Semiconductor package and method of manufacturing the same

IC package

Bonding method including adjusting surface contours of a bonding system

Printed three-dimensional (3D) functional part and method of making

Method for manufacturing display device using UV curable adhesive and display device manufactured by the method

Integrated circuit (IC) package with thick die pad functioning as a heat sink

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Method of manufacturing a semiconductor device including through silicon plugs

Embedded semiconductive chips in reconstituted wafers, and systems containing same

IC-package interconnect for millimeter wave systems

Semiconductor device and method of manufacturing same

Packaged semiconductor devices and methods of packaging semiconductor devices

Three dimensional device integration method and integrated device

Laser assisted transfer welding process

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

Method of making an electronic device including two-step encapsulation and related devices

Memory system topologies including a buffer device and an integrated circuit memory device

Methods and devices for miniaturization of high density wafer based electronic 3D multi-chip modules

Formation of solder and copper interconnect structures and associated techniques and configurations

Methods of manufacturing an integrated circuit having stress tuning layer

Method of making an electromagnetic interference shield for semiconductor chip packages

High-temperature cycling BGA packaging

Through substrate vias with improved connections

Integrated circuit with printed bond connections

Environmental hardened packaged integrated circuit

Electronic module with laterally-conducting heat distributor layer

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Multi-chips in system level and wafer level package structure

Interconnect structures for wafer level package and methods of forming same

Low-Temperature Bonding and Sealing With Spaced Nanorods

Integrated circuit device with plating on lead interconnection point and method of forming the device

Integrated circuit (IC) package with a solder receiving area and associated methods

Semiconductor package to reduce warping

Integrated circuit device with shaped leads and method of forming the device

Integrated circuits with backside metalization and production method thereof

Sleep mode initialization in a distributed computing system

Structure of battery protection circuit module package coupled with holder, and battery pack having same

Semiconductor device

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Method of forming semiconductor packages having through package vias

Embedded thin film magnetic carrier for integrated voltage regulator

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Proximity coupling of interconnect packaging systems and methods

Protrusion bump pads for bond-on-trace processing

Electronic packages and methods of making and using the same

SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS

Semiconductor device and measurement device

Memory devices with controllers under memory packages and associated systems and methods

Semiconductor package and method of forming the same

Semiconductor device

Integrated circuit packages and methods of forming same

Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles

Printed circuit board

Semiconductor device

Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods

Flip-chip bonder with induction coils and a heating element

Redistribution film for IC package

Method of filling probe indentations in contact pads

Reliability improvement of polymer-based capacitors by moisture barrier

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Semiconductor device and method of forming the same

Debond interconnect structures

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

SUBSTRATES AND INTEGRATED CIRCUIT CHIP WITH IMPROVED PATTERN

IO power bus mesh structure design

Heat spreader with wiring substrate for reduced thickness

Method of manufacturing a semiconductor device

Method of producing an interposer with microspring contacts

Method for attaching a semiconductor die to a carrier

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Semiconductor device

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

Package assembly and method for manufacturing the same

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Integrated circuit with electromagnetic energy anomaly detection and processing

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Methods of forming 3-D circuits with integrated passive devices

Method and apparatus for connecting packages onto printed circuit boards

Electronic device with first and second contact pads and related methods

Vertically integrated systems

Packaged semiconductor devices and packaging methods thereof

Semiconductor die mount by conformal die coating

Robust and Reliable Power Semiconductor Package

Improving the strength of micro-bump joints

Semiconductor memory device having pads

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Pop joint through interposer

IC module, dual IC card, and method for manufacturing IC module

Embedded package and method thereof

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Using interrupted through-silicon-vias in integrated circuits adapted for stacking

