212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Circuit module
#1802Electronic component built-in multi-layer wiring board and method of manufacturing the same
#1803Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#1804Semiconductor device
#1805Methods for making semiconductor device with sealing resin
#1806FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER BONDING
#1807SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NIPDAU OR NIAU SURFACE FINISHES DURING HIGH TEMPERATURE EXPOSURE
#1808Embedded die flip-chip package assembly
#1809Chamfered corner crackstop for an integrated circuit chip
#1810Electrical connectivity of die to a host substrate
#1811Semiconductor package with conductive clip
#1812Power semiconductor package with conductive clip and related method
#1813Semiconductor device and method of manufacturing same
#1814Method of manufacturing a semiconductor device and semiconductor integrated circuit wafer
#1815EDRAM/DRAM fabricated capacitors for use in on-chip PMUS and as decoupling capacitors in an integrated EDRAM/DRAM and PMU system
#1816Interposer package-on-package structure
#1817Seal ring structure with a metal pad
#1818Chip diode and diode package
#1819Microelectronic elements with post-assembly planarization
#1820Device having at least two wafers for detecting electromagnetic radiation and method for producing said device
#1821Integrated circuit package
#1822Integrated passive flip chip package
#1823Packaged semiconductor devices and packaging methods
#1824Embedded die ball grid array package
#1825Method for manufacturing semiconductor devices having a metallisation layer
#1826RFID tags and processes for producing RFID tags
#1827Method of forming surface protrusions on an article and the article with the protrusions attached
#1828Integrated voltage regulator with embedded passive device(s) for a stacked IC
#1829Integrated circuit package
#1830Method of manufacturing package system
#1831Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#1832Accessing or interconnecting integrated circuits
#1833LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#1834Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#1835Reliable microstrip routing for electronics components
#1836Semiconductor device and a method of manufacturing the same
#1837Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#1838Methods of making a monolithic microwave integrated circuit
#1839Bonded processed semiconductor structures and carriers
#1840Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#1841Methods for packaging integrated circuits
#1842Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method
#1843Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#1844Stacked semiconductor apparatus, system and method of fabrication
#1845Pad-less interconnect for electrical coreless substrate
#1846Microbump and sacrificial pad pattern
#1847Impedance controlled electrical interconnection employing meta-materials
#1848SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES
#1849Package assembly having a semiconductor substrate
#1850Microelectronic assembly having a heat spreader for a plurality of die
#1851Electronic Device and Method for Fabricating an Electronic Device
#1852Package assembly having interconnect for stacked electronic devices and method for manufacturing the same
#1853Power module package and method of manufacturing the same
#1854Stacked semiconductor system having interposer of half-etched and molded sheet metal
#1855Methods and systems for releasably attaching support members to microfeature workpieces
#1856Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#1857Composite electronic structure with partially exposed and protruding copper termination posts
#1858System and method for 3D integrated circuit stacking
#1859Leadless package type power semiconductor module
#1860Assembly bonding
#1861Apparatus and method for harvesting energy in an electronic device
#1862Semiconductor device structure with metal ring on silicon-on-insulator (SOI) substrate
#1863Semiconductor apparatus capable of detecting whether pad and bump are stacked
#1864Flip-chip package structure and method for an integrated switching power supply
#1865Optical bus in 3D integrated circuit stack
#1866Biochip device
#1867Semiconductor device
#1868THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACKAGES
#1869Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#1870Interposer for integrated circuit chip package
#1871Double solder bumps on substrates for low temperature flip chip bonding
#1872Protrusion bump pads for bond-on-trace processing
#1873Protrusion bump pads for bond-on-trace processing
#1874Method of fabricating a bond pad structure
#1875Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#1876Semiconductor package with conductive clips
#18773D chip testing through micro-C4 interface
#1878Magnetic field shielding for packaging build-up architectures
#1879Optoelectronic system
#18803D semiconductor apparatus for initializing channels
#1881Semiconductor device and related manufacturing method
#1882Combination of TSV and back side wiring in 3D integration
#1883Semiconductor package and fabrication method thereof
#1884INTEGRATED CIRCUITS INCLUDING COPPER PILLAR STRUCTURES AND METHODS FOR FABRICATING THE SAME
#1885Apparatus, system, and method for wireless connection in integrated circuit packages
#1886Opening in a multilayer polymeric dielectric layer without delamination
#1887Through via contacts with insulated substrate
#1888Double-sided segmented line architecture in 3D integration
#1889Grid array connection device and method
#1890Semiconductor device and method of forming stress relief layer between die and interconnect structure
#1891Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures
#1892Molding method for COB-EUSB devices and metal housing package
#1893Die-to-die inductive communication devices and methods
#1894PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
#1895Stacked packaged integrated circuit devices, and methods of making same
#1896Self-adhesive die
#1897Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors
