Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles

Wafer-level chip scale package and method for fabricating and using the same

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Method of making an integrated circuit

Chip-on-board module, and method of manufacturing the same

Process for the manufacture of large area arrays of discrete components

PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Electronic component and fabricating method

Electronic component and fabricating method

Electrode pad section for external connection

Semiconductor device and method of manufacturing the same

Electronic component and fabricating method

Microelectronic assembly having array including passive elements and interconnects

Socket grid array

Connector assembly

Quad flat non-leaded package comprising a semiconductor device

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

Semiconductor package and method for manufacturing the same

Anisotropic conductive film and bump, and packaging structure of semiconductor having the same

Semiconductor package with passive device integration

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

System and method for automated wire bonding

High performance system-on-chip discrete components using post passivation process

Manufacturing method for wiring substrates

Methods for reducing flip chip stress

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Conductive bond for through-wafer interconnect

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Compliant wirebond pedestal

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Bulk-shaped lens, light-emitting unit, and lighting equipment

Semiconductor part for component mounting, mounting structure and mounting method

Flip-chip adaptor package for bare die

Via structure for semiconductor chip

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

Bumped IC, display device and electronic device using the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of fabricating the same

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Partially etched dielectric film with conductive features

High performance RF inductors and transformers using bonding technique

Solder alloy and semiconductor device

Bumpless wafer scale device and board assembly

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method and apparatus for high electrical and thermal performance ball grid array package

Microelectronic adaptors, assemblies and methods

Method for making a socket to perform testing on integrated circuits

Circuit carrier and package structure thereof

Method of making microelectronic packages including electrically and/or thermally conductive element

Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device

Semiconductor device, its fabrication method and electronic device

Enhanced adhesion strength between mold resin and polyimide

Substrate for packaging semiconductor chip and method for manufacturing the same

Die-wafer package and method of fabricating same

Semiconductor device and method of manufacturing same

Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Integrated circuit package with transparent encapsulant and method for making thereof

High Q factor integrated circuit inductor

Method for fabrication of semiconductor device

Adhesive resin and film adhesive made by using the same

Interconnection device and system

Method and system for batch forming spring elements in three dimensions

Selective passivation of exposed silicon

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Method of fabricating a pad over active circuit I.C. with meshed support structure

Method for fabricating a chip scale package using wafer level processing

Flip chip packaging process employing improved probe tip design

Method for processing an integrated circuit

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Direct writeTM system

Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film

Internally generating patterns for testing in an integrated circuit device

Method and apparatus for underfilling semiconductor devices

Chip and multi-chip semiconductor device using thereof and method for manufacturing same

Semiconductor integrated circuit having connection pads over active elements

Adhesion by plasma conditioning of semiconductor chip

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device

WAFER-LEVEL PACKAGE STRUCTURE

Area array packages with overmolded pin-fin heat sinks

Method of fabricating a semiconductor package utilizing a thermosetting resin base member

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Semiconductor device having conducting portion of upper and lower conductive layers

Semiconductor device

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Room temperature metal direct bonding

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Integrated circuit arrangement

Semiconductor device

Method for manufacturing circuit board, circuit board, and electronic equipment

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor

Power module and power module assembly

Interconnect structure for power transistors

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Optical sensor module with semiconductor device for drive

ULTRA-FINE CONTACT ALIGNMENT

Method and apparatus for forming metal contacts on a substrate

Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale

Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Hybrid integrated circuit device and method of manufacturing the same

Method and resulting structure for manufacturing semiconductor substrates

Method of manufacturing high performance copper inductors with bond pads

Method of forming segmented ball limiting metallurgy

Hermetic passivation structure with low capacitance

Masking layer in substrate cavity

Semiconductor device and method of fabricating the same

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Printed circuit board and method for manufacturing printed circuit board

Electronic device and production method thereof

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Maskless direct write of copper using an annular aerosol jet

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Die attach by temperature gradient lead free soft solder metal sheet or film

Integrated device including connections on a separate wafer

Electronic component package

Semiconductor integrated circuit device

Structure of gold fingers

Method of packaging an optical sensor

Microelectronic component assemblies and microelectronic component lead frame structures

Partially populated ball grid design to accommodate landing pads close to the die

Semiconductor package including flex circuit, interconnects and dense array external contacts

Microelectronic component assemblies and microelectronic component lead frame structures

Flipchip QFN package

Integrated circuit packages with sandwiched capacitors

Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate

Semiconductor device

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Lithography device for semiconductor circuit pattern generation

Semiconductor device

Test assembly including a test die for testing a semiconductor product die

Mounting board and electronic device using same

Electronic component mounting method and apparatus

Methods and apparatus to reduce growth formations on plated conductive leads

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Carrier, method of manufacturing a carrier and an electronic device

Leadframe and method of manufacturing the same

Method for manufacturing semiconductor device with plural semiconductor chips

Interconnect circuitry, multichip module, and methods for making them

Method of embedding components in multi-layer circuit boards

Semiconductor integrated circuit device

Stacked IC device having functions for selecting and counting IC chips

Cooling devices and methods of using them

Semiconductor chip package

Materials for electronic devices

Wafer-level assembly method for chip-size devices having flipped chips

Efficient use of wafer area with device under the pad approach

Fabrication process for a semiconductor integrated circuit device

Semiconductor device and method of manufacturing the same

Semiconductor device

Bonding wire and an integrated circuit device using the same

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Image sensor and manufacturing method thereof

