212370 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Shape being other than a cuboid at the passive surface
Semiconductor device and semiconductor module therewith
#302Silicon carbide dimpled substrate
#303Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
#304Semiconductor constructions and semiconductor device fabrication methods
#305PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#306Method for fabricating semiconductor device and apparatus for fabricating the same
#307Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#308Electronic device and method of manufacturing the same, circuit board, and electronic instrument
#309MICRO-FABRICATED DEVICE WITH THERMOELECTRIC DEVICE AND METHOD OF MAKING
#310Multi-die package and method for fabricating same
#311Vertical DMOS device in integrated circuit
#312Package having exposed integrated circuit device
#313Method and system for increasing yield of vertically integrated devices
#314Liquid metal thermal interface material system
#315Light emitting device
#316Method and apparatus for fabricating and connecting a semiconductor power switching device
#317Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#318Method of manufacturing a semiconductor device
#319Integrated circuit package system with arched pedestal
#320Single chip and stack-type chip semiconductor package and method of manufacturing the same
#321Ultrasonic welding head
#322Methods and apparatuses for fluidic self assembly
#323Encapsulation of a chip module
#324Methods and apparatuses relating to block receptor configurations and block assembly processes
#325Thermal contact arrangement
#326Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#327Semiconductor device
#328Method of forming a semiconductor device
#329Cooling system for a semiconductor device and method of fabricating same
#330Semiconductor chip package and method of manufacturing the same
#331Chip type led
#332Thin IC package for improving heat dissipation from chip backside
#333Apparatuses and methods facilitating functional block deposition
#334Large die package structures and fabrication method therefor
#335Apparatuses and methods for forming assemblies
#336Method of fabricating a stacked die in die BGA package
#337Method of fabricating a stacked die in die BGA package
#338Stacked die in die BGA package
#339Manufacturing method for a semiconductor device
#340Method for forming wafer-level heat spreader structure and package structure thereof
#341Light-emitting diode and process for producing the same
#342Semiconductor package and method for forming the same
#343Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming
#344Thermal management of systems having localized regions of elevated heat flux
#345Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
#346Method for fabricating a semiconductor device having a heat radiation layer
#347Semiconductor device production method and semiconductor device
#348Printed wiring board and information processing apparatus
#349Packaged semiconductor device and method of manufacture using shaped die
#350Stacked die-in-die BGA package with die having a recess
#351Method of making a flexible substrate containing self-assembling microstructures
#352Chip package and fabricating method thereof
#353Semiconductor device and method of stacking semiconductor chips
#354Circuit device and manufacturing method thereof
#355Substrate for an FBGA semiconductor component
#356Semiconductor device
#357Light emitting device
#358Semiconductor light emitting element and semiconductor light emitting device
#359Photo-detection device and manufacturing method thereof
#360Assembly comprising functional devices and method of making same
#361Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate
#362Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
#363Semiconductor device and manufacturing method thereof
#364Semiconductor device comprising a memory portion and a peripheral circuit portion
#365Liquid metal thermal interface material system
#366Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
#367Cooling system for a semiconductor device and method of fabricating same
#368Method and apparatus for fabricating and connecting a semiconductor power switching device
#369Multiple die stack apparatus employing t-shaped interposer elements
#370Multiple die stack apparatus employing T-shaped interposer elements
#371Thermal management of systems having localized regions of elevated heat flux
#372Acceleration sensor chip package
#373Increasing the adhesion of an adhesive connection in housings
#374Non-contact ID card and the like and method for manufacturing same
#375Semiconductor device mounting structure for reducing thermal stress and warpage
#376Semiconductor device and method for fabricating the same
#377Structures and methods for heat dissipation of semiconductor integrated circuits
#378Integrated circuit with increased heat transfer
#379QFN package and method therefor
#380Semiconductor attachment method
#381Method of fabricating semiconductor device
#382Methods and apparatuses relating to block configurations and fluidic self-assembly processes
#383Chip handling methods and apparatus
#384Integrated circuit die with pedestal
#385Highly compliant plate for wafer bonding
#386LED with substrate modifications for enhanced light extraction and method of making same
#387LED with substrate modifications for enhanced light extraction and method of making same
#388Circuit apparatus provided with asperities on substrate surface
#389Thermal interposer for thermal management of semiconductor devices
#390Thermal interposer for thermal management of semiconductor devices
#391Semiconductor device and semiconductor apparatus
#392Methods for making electronic devices with small functional elements supported on a carriers
#393Electronic devices with small functional elements supported on a carrier
#394Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#395Web fabrication of devices
#396Large die package structures and fabrication method therefor
#397Microelectronic assembly having variable thickness solder joint
#398Semiconductor device and method of manufacturing same
#399Light emitting nitride semiconductor device and method of fabricating the same
#400IC die with directly bonded liquid cooling device
#401Semiconductor package having step type die and method for manufacturing the same
#402Closed-loop microchannel cooling system
#403Semiconductor element and wafer level chip size package therefor
#404Apparatuses and methods for forming assemblies
#405Integrated circuit package with keep-out zone overlapping undercut zone
#406Multi-chip package including at least one semiconductor device enclosed therein
#407Semiconductor device assembly process
#408Packaged acoustic and electromagnetic transducer chips
#409Packaged acoustic and electromagnetic transducer chips
#410Optoelectronic arrangement
#411Method and apparatus for fabricating self-assembling microstructures
#412Semiconductor device with improved thermal characteristics
#413Light emitting diode with porous SiC substrate and method for fabricating
#414Semiconductor device configured for reducing post-fabrication damage
#415Chip packaging module with active cooling mechanisms
#416Method for fabricating semiconductor device and apparatus for fabricating the same
#417Semiconductor device
#418Method of manufacturing a semiconductor device
#419Local reduction of compliant thermally conductive material layer thickness on chips
#420Self-aligned electrodes contained within the trenches of an electroosmotic pump
#421Semiconductor chip, semiconductor device, circuit board, and electronic instrument
#422Substrate-based package for integrated circuits
#423Semiconductor element, semiconductor device, and method for manufacturing semiconductor element
#424Semiconductor light emitting diode and method for manufacturing the same
#425Material handling system with dynamic source tagging
#426Electroosmotic microchannel cooling system
#427Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
#428Single chip and stack-type chip semiconductor package and method of manufacturing the same
#429Cooling system for a semiconductor device and method of fabricating same
#430Head assembly, disk unit, and bonding method and apparatus
#431Semiconductor dice with edge cavities
#432Stacked chip package having upper chip provided with trenches and method of manufacturing the same
#433Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
#434CSP semiconductor device having signal and radiation bump groups
#435Stacked mass storage flash memory package
#436Semiconductor device and method of manufacturing the same
#437Light-emitting semiconductor component
#438Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
#439Multiple die stack apparatus employing T-shaped interposer elements
#440Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
#441Fabrication method for stacked multi-chip package
#442Method of producing circuit component built-in module with embedded circuit component