#1898Formation of alpha particle shields in chip packaging
#1899Semiconductor wafer and semiconductor die
#1900Light emitting apparatus having at least one reverse-biased light emitting diode
#1901Semiconductor manufacturing device and semiconductor manufacturing method
#1902Package structure integrating a start-up component, a controller, and a power switch
#1903Chip, chip package and die
#1904INTEGRATED WIRE BONDER AND 3D MEASUREMENT SYSTEM WITH DEFECT REJECTION
#1905Protective layer for contact pads in fan-out interconnect structure and method of forming same
#1906Computer modules with small thicknesses and associated methods of manufacturing
#1907Multiple die stacking for two or more die
#1908Electronic component with sheet-like redistribution structure
#1909Stacked multi-chip integrated circuit package
#1910Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding
#1911Temporary bonding scheme
#1912Semiconductor device and a method of manufacturing the same
#1913Aluminum coated copper bond wire and method of making the same
#1914Semiconductor device with sealed semiconductor chip
#1915SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
#1916Electronic device with first and second contact pads and related methods
#1917Low profile wire bonded USB device
#1918Three-dimensional integrated circuit device fabrication including wafer scale membrane
#1919Embedded semiconductive chips in reconstituted wafers, and systems containing same
#1920Ball arrangement for integrated circuit package devices
#1921Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same
#1922Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#1923Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
#1924Semiconductor package
#1925Semiconductor chip with electrically conducting layer
#1926Semiconductor integrated circuit with TSV bumps
#1927Method of producing a transponder and a transponder
#1928Circuit connecting material and semiconductor device manufacturing method using same
#1929Wafer level semiconductor package and manufacturing methods thereof
#1930Aluminum coated copper ribbon
#1931Optically-masked microelectronic packages and methods for the fabrication thereof
#1932Stacked microelectronic devices
#1933Electronic device
#1934Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#1935Semiconductor device and semiconductor module
#1936Multi-die sensor device
#1937Method of forming a microelectronic device package
#1938Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#1939Packaging methods for semiconductor devices
#1940Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#1941Module IC package structure and method for manufacturing the same
#1942Semiconductor element
#1943Bump-on-trace methods and structures in packaging
#1944Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
#1945Post passivation interconnect structures and methods for forming the same
#1946SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#1947Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1948Method of wafer-scale integration of semiconductor devices and semiconductor device
#1949Optical-semiconductor device and method for manufacturing the same
#1950Die-to-die gap control for semiconductor structure and method
#1951Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#1952Semiconductor device and method for manufacturing the same
#1953Alignment marks in substrate having through-substrate via (TSV)
#1954SEMICONDUCTOR DEVICE
#1955Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1956Semiconductor package
#1957Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#1958Semiconductor Device and Method for Manufacturing Semiconductor Device
#1959Processes and structures for IC fabrication
#1960Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path
#1961Thin integrated circuit chip-on-board assembly
#1962Semiconductor device and manufacturing method thereof
#1963Submount, encapsulated semiconductor element, and methods of manufacturing the same
#1964SEMICONDUCTOR MODULE CARRYING THE SAME
#1965Integrated circuit package with spatially varied solder resist opening dimension
#1966Method of manufacturing a semiconductor package including a surface profile modifier
#1967Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
#1968Electrostatic discharge protection for modular equipment
#1969Chip package and packaging method
#1970Vertical semiconductor device with thinned substrate
#1971Isolation module for use between power rails in an integrated circuit
#1972Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#1973Plug via formation with grid features in the passivation layer
#1974Semiconductor device and method for manufacturing the same
#1975Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#19763D device packaging using through-substrate pillars
#1977DRIVER INTEGRATED CIRCUIT CHIP, DISPLAY DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING A DRIVER INTEGRATED CIRCUIT CHIP
#1978Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#1979Semiconductor device with layout of wiring layer and dummy patterns
#1980Flip chip assembly process for ultra thin substrate and package on package assembly
#1981Packaging DRAM and SOC in an IC package
#1982Semiconductor device assemblies including face-to-face semiconductor dice and related methods
#1983Assembly and a chip package
#1984LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNING AND REMOVAL
#1985Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#1986BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
#1987Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#1988Multiple access over proximity communication
#1989Through via package
#1990Wireless communication with dielectric medium
#1991Method of room temperature covalent bonding
#1992Optical coupling module
#1993Semiconductor laser structure
#1994Method of forming a memory device
#1995Integrated circuit package including in-situ formed cavity
#1996Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1997Package-on-package devices, methods of fabricating the same, and semiconductor packages
#1998Apparatus and methods for reducing impact of high RF loss plating
