Lead frame, lead frame fabrication, and semiconductor device

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer

Aluminum bond pads with enhanced wire bond stability

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Composite multi-layer substrate and module using the substrate

Method and Apparatus for Building Multilayer Circuits

CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Method for providing a redistribution metal layer in an integrated circuit

Electronic system modules and method of fabrication

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Semiconductor device having a semiconductor chip, and method for the production thereof

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Wafer level chip scale package

Power electronic device

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

Semiconductor package

Stress-engineered interconnect packages with activator-assisted molds

Airgap micro-spring interconnect with bonded underfill seal

STACKED SEMICONDUCTOR PACKAGE ASSEMBLY

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES

Method for fabrication of a semiconductor device and structure

Semiconductor device having surface protective films on bond pad

Semiconductor device

Arrangement for energy conditioning

Electronic component mounted structure

Method of layout of pattern

Method for fabrication of a semiconductor device and structure

Patterned die attach and packaging method using the same

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

Semiconductor device with an improved solder joint

ADHESIVE FILM

System-in packages

Substrate structure

Multi chip semiconductor device

Semiconductor package

Method and core materials for semiconductor packaging

Semiconductor device

Semiconductor component and assumbly with projecting electrode

Semiconductor die having a redistribution layer

3D integration structure and method using bonded metal planes

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COIN BONDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Semiconductor package and manufacturing method of the semiconductor package

SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE

Semiconductor chip package

Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Method and Apparatus for Vertical Stacking of Integrated Circuit Chips

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Semiconductor device

ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

Method and apparatus for mounting electric component

Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Fabrication method of semiconductor device

Connecting film, and joined structure and method for producing the same

Metered Conveyor Feed System For Gum Components

Circuit device

Packaging techniques and configurations

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Semiconductor device

Techniques for packaging multiple device components

Structure and method of forming a pad structure having enhanced reliability

Stack structure with copper bumps

In-situ cavity integrated circuit package

Die Exposed Chip Package

Mold lock on heat spreader

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Method for packing semiconductor components and product produced according to the method

SEMICONDUCTOR DEVICE

Semiconductor device driving bridge-connected power transistor

Massively parallel interconnect fabric for complex semiconductor devices

Optoelectronic system

Bonding wire for semiconductor device

Pressure sensor package

Integrated circuit package system including honeycomb molding

Semiconductor device and method of manufacturing the same

Semiconductor bond pad patterns and method of formation

Underfill dispensing system for integrated circuits

Package with multiple dies

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Fabrication method of semiconductor integrated circuit device

IC card with terminals for direct access to internal components

Antenna sheet, transponder, and booklet

Manufacturing method of semiconductor integrated circuit device

Separate probe and bond regions of an integrated circuit

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device and method to manufacture thereof

Semiconductor module

Semiconductor device

Reworkable electronic device assembly and method

Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same

System and method for multi-chip module die extraction and replacement

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

Method and device of preventing delamination of semiconductor layers

Wafer backside structures having copper pillars

Integrated circuit package and method for fabrication thereof

Semiconductor device including a magnetic sensor chip

MEMS microphone with cavity and method therefor

Shielding for a micro electro-mechanical device and method therefor

Method of forming an interconnect joint

Semiconductor package including power ball matrix and power ring having improved power integrity

Method of interconnecting electronic wafers

Thermally enhanced wafer level package

SEMICONDUCTOR DEVICE

Die bonding utilizing a patterned adhesion layer

Chip identification using top metal layer

Integrated circuit package system with offset stacking and anti-flash structure

High quality electrical contacts between integrated circuit chips

Integrated circuit packaging system and method of manufacture thereof

Dual Interconnection in Stacked Memory and Controller Module

Power lead-on-chip ball grid array package

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

LIQUID ELECTRICAL INTERCONNECT AND DEVICES USING SAME

Method for Mounting Flip Chip and Substrate Used Therein

Backside process for a substrate

Integrated circuit module and method of packaging same

Carbon nanotubes for the selective transfer of heat from electronics

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Method and system for providing a low-profile semiconductor assembly

Semiconductor die packages using thin dies and metal substrates

Multi-chip system including capacitively coupled and optical communication

Multi-chip packages providing reduced signal skew and related methods of operation

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

Receive circuit for connectors with variable complex impedance

Packaged electronic device having metal comprising self-healing die attach material

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Three dimensional integrated circuit integration using dielectric bonding first and through via formation last

