Fabrication method of semiconductor integrated circuit device

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

System for improving flip chip performance

Method for bonding wafers to produce stacked integrated circuits

Reconfigured wafer alignment

Method for manufacturing capacitor embedded in interposer

Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication

FLMP buck converter with a molded capacitor and a method of the same

Method for producing an electronic module

Thee-dimensional integrated semiconductor device and method for manufacturing same

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND PACKAGING METHOD THEREOF

Flexible packaging for chip-on-chip and package-on-package technologies

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor constructions

Wire loop and method of forming the wire loop

Reducing stress between a substrate and a projecting electrode on the substrate

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Multi-die semiconductor package with heat spreader

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Double side cooled power module with power overlay

Semiconductor device

Integrated circuit package-in-package system and method for making thereof

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure

Semiconductor Carrier for Multi-Chip Packaging

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Packaging with Integrated Passive Componentry

WIRING MEMBER, METAL COMPONENT WITH RESIN AND RESIN SEALED SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THEM

Contact portion of wire and manufacturing method thereof

PRODUCTION OF INTEGRATED CIRCUITS COMPRISING DIFFERENT COMPONENTS

Electrical interconnect forming method

Electrical interconnect forming method

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Electrical interconnect structure

Method for manufacturing integrated circuit device having antenna conductors

Method of fabricating a semiconductor package with mold lock opening

Gold alloy wire for ball bonding

All optical fast distributed arbitration in a computer system device

Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same

Printed circuit board and method of manufacturing printed circuit board

Stacked device assembly with integrated coil and method of forming same

Semiconductor device

Integrated circuit for driving semiconductor device and power converter

Integrated circuit assemblies with alignment features and devices and methods related thereto

Wire bond interconnection

Integrated circuit packaging system with stacked die and method of manufacture thereof

Semiconductor device

System and method for stacked die embedded chip build-up

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Mounted body and method for manufacturing the same

Chip-scale packaging with protective heat spreader

Lead and lead frame for power package

Routable array metal integrated circuit package

Stacked integrated circuit package system and method for manufacturing thereof

Integrated circuit packaging system with flex tape and method of manufacture thereof

Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

Stress barrier structures for semiconductor chips

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Micro-fluidic injection molded solder (IMS)

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Depositing carbon nanotubes onto substrate

Method to build robust mechanical structures on substrate surfaces

Wireless communication device integrated into a single package

Method of manufacturing ball grid array type semiconductor device

Multi-surface IC packaging structures and methods for their manufacture

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Component-containing module

Electronic substrate, semiconductor device, and electronic device

Semiconductor device having shifted stacked chips

Electromigration-Resistant Flip-Chip Solder Joints

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

Semiconductor device

Stackable integrated circuit package system

Complete power management system implemented in a single surface mount package

Quad flat non-leaded package

Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Nitride crystal with removable surface layer and methods of manufacture

Chip capacitive coupling

MIM decoupling capacitors under a contact pad

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

Printed wiring board

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

LOW COST BONDING TECHNIQUE FOR INTEGRATED CIRCUIT CHIPS AND PDMS STRUCTURES

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit micro-module

Manufacturing method of glass-sealed package, and glass substrate

Stacked semiconductor devices including a master device

Integrated circuit package having integrated faraday shield

Multilayer wiring board and method for manufacturing the same

Module having a stacked magnetic device and semiconductor device and method of forming the same

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Wire bonding structure and method for forming same

Semiconductor device and method of forming through vias with reflowed conductive material

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Through-silicon via formed with a post passivation interconnect structure

Solder bump UBM structure

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Stack package

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Semiconductor Module, Terminal Strip, Method for Manufacturing Terminal Strip, and Method for Manufacturing Semiconductor Module

Systems and methods of tamper proof packaging of a semiconductor device

MULTI-CHIP PACKAGE

WIRE BOND CHIP PACKAGE

Electronic device

Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package

Reduced-crosstalk wirebonding in an optical communication system

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Method of manufacturing semiconductor device

Formation of solder bumps

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer

Method of manufacturing semiconductor devices

Multilayer wiring substrate and method for manufacturing the same

Pad interface circuit and method of improving reliability of the pad interface circuit

Semiconductor component having a stack of semiconductor chips and method for producing the same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor module, method for manufacturing semiconductor module, and portable device

Semiconductor device and semiconductor device mounted structure

Semiconductor device

Package-on-package system with through vias and method of manufacture thereof

Quad flat package with exposed common electrode bars

Chip package and manufacturing method thereof

Non-planar microcircuit structure and method of fabricating same

Electronic Device and Method of Manufacturing Same

Wire bonding method, wire bonding apparatus, and wire bonding control program

Wire bonding apparatus, record medium storing bonding control program, and bonding method

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

Process for placing, securing and interconnecting electronic components

Method of refining solder materials

Semiconductor device and method of manufacturing semiconductor device

Multi-component integrated circuit contacts

Semiconductor package formed within an encapsulation

Method of manufacturing a semiconductor package with fine pitch lead fingers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Method of manufacturing semiconductor device, and wire bonder

Method for manufacturing semiconductor

Method for fabricating semiconductor packages with discrete components

Chip assembly

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Gap capacitors for monitoring stress in solder balls in flip chip technology

Thermoplastic material

Carrier assembly for an integrated circuit

Semiconductor device and method for manufacturing semiconductor device

Bond pad support structure for semiconductor device

Lock and key through-via method for wafer level 3D integration and structures produced