#1999Substrate, method of fabricating the same, and application the same
#20003D semiconductor device and structure
#2001Substrateless power device packages
#2002Method of chip positioning for multi-chip packaging
#2003Semiconductor device and method of forming pad layout for flipchip semiconductor die
#2004METHOD OF MANUFACTURING CHIP PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING CHIP PACKAGE
#2005Multilayer pillar for reduced stress interconnect and method of making same
#2006Semiconductor package with embedded die and its methods of fabrication
#2007Adhesive sheet and method for manufacturing semiconductor device
#2008Circuit board with corner hollows
#2009Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#2010Methods to fabricate a radio frequency integrated circuit
#2011Packaging methods and structures for semiconductor devices
#2012Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
#2013Structures and methods for improving solder bump connections in semiconductor devices
#2014Semiconductor device with layout of wiring layer and dummy patterns
#2015Image forming apparatus, chip, and chip package to reduce cross-talk between signals
#2016Strength of micro-bump joints
#2017Segmented bond pads and methods of fabrication thereof
#2018Multichip device including a substrate
#2019VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION
#2020Wafer scale package for high power devices
#2021Semiconductor device with combined passive device on chip back side
#2022Printed wiring board and method for manufacturing printed wiring board
#2023Organic module EMI shielding structures and methods
#2024Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#2025Semiconductor module
#2026Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer
#2027Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
#2028Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2029Semiconductor device and power supply unit utilizing the same
#2030Semiconductor device
#2031Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#2032Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
#2033Bonded semiconductor structures
#2034Microelectronic Assembly With Thermally and Electrically Conductive Underfill
#2035Electronic device with at least one impedance-compensating inductor and related methods
#2036Connection arrangement of an electric and/or electronic component
#2037On-chip interconnects with reduced capacitance and method of fabrication thereof
#2038Heat-transfer structure
#2039Thin wafer handling and known good die test method
#2040Packaging for high power integrated circuits and infrared emitter arrays
#2041Pin attachment
#2042Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#2043Package on-package process for applying molding compound
#2044Semiconductor device having low dielectric insulating film and manufacturing method of the same
#2045Device packaging with substrates having embedded lines and metal defined pads
#2046Methods of fluxless micro-piercing of solder balls, and resulting devices
#2047Bond pad stack for transistors
#2048Die-to-die inductive communication devices and methods
#2049Reliable microstrip routing for electronics components
#2050DE-POP ON-DEVICE DECOUPLING FOR BGA
#2051Semiconductor device and method of manufacturing same
#2052Semiconductor device and a method of manufacturing the same
#2053Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#2054Methods for the formation of a trap rich layer
#2055Package with solder regions aligned to recesses
#2056Semiconductor device having an inductor
#2057Vertical mount package and wafer level packaging therefor
#2058Copper post solder bumps on substrates
#2059Dual lead frame semiconductor package and method of manufacture
#2060Room temperature metal direct bonding
#2061Warp compensated electronic assemblies
#2062Semiconductor substrate and semiconductor chip
#2063Electric magnetic shielding structure in packages
#2064Pillar bumps and process for making same
#2065Semiconductor device and method for manufacturing the same
#2066Group III nitride based flip-chip integrated circuit and method for fabricating
#2067Slotted configuration for optimized placement of micro-components using adhesive bonding
#2068Semiconductor device with overlapped lead terminals
#2069Pillar design for conductive bump
#2070Semiconductor device and radio communication device
#2071Integrated circuit package with printed circuit layer
#2072SEMICONDUCTOR DEVICE
#2073Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
#2074Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
#2075Semiconductor package and method of manufacturing the same
#2076Component-embedded substrate manufacturing method
#2077Semiconductor device
#2078Testing probe head for wafer level testing, and test probe card
#2079Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#2080Semiconductor package with single sided substrate design and manufacturing methods thereof
#2081Semiconductor structure with sacrificial anode and passivation layer and method for forming
#2082Apparatus and method for embedding components in small-form-factor, system-on-packages
#2083Method and system for template assisted wafer bonding
#2084Semiconductor device comprising mold for top side and sidewall protection
#2085Semiconductor device and method of forming insulating layer around semiconductor die
#2086Bonding structure and method
#2087Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#2088Electronic module allowing fine tuning after assembly
#2089SEMICONDUCTOR PACKAGE HAVING INTEGRATED ANTENNA PAD
#2090Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP
#2091Chip package and manufacturing method thereof
#2092Stacked chip package and method for forming the same
#2093Methods of forming 3-D circuits with integrated passive devices
#2094Chip package and method for forming the same
#2095Chip package
#2096Microelectronic devices and methods for manufacturing microelectronic devices
#2097Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#2098Forming semiconductor chip connections
#2099Microelectromechanical device and a method of manufacturing
#2100Chip package and method for forming the same