for fabricating protective layers on semiconductor device components
#152Chip and package structure
#153Constant voltage diode
#154Optical imaging device for optical proximity communication
#155Resonator system for optical proximity communication
#156Method and apparatus for facilitating proximity communication and power delivery
#157CHIP PACKAGE STRUCTURE
#158Semiconductor device with a resin-sealed optical semiconductor element
#159Manufacturing method for a semiconductor device
#160Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
#161Light-emitting device
#162Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#163Die structure of package and method of manufacturing the same
#164Light-emitting diode device and method of manufacturing thereof
#165Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#166Substrate for an FBGA semiconductor component
#167Encapsulated electronic component and production method
#168Circuit device with circuit board and semiconductor chip mounted thereon
#169Method for fabricating semiconductor components
#170Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#171Semiconductor attachment method
#172Method of fabricating semiconductor device
#173Metal pad of semiconductor device and method for bonding the metal pad
#174Substrate having built-in semiconductor apparatus and manufacturing method thereof
#175Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#176Package for sealing an integrated circuit die
#177Component mounting substrate and structure
#178Semiconductor device package having a semiconductor element with resin
#179Package structure with a retarding structure and method of making same
#180Resin-molded semiconductor device having posts with bumps and method for fabricating the same
#181Method for fabricating a chip scale package using wafer level processing
#182Semiconductor device
#183Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#184Semiconductor device structures including protective layers formed from healable materials
#185UBM for fine pitch solder ball and flip-chip packaging method using the same
#186System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#187Semiconductor device and manufacturing method thereof
#188Optical semiconductor device and method for fabricating the same
#189Semiconductor chip, semiconductor device, circuit board, and electronic instrument
#190Package structure with a retarding structure and method of making same
#191Substrate having built-in semiconductor apparatus and manufacturing method thereof
#192Encapsulated component which is small in terms of height and method for producing the same
#193Semiconductor device and method of manufacturing the same
#194Power supply device
#195Method for manufacturing semiconductor device
#196High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same
#197Method of producing circuit component built-in module with embedded circuit component
#198System and method for increasing the strength of a bond made by a small diameter wire in ball bonding