Semiconductor device and method for manufacturing semiconductor device

Spaced, bumped component structure

Display apparatus

Semiconductor chip electrical connection structure

Semiconductor device and method of manufacturing a semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device and manufacturing method thereof

Bilayer aluminum last metal for interconnects and wirebond pads

Chip on board leadframe for semiconductor components having area array

Localized hermetic sealing of a power monitor on a planar light circuit

Method of making an electronic assembly

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

Method for designing integrated circuit package and method for manufacturing same

System-in-package wireless communication device comprising prepackaged power amplifier

System-in-package wireless communication device comprising prepackaged power amplifier

VSAT block up converter (BUC) chip

Method of making a compliant interconnect assembly

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Substrate bump formation

Method for producing an anisotropic conductive film on a substrate

Under bump metallurgy in integrated circuits

Fabrication of stacked microelectronic devices

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Multi-band power amplifier module for wireless communication devices

Multi-band power amplifier module for wireless communication devices

Multi-band power amplifier module for wireless communications

Multi-band power amplifier module for wireless communication devices

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Electronic component, electro-optical device, and electronic apparatus

Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material

Flip-chip semiconductor device with improved power pad arrangement

Flip-chip package structure with direct electrical connection of semiconductor chip

Signal redistribution using bridge layer for multichip module

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Fabrication method for chip size package and non-chip size package semiconductor devices

Low profile ball-grid array package for high power

Semiconductor integrated circuit and method of manufacturing the same

IC card

Integrated circuit card having staggered sequences of connector terminals

Reader / writer and method for manufacturing the same

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Integrated packaged having magnetic components

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Embedded inductor for semiconductor device circuit

Current sensor

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor chip stack package having dummy chip

On-pad broadband matching network

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Multi-function card device

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Assembly comprising functional devices and method of making same

Patterned plasma treatment to improve distribution of underfill material

Method of manufacturing a cavity package

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor interconnect having dome shaped conductive spring contacts

Electronic device

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

Semiconductor devices having post passivation interconnections and a buffer layer

Printed circuit board including embedded chips and method of fabricating the same using plating

Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same

Microelectronic multi-chip module

NANO IC packaging

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Leadframe designs for plastic cavity transistor packages

Flexible substrate for package

Tape for tape carrier package

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Electro-optic integrated circuits with connectors and methods for the production thereof

Wire bonds having pressure-absorbing balls

Coupler resource module

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Method of forming pad and fuse in semiconductor device

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same

Adhesive of folder package

Method and system for 3D alignment in wafer scale integration

Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate

Method of manufacturing a semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Bare die socket

Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby

Packaging for electronic modules

Arrangement for energy conditioning

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Method for fabricating thermally enhanced semiconductor package

Semiconductor device and fabrication method thereof

Method of forming a bonding pad structure

Copper interconnect

Integrated circuit packaging device and method for matching impedance

Microelectronic package having stacked semiconductor devices and a process for its fabrication

High power light emitting diode device

Micromechanical getter anchor

Methods of vertically stacking wafers using porous silicon

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Method for wafer stacking using copper structures of substantially uniform height

Semiconductor integrated circuit device and method of manufacturing the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Method for attaching chips in a flip-chip arrangement

Semiconductor device and radio communication device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Semiconductor device and manufacturing method therefor

Self-tuned millimeter wave RF transceiver module

Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device

Connection ball positioning method and device for integrated circuits

Method for constructing contact formations

Wafer structure, chip structure, and fabricating process thereof

Method of marking a low profile packaged semiconductor device

Method and system for performing die attach using a flame

Package that integrates passive and active devices with or without a lead frame

Methods of forming semiconductor packages

Thermally controlled fluidic self-assembly

Semiconductor package with a controlled impedance bus

LED array package structure and method thereof

Bonding pad structure

Ball limiting metallurgy split into segments

Carrier with metal bumps for semiconductor die packages

Circuit device with circuit board and semiconductor chip mounted thereon

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Package for a high-frequency electronic device

Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip

Multi lead frame power package

Ball grid array substrate having window and method of fabricating same

Repairable three-dimensional semiconductor subsystem

Semiconductor device with noise control

Arrangement of input/output pads on an integrated circuit

System for implementing a configurable integrated circuit

Manufacturing method of a quad flat no-lead package structure

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Semiconductor device package with reduced leakage

Methods of making and using a floating lead finger on a lead frame

Packages for encapsulated semiconductor devices and method of making same

Use of a down-bond as a controlled inductor in integrated circuit applications

Monolithic microwave integrated circuit compatible FET structure

Multi-layer printed circuit board comprising a through connection for high frequency applications

