Lead frame and semiconductor device

Semiconductor module and method of manufacturing the same

Wafer level package including a device wafer integrated with a passive component

Bonding wire cleaning unit and method of wire bonding using same

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Circuit device

Method for manufacturing an electronic module

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Method of room temperature covalent bonding

Method of manufacturing a semiconductor device

Universal interconnect die

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Flip chip interconnection having narrow interconnection sites on the substrate

Vertically stacked semiconductor device

Schottky diode device with aluminum pickup of backside cathode

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Methods for the electronic, homogeneous assembly and fabrication of devices

Integrated circuit for communications modules

Integrated circuit carrier

Semiconductor structure with RF element

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Die attach methods and apparatus

Semiconductor chip and method manufacturing the same

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Wafer level chip scale package having a gap and method for manufacturing the same

Semiconductor device with interlocking clip

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Semiconductor device including an arrangement for detection of tampering

Shield and semiconductor die assembly

Device and applications for passive RF components in leadframes

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

System for tracking elements using tags

RFID label technique

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Signal transmission arrangement and method

Method of forming an interconnection element

ELECTRICAL CONTACT

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Large-area nanoenabled macroelectronic substrates and uses therefor

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Flip-chip adaptor package for bare die

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Method of producing a package for semiconductor chips

Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device

Method of making a flexible substrate containing self-assembling microstructures

Semiconductor device

Electronic assembly with integral thermal transient suppression

Microelectronic component assemblies with recessed wire bonds and methods of making same

Flip-chip-on-film package structure

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Stacked package integrated circuit

Integrated device and electronic system

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Semiconductor device and manufacturing method for the same

Semiconductor chip and semiconductor device including the same

RFID tag, module component, and RFID tag fabrication method

Forming solder balls on substrates

Bonding pads having slotted metal pad and meshed via pattern

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Semiconductor device and a method for manufacturing the same

Temperature dependent semiconductor module connectors

Low capacitance solder bump interface structure

Front-end processing of nickel plated bond pads

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Radio frequency identification (RFID) tag lamination process using liner

Radio frequency identification (RFID) tag lamination process

Semiconductor package fabrication

Wafer-processing tape

Circuit device

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Current regulator having a transistor and a measuring resistor

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Semiconductor device and method of manufacturing the same

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Circuit substrate and its manufacturing method

Copper interconnection with conductive polymer layer and method of forming the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Conductive bump structure of circuit board and method for fabricating the same

Semiconductor device, semiconductor body and method of manufacturing thereof

Impedance matching external component connections with uncompensated leads

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Method for MCP packaging for balanced performance

Semiconductor component having stiffener, circuit decal and terminal contacts

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures

Semiconductor package and method for manufacturing the same

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Semiconductor device

Semiconductor device

Wafer-level package having test terminal

Integrated circuit card and a method for manufacturing the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

System and method for increasing yield from semiconductor wafer electroplating

Low profile small outline leadless semiconductor device package

Electrical device allowing for increased device densities

Methods of refining lead-containing materials

Method for separating electronic component from organic board

Method of manufacture of ceramic composite wiring structures for semiconductor devices

LOCAL MULTILAYERED METALLIZATION

Junction-isolated vias

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor integrated circuit and semiconductor device

Process for manufacturing sawing type leadless semiconductor packages

Ultra thin dual chip image sensor package structure and method for fabrication

CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Carrier for substrate film

Semiconductor device and a manufacturing method of the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Planar microspring integrated circuit chip interconnection to next level

Semiconductor device

System for different bond pads in an integrated circuit package

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

HIP PACKAGE STRUCTURE

Magnetic self-assembly for integrated circuit packages

Stacked integrated circuits package system with dense routability and high thermal conductivity

Integrated circuit package system with die and package combination

Stacked device package for peripheral and center device pad layout device

MOSFET package

Semiconductor package with passive device integration

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

CHIP STRUCTURE AND WAFER STRUCTURE

Semiconductor device and method for producing same

Semiconductor device, magnetic sensor, and magnetic sensor unit

Semiconductor composite apparatus, LED, LED printhead, and image forming apparatus

Low stress conductive adhesive

Methods of fabricating integrated circuit devices having self-aligned contact structures

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Method of manufacturing semiconductor device

Carrier for substrate film

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Integrated circuit with staggered differential wire bond pairs

Semiconductor flip chip package having substantially non-collapsible spacer

Chip scale package having flip chip interconnect on die paddle

Semiconductor chip package and method of manufacture

Integrated connection arrangements

Ultra thin dual chip image sensor package structure and method for fabrication

Chip stack employing a flex circuit

Integrated circuit and wireless IC tag

Encapsulation method for semiconductor device having center pad

Semiconductor package having double layer leadframe

Integrated circuit package and method of manufacture thereof

Embedded chip printed circuit board and method of manufacturing the same

Anodic bonding process for ceramics

System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices

Flat flex cable (FFC) with embedded spring contacts for connecting to a PCB or like electronic device