Discrete flexible interconnects for modules of integrated circuits

Circuit substrate interconnect

Through package circuit in fan-out wafer level package

Semiconductor device having markings and package on package including the same

Wafer level integration of passive devices

Packaged device with additive substrate surface modification

Edge coupling alignment using embedded features

Semiconductor constructions, and methods of forming cross-point memory arrays

Stacked semiconductor device assembly

Semiconductor package having cascaded chip stack

Method for low temperature bonding and bonded structure

Semiconductor device and a method of manufacturing the same

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Chip mounting

Method and a system for producing a semi-conductor module

Semiconductor devices and methods of manufacture thereof

Room temperature metal direct bonding

Integrated circuit packages and methods for forming the same

Systems and methods for mechanical and electrical package substrate issue mitigation

Test probe head for full wafer testing

Radio-frequency module component

SEMICONDUCTOR DEVICE HAVING TERMINALS FORMED ON A CHIP PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS AND MANUFACTURING METHOD THEREOF

Semiconductor device and a method of manufacturing the same

Package with UBM and methods of forming

Package with UBM and methods of forming

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias

Lead-Free Solder Alloy

Packages and methods of forming packages

Package structures and methods of forming

Multichip modules and methods of fabrication

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Interposer and semiconductor package with noise suppression features

Semiconductor device and a method of manufacturing the same

Semiconductor device comprising power elements in juxtaposition order

Patterned grounds and methods of forming the same

Semiconductor device and method of manufacturing the same

Hybrid carbon-metal interconnect structures

Semiconductor structure including a through electrode, and method for forming the same

Temporary bonding scheme

Method for fabricating electronic device package

Semiconductor modules and semiconductor packages

Islanded carrier for light emitting device

Batch process for connecting chips to a carrier

Low-noise flip-chip packages and flip chips thereof

Methods for solder for through-mold interconnect

EMI shield for high frequency layer transferred devices

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFENER FOR THIN CORE PANEL PROCESSING

High-frequency component and high-frequency module including the same

Light emitting device and method of manufacturing the same

Trap rich layer for semiconductor devices

Chip package and chip assembly

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Apparatus, systems and methods for limiting travel distance of a heat sink

Electrical connector between die pad and z-interconnect for stacked die assemblies

TEST CIRCUIT UNDER PAD

Memory device structure

Device and method for improving RF performance

SMD, IPD, and/or wire mount in a package

Semiconductor laser structure

Integrated millimeter wave transceiver

Selective die electrical insulation by additive process

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

Semiconductor device and manufacturing method thereof

Adhesive composition, adhesive sheet and production process for semiconductor device

Passive component integrated with semiconductor device in semiconductor package

Semiconductor package with integrated semiconductor devices and passive component

Substrate interconnections having different sizes

Methods of packaging semiconductor devices and packaged semiconductor devices

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor devices with recessed interconnects

Semiconductor wiring patterns

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Methods of fabricating QFN semiconductor package and metal plate

Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

Chip capacitors

Embedded component substrate and method for fabricating the same

Chip embedded substrate

Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Semiconductor chip assembly and method for making same

EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE

Packaging structural member

Wireless transmission and video integrated apparatus

Stacked chips attached to heat sink having bonding pads

Stacked IC control through the use of homogenous region

Method of forming an integrated circuit device including a pillar capped by barrier layer

Conductor structure for three-dimensional semiconductor device

Methods of packaging semiconductor devices and packaged semiconductor devices

Packaged semiconductor chips with array

Advanced structure for info wafer warpage reduction

Method of making a system-in-package device, and a system-in-package device

Combination of TSV and back side wiring in 3D integration

Method of forming inductor with conductive trace

Stack of integrated-circuit chips and electronic device

Semiconductor device and a method of manufacturing the same

Silicon shield for package stress sensitive devices

Pad design for reliability enhancement in packages

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Double-sided segmented line architecture in 3D integration

Recessed and embedded die coreless package

Three-dimensional semiconductor architecture

Phenolic polymers and photoresists comprising same

Radiation hardened by design digital input/output circuits and related methods

Interconnect structure with redundant electrical connectors and associated systems and methods