Illumination assembly and method of making same

RFID tag and method of manufacturing the same

RFID tag and method of manufacturing the same

Method of manufacturing a semiconductor device

Thermal attach and detach methods and system for surface-mounted components

Methods and systems for aligning and coupling devices

Semiconductor device and manufacturing method thereof

Methods for fabricating thin complaint spring contacts

Microelectronic devices having underfill materials with improved fluxing agents

Method for re-routing lithography-free microelectronic devices

Memory package

Package structure with embedded chip and method for fabricating the same

Fabrication of stacked die and structures formed thereby

Compact system module with built-in thermoelectric cooling

Xerographic micro-assembler

Cornerbond assembly comprising three-dimensional electronic modules

Protection of an integrated capacitor

Transceiver using low temperature co-fired ceramic method

B-stageable underfill encapsulant and method for its application

Semiconductor device having a bonding pad structure including an annular contact

Method of making wafer level ball grid array

Flip chip device

Method for solder bumping, and solder-bumping structures produced thereby

Test system for semiconductor components having conductive spring contacts

Method for fabricating semiconductor components with conductive spring contacts

Semiconductor device and manufacturing method thereof

Metallization structure over passivation layer for IC chip

Thermally enhanced package for an integrated circuit

Semiconductor device and manufacturing method thereof

Semiconductor package structure and method for fabricating the same

High density package interconnect wire bond strip line and method therefor

Semiconductor device

Circuit boards, electronic devices, and methods of manufacturing thereof

Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Semiconductor package having improved adhesion and solderability

Electronic component and a panel

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Wireless communication system

Multi-channel radiometer imaging system and MMIC chips for use thereof

Bonding structure and fabrication thereof

Method and device for wafer scale packaging of optical devices using a scribe and break process

Three-dimensional device fabrication method

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device

Methods and apparatus for addition of electrical conductors to previously fabricated device

Wafer-level underfill process making use of sacrificial contact pad protective material

Method of fabrication of stacked semiconductor devices

Method for die attaching

Semiconductor integrated circuit

Semiconductor memory device and defect remedying method thereof

Thermal management of surface-mount circuit devices

Liquid metal thermal interface material system

Printed circuit board having a bond wire shield structure for a signal transmission line

Low voltage logic operation using higher voltage supply levels

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Fabricating stacked chips using fluidic templated-assembly

Semiconductor device, its manufacturing method, and radio communication device

Packaging structure with a plurality of drill holes formed directly below an underfill layer

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Method for fabricating semiconductor package having conductive bumps on chip

Semiconductor package and fabrication method thereof

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Memory module having interconnected and stacked integrated circuits

Liquid metal thermal interface material system

Lead frame assemblies and decoupling capacitors

Sharp corner lead frame

MSD raised metal interface features

Power semiconductor device

Solder interconnect structure and method using injection molded solder

Epoxy-solder thermally conductive structure for an integrated circuit

Method for fabricating semiconductor components with conductive vias

Semiconductor package substrate with embedded chip and fabrication method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Methods for assembling a stack package for high density integrated circuits

Attachment of flip chips to substrates

Memory module

Bond pad for ball grid array package

Doped alloys for electrical interconnects, methods of production and uses thereof

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Multi-chip module

Semiconductor device and method for manufacturing the same

Wire bond interconnection

Heat stud for stacked chip package

Semiconductor die attachment for high vacuum tubes

Stack package for high density integrated circuits

Semiconductor chip and tab package having the same

Semiconductor device with improved heat dissipation

connection arrangement for micro lead frame plastic packages

Simplified multichip packaging and package design

Method and apparatus for polymer dielectric surface recovery by ion implantation

Integrated circuit including silicon wafer with annealed glass paste

Methods for aligning semiconductor fabrication molds and semiconductor substrates

Device and method for fabricating double-sided SOI wafer scale package with optical through via connections

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Method and device for mounting electric component

Plating apparatus

Package for a semiconductor device

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Wafer alignment method

High surface area aluminum bond pad for through-wafer connections to an electronic package

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Leadframe with enhanced encapsulation adhesion

Structure of embedded active components and manufacturing method thereof

Method for stacking BGA packages and structure from the same

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Transponder incorporated into an electronic device

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Multi-chips semiconductor device assemblies and methods for fabricating the same

Integrated circuit package and assembly thereof

Semiconductor component package

Probe arrays and method for making

Multi-chip package using an interposer

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Leadframe designs for integrated circuit plastic packages

ESD protection apparatus for an electrical device

Trenched MOSFETS with part of the device formed on a (110) crystal plane

Integrated circuit component and mounting method thereof

Electronic device and method of manufacturing the same

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same