Semiconductor device, optoelectronic board, and production methods therefor

Bumping electronic components using transfer substrates

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Electronic device and method for producing the same

Lithographic contact elements

Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings

Encapsulated semiconductor components and methods of fabrication

Alignment and orientation features for a semiconductor package

Method of manufacturing an electronic device, and electronic device

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Insulating substrate for IC packages having integral ESD protection

High-frequency module, and method of producing same

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Electronic package structure and the packaging process thereof

Wafer stacking with anisotropic conductive adhesive

Semiconductor device and semiconductor module

Semiconductor device and method of manufacturing the same

FLIP CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE THEREOF

Method for fabricating a semiconductor interconnect having conductive spring contacts

Method of forming a bonding pad structure

Semiconductor chip with external connecting terminal

Low profile stacking system and method

Semiconductor element having protruded bump electrodes

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Method of fabricating a pad over active circuit I.C. with frame support structure

Stackable ceramic FBGA for high thermal applications

Semiconductor device

Semiconductor sensor device and method of producing the same

Method of packaging an optical sensor

Surface mount package

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

I/O architecture for integrated circuit package

Apparatus and methods for an underfilled integrated circuit package

Flexible rewiring plate for semiconductor components, and process for producing it

Method for preparing arylphosphonite antioxidant

Method of backside grinding a bumped wafer

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Array capacitors with voids to enable a full-grid socket

Thin film capacitors on ceramic

Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Dual band power amplifier module for wireless communication devices

Method and device for manufacturing bonding pads for chip scale packaging

Fabrication methods for electronic system modules

Semiconductor device, manufacturing method thereof and electronic equipment

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

Method and apparatus for applying body bias to integrated circuit die

Chip assembly package

Semiconductor package

Thermal intermediate apparatus, systems, and methods

Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure

Method of manufacturing a semiconductor device

High-frequency device

Leadless semiconductor package

Semiconductor package with increased number of input and output pins

Chemical leadframe roughening process and resulting leadframe and integrated circuit package

Chip-mounted film package

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Package structure for semiconductor

Nanotube modified solder thermal intermediate structure, systems, and methods

Mounting device and method thereof

Apparatuses and methods to route line to line

Novel process for improved hot carrier injection

Methods of providing solder structures for out plane connections

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Attachment of integrated circuit structures and other substrates to substrates with vias

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Plastic lead frames utilizing reel-to-reel processing

Warpage control of array packaging

Stacked semiconductor device assembly and method for forming

Integrating passive components on spacer in stacked dies

Chip packaging compositions, packages and systems made therewith, and methods of making same

Adhesive film for manufacturing semiconductor device

Embedded redistribution interposer for footprint compatible chip package conversion

Various structure/height bumps for wafer level-chip scale package

Packaging substrates for integrated circuits and soldering methods

Flexible package with rigid substrate segments for high density integrated circuit systems

Wire loop grid array package

Tapered dielectric and conductor structures and applications thereof

System and method for increasing the number of IO-s on a ball grid pattern

Stress distribution package

Wire bonding package

Thermally enhanced semiconductor package

Method of assembling a ball grid array package with patterned stiffener layer

Semiconductor package with a flip chip on a solder-resist leadframe

Method and apparatus for improved power routing

System and method for increasing the ball pitch of an electronic circuit package

Substrate structure capable of reducing package singular stress

Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument

Semiconductor packaging substrate

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Methods of forming solder areas on electronic components and electronic components having solder areas

Flip-chip solder bump formation using a wirebonder apparatus

Chip orientation and attachment method

Photocurable adhesive compositions, reaction products of which have low halide ion content

Combinations of resin compositions and methods of use thereof

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Methods for maskless lithography

Castellation wafer level packaging of integrated circuit chips

Method of making a microelectronic assembly

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor device including multi-chip

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Patterned plasma treatment to improve distribution of underfill material

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Structure and method for fabricating a bond pad structure

Structure and method for reinforcing a bond pad on a chip

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Power semiconductor module and method for producing it

Ball grid array package substrates with a modified central opening and method for making the same

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor package

Semiconductor packages for enhanced number of terminals, speed and power performance

Stacked die semiconductor device

Multi-die processor

Microelectronic device signal transmission by way of a lid

Thin, thermally enhanced molded package with leadframe having protruding region

Microelectronic devices and methods for filling vias in microelectronic devices

Semiconductor device and fabrication method thereof

Nano-metal composite made by deposition from colloidal suspensions

Combination back grind tape and underfill for flip chips

Method of incorporating interconnect systems into an integrated circuit process flow

Semiconductor packaging

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Connector for making electrical contact at semiconductor scales

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Method of producing an electronic component

Fan out type wafer level package structure and method of the same

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Module board having embedded chips and components and method of forming the same

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate