Light emitting device and method of manufacturing the same

Termination structure for gallium nitride schottky diode

Light emitting device

Semiconductor light-emitting device

Semiconductor device that transfers an electric signal with a set of inductors

Light-emitting apparatus

Semiconductor package and method of manufacturing thereof

Reversible top/bottom MEMS package

Package support, fabrication method and LED package

Electronic component package including electronic component, metal member, and sealing resin

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Packaging for fingerprint sensors and methods of manufacture

Chip on flex optical subassembly

LED package structure

LED with internally confined current injection area

Discontinuous patterned bonds for semiconductor devices and associated systems and methods

Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

Semiconductor device and method of forming a thin wafer without a carrier

Rigid-flex electronic module

Methods of forming conductive and insulating layers

Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping

ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

Organic modified silicone resin composition

Optical coupling device having a drive circuit on a ground frame to drive a light emitting element on a power frame

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATION APPARATUS

LED packages and manufacturing method thereof

Methods and devices for fabricating and assembling printable semiconductor elements

Compact optoelectronic modules

Micro device transfer system with pivot mount

Method for coating conductive substrate with adhesive

Semiconductor device and a method of manufacturing the same

Methods and devices for fabricating and assembling printable semiconductor elements

Optoelectronic component, contact-making device, and optoelectronic subassembly

Display device

Light-emitting device

Tunable composite interposer

Semiconductor device and method of forming an embedded SoP fan-out package

Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP

Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package

Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages

Method for transfer of semiconductor devices

Wireless chip and electronic device having wireless chip

Fully molded peripheral package on package device

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Systems and Methods Utilizing Anisotropic Conductive Adhesives

SILICONE ADHESIVE

Mounting substrate and electronic device including the same

Light-emitting apparatus

Optoelectronic component and method for producing an optoelectronic component

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Composite substrate with alternating pattern of diamond and metal or metal alloy

Electrode connection structure and electrode connection method

Optoelectronic light-emitting component and leadframe assemblage

Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel

Circuit module and method of manufacturing the same

Substrate for mounting chip and chip package

Thermal management in electronic devices with yielding substrates

Printed three-dimensional (3D) functional part and method of making

Package carrier

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Method of manufacturing a semiconductor device including through silicon plugs

Adhesive and light-emitting device

Light emitting diode

Light-emitting device

Laser assisted transfer welding process

Reducing solder pad topology differences by planarization

Chip package and method for forming the same

Mass transfer tool manipulator assembly

Method for fabrication of an electronic module and electronic module

Method for producing an optoelectronic device

Ultraviolet reflective rough adhesive contact

Low-Temperature Bonding and Sealing With Spaced Nanorods

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS HAVING THE SAME

Light emitting device mount, leadframe, and light emitting apparatus

Light emitting device and method for manufacturing the same

Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance

Light emitting device and method for manufacturing the same

Thin film light emitting diode

Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)

Semiconductor device and method of forming the same

Electronic circuit comprising PN junction and schottky barrier diodes

Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal

P-n separation metal fill for flip chip LEDs

LED having vertical contacts redistributed for flip chip mounting

Semiconductor light emitting device

PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Light emitting diodes and a method of packaging the same

Method for integrating a light emitting device

Driving chip and display device

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Display device

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Using MEMS fabrication incorporating into LED device mounting and assembly

Light-emitting dies incorporating wavelength-conversion materials and related methods

Method of manufacturing a single light-emitting structure

Polymer powder, curable resin composition and cured material thereof

Semiconductor device and method comprising redistribution layers

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Wafer-level flip chip device packages and related methods

Wafer-level flip chip device packages and related methods

Light-emitting semiconductor component and method of producing light-emitting semiconductor components

Edge coupling alignment using embedded features

Lighting apparatus including an optoelectronic component

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device and method of adaptive patterning for panelized packaging

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Active matrix display panel with ground tie lines

Light-emitting device

Method for making a microelectronic assembly having conductive elements

Light emitting device and method of manufacturing the same

Method for fabricating electronic device package

Flexible LED device with wire bond free die

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Semiconductor device and method of manufacturing the same

LED with high thermal conductivity particles in phosphor conversion layer

Light source device having multiple LED chips of different thickness

Display device using semiconductor light emitting device

Light emitting device and method of manufacturing the same

Light emitting device and method for manufacturing light emitting device

Semiconductor device and method of manufacturing the same

Process for connecting joining parts

Semiconductor laser structure

Light emitting module

Light-emitting apparatus

Light emitting device and method for manufacturing the same

Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics

Self-similar and fractal design for stretchable electronics

Stretchable electronic systems with containment chambers

Full color LED module having integrated driver transistors

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device

Active LED module having integrated limiter

TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD

LED light-emitting device

Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping

Device electrode formation using metal sheet

Method for obtaining a bonding surface for direct bonding

Reflecting resin sheet, light emitting diode device and producing method thereof

Engineered-phosphor LED packages and related methods

Method for producing a plurality of optoelectronic components and optoelectronic component

Discontinuous patterned bonds for semiconductor devices and associated systems and methods

Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Light emitting device package

Methods for surface attachment of flipped active components

Circuit module and method of manufacturing the same

Method for manufacturing light emitting device and light emitting device

Mass transfer system

Thermal management in electronic devices with yielding substrates

Light emitting device having a metal film extending from the first electrode

Method for producing an optoelectronic semiconductor device, and optoelectronic semiconductor device