Semiconductor device and a method of manufacturing the same

Grooving bumped wafer pre-underfill system

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Electronic component

Method of manufacturing a semiconductor device

Semiconductor assembly with one metal layer after base metal removal

MICROWAVE CIRCUIT ASSEMBLY

Integrated circuit package system including shield

Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Large substrate structural vias

Anisotropic conductive adhesive

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

BIOLOGICAL IMPLANTABLE FUNCTIONAL DEVICE AND VISION REGENERATION ASSISTING APPARATUS

Methods and apparatus for measuring analytes using large scale FET arrays

Coaxial through chip connection

Implantable microelectronic device and method of manufacture

Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same

Power semiconductor devices having integrated inductor

Echo removing apparatus

Integrated multicomponent device in a semiconducting die

ELECTRICAL DEVICE HAVING A POWER SOURCE WITH A MAGNETIC CAPACITOR AS AN ENERGY STORAGE DEVICE

SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME

Adhesive composition for electronic components, and adhesive sheet for electronic components using the same

Semiconductor Device and a Method of Manufacturing the Same

Barrier structures and methods for through substrate vias

Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion

Structure of UBM and solder bumps and methods of fabrication

Flip chip interconnection having narrow interconnection sites on the substrate

Semiconductor module having semiconductor device mounted on device mounting substrate

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor flip-chip system having oblong connectors and reduced trace pitches

Thermally enhanced semiconductor package

Semiconductor device including semiconductor constituent

SEMICONDUCTOR MODULE

Integrated antennas in wafer level package

Wafer Level package for heat dissipation and method of manufacturing the same

Package-on-package using through-hole via die on saw streets

Semiconductor device

Memory card and method for manufacturing memory card

Integrated circuit package system with offset stacked die

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Semiconductor device and manufacturing method therefor

Semiconductor chip package

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Integrated Circuit Package for Magnetic Capacitor

Epoxy resin composition

Solder bump confinement system for an integrated circuit package

Micro-assembler

Simple radio frequency integrated circuit (RFIC) packages with integrated antennas

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING CONNECTION TERMINAL

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Semiconductor device and production method therefor

Method of manufacturing semiconductor device

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE

METAL BONDED NANOTUBE ARRAY

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic device package and method for fabricating the same

Through-Silicon Via Sidewall Isolation Structure

Semiconductor chips including passivation layer trench structure

Reduced bottom roughness of stress buffering element of a semiconductor component

Semiconductor device

System and method for 3D integrated circuit stacking

3-D ICs equipped with double sided power, coolant, and data features

Package substrate structure and chip package structure and manufacturing process thereof

On-chip heat spreader

Process for packaging components, and packaged components

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME

Electrical connectivity for circuit applications

Method and structures of monolithically integrated ESD suppression device

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor device and production method therefor

Electronic device

Tamper-resistant semiconductor device and methods of manufacturing thereof

Lead pin for mounting semiconductor and printed wiring board

Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer

Micro-assembler

Systems and methods for forming micro-object assemblies

Micro-machined structure production using encapsulation

Method to prevent corrosion of bond pad structure

Method of manufacturing semiconductor device

Semiconductor device

Thermal spacer for stacked die package thermal management

Integrated circuit protection layer used in a capacitive capacity

Semiconductor device and manufacturing method of the same

3D integration of vertical components in reconstituted substrates

Achieving mechanical and thermal stability in a multi-chip package

INTEGRATED CIRCUIT CHIP PACKAGE MODULE

Stackable layer containing ball grid array package

Multi-chip semiconductor package

Lead frames with improved adhesion to plastic encapsulant

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

IC package with capacitors disposed on an interposal layer

Method of forming an isolation structure

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Dual metal for a backside package of backside illuminated image sensor

Chip-scale package conversion technique for dies

High-yield method of exposing and contacting through-silicon vias

Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme

Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method

Method of fabricating a semiconductor device

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device having a plurality of semiconductor constructs

Methods and applications of non-planar imaging arrays

Computer modules with small thicknesses and associated methods of manufacturing

Semiconductor circuit and switching power supply apparatus

Contact pad supporting structure and integrated circuit for crack suppresion

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS

Semiconductor package system with thermal die bonding

Method and apparatus for stacked die package with insulated wire bonds

Power module package having excellent heat sink emission capability and method for manufacturing the same

Integrated circuit package-on-package stacking system

Through-silicon via with low-K dielectric liner

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Microelectromechanical apparatus and method for producing the same

Semiconductor device with circuit for reduced parasitic inductance

Semiconductor device having sealing film and manufacturing method thereof

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

Methods for forming packaged products

System and method for ESD protection

PACKAGED POWER SWITCHING DEVICE

Integrated circuit package system and method of manufacture thereof

HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Through-wafer interconnects for photoimager and memory wafers

Electronic device and electronic apparatus

Semiconductor package structure with protection bar

SEMICONDUCTOR CHIP PACKAGE

Isolation Structure for Stacked Dies

Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate

Electronic device package and fabrication method thereof

Semiconductor device with output circuit arrangement

Rigid-flex module and manufacturing method

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE

Structure and process for a contact grid array formed in a circuitized substrate

METHOD FOR FABRICATING A SEMICONDUCTOR CHIP DEVICE HAVING THROUGH-SILICON-VIA (TSV)