Apparatus and methods for high-density chip connectivity

Methods for surface attachment of flipped active components

Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRISING ALUMINUM NITRIDE INTERPOSER

Method for making semiconductor device with lead frame made from top and bottom components and related devices

Semiconductor device with encapsulated lead frame contact area and related methods

Circuit module and method of manufacturing the same

Semiconductor device with a semiconductor chip connected in a flip chip manner

Stack frame for electrical connections and the method to fabricate thereof

Micro electro mechanical system, semiconductor device, and manufacturing method thereof

Communication circuit with impedance matching

Package systems

Semiconductor package, printed circuit board substrate and semiconductor device

Power semiconductor package

3D IC method and device

Methods of manufacturing and operating die-to-die inductive communication devices

Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another

Stacked microelectronic assembly with TSVs formed in stages with plural active chips

Articles including bonded metal structures and methods of preparing the same

Semiconductor Package with Multiple Dies

High-frequency device including high-frequency switching circuit

Method of making a stacked microelectronic package

Embedded package and method thereof

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same

Conductive connections, structures with such connections, and methods of manufacture

Semiconductor device

INTEGRATED CIRCUIT

Multi-die, high current wafer level package

Gallium nitride power devices using island topography

Method of forming wafer-level molded structure for package assembly

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF

Bonding structures and methods of forming the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Device packaging with substrates having embedded lines and metal defined pads

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Wafer having pad structure

Semiconductor package and method for manufacturing the same

Integrated circuit system with debonding adhesive and method of manufacture thereof

Method of manufacturing a carrier tape

Semiconductor device and method of forming bump-on-lead interconnection

Electromagnetic bandgap structure for three dimensional ICS

Semiconductor device with combined passive device on chip back side

Integrated circuit package including miniature antenna

Method for low temperature bonding and bonded structure

Integrated circuit package and method of forming the same

INTEGRATED CIRCUIT CHIP AND DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

Multi-use substrate for integrated circuit

Chip-scale packaging with protective heat spreader

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Biocompatible packaging

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

3D integrated circuit package with through-mold first level interconnects

Multiple die layout for facilitating the combining of an individual die into a single die

Solder bump reflow by induction heating

Integrated electronic device with transceiving antenna and magnetic interconnection

Pattern between pattern for low profile substrate

Module comprising a semiconductor chip

Combined QFN and QFP semiconductor package

Composition of a solder, and method of manufacturing a solder connection

Manufacture of a circuit board and circuit board containing a component

Networking packages based on interposers

Semiconductor device with output circuit and pad arrangements

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Packages with metal line crack prevention design

Three dimensional device integration method and integrated device

Semiconductor device including a buffer layer structure for reducing stress

Integrated circuit chip and fabrication method

Semiconductor sensor device and method of producing a semiconductor sensor device

Through-silicon via with low-K dielectric liner

Semiconductor device and process for fabricating the same

Method of forming a semiconductor substrate including a cooling channel

Defective die replacement in a die stack

Protecting flip-chip package using pre-applied fillet

Flexible underfill compositions for enhanced reliability

Chip to dielectric waveguide interface for sub-millimeter wave communications link

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Power semiconductor package with a common conductive clip

Semiconductor device

Recessed semiconductor substrates and associated techniques

LPS solder paste based low cost fine pitch pop interconnect solutions

Electromagnetic interference shield for semiconductor chip packages

Space transformer

Inductor embedded in a package substrate

Apparatus with light emitting diodes

Semiconductor device

Semiconductor package with via-coupled power transistors

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Crack-stopping structure and method for forming the same

Metal electromagnetic interference (EMI) shielding coating along an edge of a ceramic substrate

Lead frame with mold lock structure

Novel 3D Integration Method using SOI Substrates and Structures Produced Thereby

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Electronic device including soldered surface-mount component

INTEGRATED CIRCUIT PACKAGE

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES

COF type semiconductor package and method of manufacturing the same