Electrical contact

Ta-TaN selective removal process for integrated device fabrication

Method of making reinforced semiconductor package

Encapsulation of circuit components to reduce thermal cycling stress

Microfeature devices and methods for manufacturing microfeature devices

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Method for integrating an electronic component or similar into a substrate

Method of manufacturing an electronic device

Semiconductor component and method of manufacture

Low cost method to produce high volume lead frames

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Wirebond crack sensor for low-k die

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Method of manufacturing an ink-jet assembly

Input and output circuit of an integrated circuit chip

Bonding apparatus

Semiconductor device with chip-on-board structure

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor chip capable of implementing wire bonding over active circuits

Copper bonding wire for semiconductor packaging

Semiconductor device and manufacturing method thereof

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Method to create flexible connections for integrated circuits

Trace design to minimize electromigration damage to solder bumps

Substrate assembly with direct electrical connection as a semiconductor package

Chip scale package with heat spreader

Package structure with chip embedded in substrate

Semiconductor device

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor packages and methods for making and using same

Semiconductor device and unit equipped with the same

Semiconductor package having improved adhesiveness and ground bonding

Dual row leadframe and fabrication method

Package stacking lead frame system

Ball mounting method

Apparatus and method for bonding wires

Universal pattern of contact pads for semiconductor reflow interconnections

Semiconductor device with micro connecting elements and method for producing the same

Component mounting method

Memory apparatus connectable to a host system having a USB connector

Semiconductor component sealed on five sides by polymer sealing layer

Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates

Semiconductor package and method for manufacturing the same

Current sensor

Bond pad structure for integrated circuit chip

Semiconductor device

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor package with plated connection

Semiconductor chip having solder bumps and dummy bumps

Contact structure and method for manufacturing the same

Fine pitch low cost flip chip substrate

Ground arch for wirebond ball grid arrays

Semiconductor package using terminals formed on a conductive layer of a circuit board

Stacked die package system

Stacked integrated circuit and package system

Three-dimensional circuit module and method of manufacturing the same

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor package with low and high-speed signal paths

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

IC chip coating material and vacuum fluorescent display device using same

Method and system for transferring dies between surfaces

Stable electroless fine pitch interconnect plating

Perimeter matrix ball grid array circuit package with a populated center

Multilayer printed wiring board and method of manufacturing the same

Implantable, tissue conforming drug delivery device

Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

Method for fabricating semiconductor packages with semiconductor chips

Manufacturing method of semiconductor device

Package or pre-applied foamable underfill for lead-free process

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Semiconductor device and method of making the same

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Semiconductor device

High performance IC package and method

Structure and method for bonding an IC chip

Integrated circuits and interconnect structure for integrated circuits

Ball grid array package

Dissociated fabrication of packages and chips of integrated circuits

Semiconductor device

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Stacked structure of integrated circuits and method for manufacturing the same

Multi-leadframe semiconductor package and method of manufacture

Semiconductor device and fabrication method thereof

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Capillary holder

Wiring board and capacitor to be built into wiring board

Antenna designs for radio frequency identification tags

Compliant electrical contacts

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Fabrication of stacked microelectronic devices

Method and system for 3D alignment in wafer scale integration

Semiconductor device and a method of manufacturing the same

Device packages

Placement method of an electronic module on a substrate and device produced by said method

Device packages having stable wirebonds

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor module

Semiconductor device and method of manufacturing thereof

Bump structure of semiconductor device and method of manufacturing the same

Routing design to minimize electromigration damage to solder bumps

Module structure having embedded chips

Chip scale package and method for manufacturing the same

Device package

Stacked type semiconductor device and method of fabricating stacked type semiconductor device

Electronic device and method for fabricating the same

Spacer Structures for Semiconductor Package Devices

Semiconductor package and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Method and apparatus for packaging an electronic chip

Integrated circuit device having encapsulant dam with chamfered edge

Circuit board and semiconductor device

Semiconductor device

Substrate mapping

Electronic device manufacture

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Forming buried via hole substrates

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Integrated circuit die connection methods and apparatus

Thermal enhanced package for block mold assembly

High-density inter-die interconnect structure

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Structured integrated circuit device

Semiconductor device and method of fabricating the same

Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor

Integrated circuit package encapsulating a hermetically sealed device

IC chip package structure and underfill process

Semiconductor device

Structure and manufacturing method of a chip scale package