Optical semiconductor lighting apparatus

LED display with wavelength conversion layer

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Optoelectronic modules that have shielding to reduce light leakage or stray light

Integrated LED light-emitting device and fabrication method thereof

Light emitting diode display with redundancy scheme

Semiconductor device

Hot-melt type curable silicone composition for compression molding or laminating

Light emitting device

Semiconductor device and method of forming bump-on-lead interconnection

Three-terminal printed devices interconnected as circuits

Apparatus and method for electrostatic spraying or electrostatic coating of a thin film

Dicing wafers having solder bumps on wafer backside

Apparatus with light emitting or absorbing diodes

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Optoelectronic component with integrated protection diode and method of producing same

Manufacture of a circuit board and circuit board containing a component

Light emitting diode assembly and method for fabricating the same

Light-emitting diode and application therefor

Light-emitting diode and application therefor

Flexible display device and method for manufacturing the same

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Mounting method

Chromium/titanium/aluminum-based semiconductor device contact fabrication

Chip to dielectric waveguide interface for sub-millimeter wave communications link

Drive chip and display apparatus

Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring

Apparatus with light emitting diodes

Compliant micro device transfer head

Semiconductor device

Microelectronic device with integrated energy source

Optoelectronic package and method of manufacturing the same

Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same

Light-emitting diode and application therefor

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Dry-removable protective coatings

Metal electromagnetic interference (EMI) shielding coating along an edge of a ceramic substrate

Semiconductor light-emitting device

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

COF type semiconductor package and method of manufacturing the same

Light-emitting diode and method of fabricating the same

Optical apparatus having resin encased stacked optical and semiconductor devices

Optoelectronic component having chips and conversion elements

Method for producing a multiplicity of optoelectronic semiconductor components

Light emitting apparatus, illumination apparatus and display apparatus

Method of manufacturing light-emitting device and wiring substrate for light-emitting element

Semiconductor device

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

Package support, fabrication method and LED package

Bottom package having routing paths connected to top package and method of manufacturing the same

Semiconductor device

Fabrication method for microelectronic components and microchip inks used in electrostatic assembly

Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof

Multi-segment monolithic LED chip

Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration

Display device using semiconductor light emitting devices having different structures

Laser de-bond carrier wafer from device wafer

Protection circuit including vertical gallium nitride schottky diode and PN junction diode

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Electronic component package and method for manufacturing same

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

LED lighting apparatus formed by a printable composition of a liquid or gel suspension of diodes and methods of using same

LED lighting apparatus formed by a printable composition of a liquid or gel suspension of diodes and methods of using same

Silver paste composition and semiconductor device using same

Light-emitting device

LED package and manufacturing method

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Electronic component package and method for manufacturing the same

Assembly bonding

Anisotropic conductive adhesive

Organic light-emitting display apparatus and method of manufacturing the same

Methods for fabricating a plurality of optoelectronic devices from a wafer that includes a plurality of light detector sensor areas

Method of manufacturing semiconductor device

Semiconductor light-emitting device

Method of making the light source structure in flexible substrate

System, method, and computer program product for a cavity package-on-package structure

Semiconductor light emitting device

Stud bump and package structure thereof and method of manufacturing the same

Reversible top/bottom MEMS package

Optoelectronic system

LED with internally confined current injection area

Etch removal of current distribution layer for LED current confinement

Semiconductor device

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor device for transmitting electrical signals between two circuits

Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package

Semiconductor device and method of making embedded wafer level chip scale packages

Light emitting device and method for manufacturing the same

Molding method for COB-EUSB devices and metal housing package

Light emitting device

GaN based semiconductor light-emitting device and method for producing same

SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

Light emitting apparatus having at least one reverse-biased light emitting diode

Light-reflective anisotropic conductive adhesive and light-emitting device

Substrates with transferable chiplets

Light-emitting dies incorporating wavelength-conversion materials and related methods

Semiconductor device and method of manufacturing the same

Optoelectronic component and a method for manufacturing an optoelectronic component

Semiconductor package for III-nitride transistor stacked with diode

Light-emitting device including light-emitting diode element that is mounted on outer portion of electrode

Tunable composite interposer

Etched trenches in bond materials for die singulation, and associated systems and methods

Aluminum coated copper bond wire and method of making the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

High heat-radiant optical device substrate

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

Semiconductor device and method of forming wire bondable fan-out EWLB package

Lighting device and light source device

Aluminum coated copper ribbon

Adhesive composition and semiconductor device using same

Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV

Semiconductor device having metal patterns and piezoelectric patterns

III nitride semiconductor substrate, epitaxial substrate, and semiconductor device

Illuminating device

Optical sensor package

Gallium nitride devices

Method for manufacturing light distribution member, and method for manufacturing light emitting device

Methods for surface attachment of flipped active components

Fabrication methods of chip device packages

Heat spreading substrate with embedded interconnects

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Optical-semiconductor device and method for manufacturing the same

Light-emitting device and the method of manufacturing the same

Chip device packages and fabrication methods thereof

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Array substrate for mounting chip and method for manufacturing the same

Electronic component assembly apparatus

Wafer-level flip chip device packages and related methods

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

Carrier-bonding methods and articles for semiconductor and interposer processing

Method for mounting a chip and chip package

Light-emitting diode assembly and fabrication method thereof