Methods of fluxless micro-piercing of solder balls, and resulting devices

IC package reducing wiring layers on substrate and its carrier

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with leaded package and method for manufacturing thereof

Semiconductor component having through wire interconnect (TWI) with compressed wire

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method of forming high-frequency circuit structure and method thereof

High breakdown voltage semiconductor device and high voltage integrated circuit

Anti-reflection structures for CMOS image sensors

Semiconductor integrated circuit device and method of manufacturing same

WIRELESS COMMUNICATION DEVICE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL

WIRELESS COMMUNICATION DEVICE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

WIRELESS COMMUNICATION DEVICE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL

Active area bonding compatible high current structures

Manufacturing method of semiconductor device with surface mounting terminals

Wafer level packaging method

Semiconductor package and method of packaging semiconductor devices

Manufacturing method of semiconductor integrated circuit device

Remote chip attachment

Widebody coil isolators

Exposed die pad package with power ring

Interconnection of IC Chips by Flex Circuit Superstructure

Assembling substrates that can form 3-D structures

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Package-on-package interconnect stiffener

Semiconductor die package and method for making the same

Semiconductor device and manufacturing method thereof

Conductive through connection and forming method thereof

Structures for improving current carrying capability of interconnects and methods of fabricating the same

3D-IC Verification Method

Semiconductor device having elastic solder bump to prevent disconnection

Semiconductor Manufacturing Method

Method of manufacturing a semiconductor device including plural semiconductor chips

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Manufacturing method of bottom substrate of package

Packaging and connecting electrostatic transducer arrays

X-Ray Opaque Coating

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric

Systems and methods for printing electronic device assembly

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Three-dimensional semiconductor architecture

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES

Methods and apparatuses for assembling components onto substrates

Method of Manufacturing Addressable and Static Electronic Displays, Power Generating Or Other Electronic Apparatus

Method of fabricating a semiconductor device

Method of manufacturing semiconductor device

Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Method of handling a thin wafer

Method of making chip-on-lead package

Self-Aligned Chip Stacking

Methods and systems for releasably attaching support members to microfeature workpieces

Integrated circuit chip using top post-passivation technology and bottom structure technology

Electronic component module

CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT

Electronic apparatus produced using lead-free bonding material for soldering

ELECTRONIC DEVICE

Method and apparatus for distributing a thermal interface material

Assembly of radiofrequency chips

Structures and processes for fabrication of probe card assemblies with multi-layer interconnect

Method for ultra thin wafer handling and processing

Assembly of electronic components

Stacked multichip package

Integrated circuit packaging system with package underfill and method of manufacture thereof

THREE-DIMENSIONAL ELECTRONICS PACKAGE

WIRING BOARD

Integrated circuit package system with multiple device units and method for manufacturing thereof

Apparatus, system, and method for wireless connection in integrated circuit packages

Chip packages

Through-hole contacts in a semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Filp chip interconnection structure with bump on partial pad and method thereof

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Stackable electronic package and method of making same

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device

Integrated circuit package and method of making same

Chip stack package and method of fabricating the same

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

Semiconductor package fabrication process and semiconductor package

Stackable electronics package and method of fabricating same

Stackable electronic package

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Semiconductor device with first and second semiconductor substrates

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Semiconductor module and camera module mounting said semiconductor module

Multilayer wiring substrate having a castellation structure

Wafer level packaging using flip chip mounting

Integrated circuit packaging system with interposer and method of manufacture thereof

Component mounting apparatus and method

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER

Auto feedback apparatus for laser marking

Film-like adhesive, adhesive sheet, and semiconductor device using same

Composite alloy bonding wire and manufacturing method thereof

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Load driving device

Applications of smart polymer composites to integrated circuit packaging

Structure and Method for Thin Single or Multichip Semiconductor QFN Packages

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

Barrier for through-silicon via

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Structure and method for sealing cavity of micro-electro-mechanical device

Methods and systems for packaging integrated circuits

Stack type semiconductor package apparatus

Integrated circuit packaging system with layered packaging and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Making a semiconductor device having conductive through organic vias

SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE

Electrostatic discharge structure for 3-dimensional integrated circuit through-silicon via device

Semiconductor device and method for manufacturing the same

Elevator load bearing member

Package substrate with a cavity, semiconductor package and fabrication method thereof

Multiple layer strain gauge

Apparatus and method for manufacturing semiconductor device

Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method