Programmable system in package

Semiconductor apparatus and method of producing the same

Method and apparatus for prevention of solder corrosion

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device with cooling member

Semiconductor device and method for fabricating the same

Underfill film having thermally conductive sheet

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Modularized Die Stacking System and Method

Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same

Semiconductor device package with groove

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Stacked die semiconductor device having circuit tape

Stacked multi-chip package with EMI shielding

Reduction in thickness of semiconductor component on substrate

METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR

Electronic component package with EMI shielding

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

Packaged microelectronic components with terminals exposed through encapsulant

Techniques for providing decoupling capacitance

Electronic packages with fine particle wetting and non-wetting zones

Printed circuit board for package and manufacturing method thereof

Retinal prosthesis and method of manufacturing a retinal prosthesis

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Perimeter matrix ball grid array circuit package with a populated center

Amide-substituted silicones and methods for their preparation and use

Configurable IC with logic resources with offset connections

Semiconductor package and fabrication method thereof

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

Packaging board, semiconductor module, and portable apparatus

Packaging structure

Method for producing a circuit module comprising at least one integrated circuit

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Packaged stacked semiconductor device and method for manufacturing the same

Multi-layer printed wiring board and manufacturing method thereof

Flexible core for enhancement of package interconnect reliablity

Method of manufacturing a semiconductor device

Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same

Map type semiconductor package

Microelectronic devices and methods for manufacturing microelectronic devices

Printed circuit board

Passive component and electronic component module

IC package with a protective encapsulant and a stiffening encapsulant

Stacking integrated circuit dies

Semiconductor device, relay chip, and method for producing relay chip

Flip-Chip Ball Grid Array Strip and Package

Semiconductor package having non-aligned active vias

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR BALL GRID ARRAY PACKAGE

Flexible core for enhancement of package interconnect reliability

Chip package and method for fabricating the same

POP package and method of fabricating the same

Stacked die packages

SEMICONDUCTOR STACK PACKAGE FOR OPTIMAL PACKAGING OF COMPONENTS HAVING INTERCONNECTIONS

Multi-chip package with spacer for blocking interchip heat transfer

Embedded package in package

Stacked-die electronics package with planar and three-dimensional inductor elements

Semiconductor device and manufacturing method thereof

Semiconductor package and method therefor

Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Epoxy-Based Compositions Having Improved Impact Resistance

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Adhesion by plasma conditioning of semiconductor chip

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Top layers of metal for high performance IC's

Stacked structure of chips and water structure for making the same

Metal core foldover package structures

Module and mounted structure using the same

Semiconductive device having improved copper density for package-on-package applications

Package for an implantable neural stimulation device

Plastic housing and semiconductor component with said plastic housing

Top layers of metal for integrated circuits

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Chip carrier and fabrication method

Semiconductor package having laser-embedded terminals

Circuit substrate and semiconductor device

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

Semiconductor device

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

REINFORCED SEMICONDUCTOR PACKAGE AND STIFFENER THEREOF

Integrated circuit package with a heat dissipation device

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Package for semiconductor devices

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor device and manufacturing method of the same

Stack type ball grid array package and method for manufacturing the same

Stackable ceramic FBGA for high thermal applications

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

Integrated circuit package system with waferscale spacer

Multilayered printed circuit board, solder resist composition, and semiconductor device

Interconnect for improved die to substrate electrical coupling

Chip package and method for fabricating the same

Microphone module and method for fabricating the same

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Semiconductor device and method of manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Package structure and heat sink module thereof

Package unit

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Multi-chip structure

Method for producing a module with components stacked one above another

Package substrate

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Structure and method of making sealed capped chips

Integrated circuit package system with down-set die pad and method of manufacture thereof

Method for fabricating chip-stacked semiconductor package

Method of fabricating a stacked die having a recess in a die BGA package

Method of fabricating microelectronic devices

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Capacitor built-in interposer and method of manufacturing the same and electronic component device

Versatile Si-based packaging with integrated passive components for mmWave applications

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Structure and method of making lidded chips

METHOD FOR SEPARATING PACKAGE OF WLP

Integrated circuit package system with molding vents

Interposer and semiconductor package with reduced contact area

Semiconductor package device

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Integrated circuit package-on-package stacking system

Semiconductor device

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Semiconductor device and operation control method of semiconductor device

Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Electronic packages with roughened wetting and non-wetting zones

Substrate structure integrated with passive components

Methods for providing and using grid array packages

Silicon-based thin substrate and packaging schemes

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board

Semiconductor device and manufacturing method for the same

Substrate structure integrated with passive components

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Package structure having semiconductor chip embedded therein and method for fabricating the same

Component packaging apparatus, systems, and methods

Semiconductor package

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Array-Processed Stacked Semiconductor Packages

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Substrate having stiffener fabrication method

Configurable IC with configuration logic resources that have asymmetric inputs and/or outputs

Semiconductor device and method for manufacturing same

Leaded stacked packages having elevated die paddle

Capillary underflow integral heat spreader

Semiconductor device and manufacturing method therefor

Stack type semiconductor package and method of fabricating the same

Electronic circuit in a package-on-package configuration and method for producing the same

Hybrid Microelectronic Package

Chip package structure and manufacturing method thereof

Integrated circuit package system with laminate base

Leaded stacked packages having integrated upper lead

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package

Interposer and electronic device using the same

Method, device and system for controlling heating circuits

Materials-based failure analysis in design of electronic devices, and prediction of operating life

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

Integrated circuit module

Wiring substrate, semiconductor device, and method of manufacturing the same

Chip structure with redistribution traces

Cooling module against ESD and electronic package, assembly and system using the same

Integrated circuit heat spreader stacking method

Semiconductor component and method for producing the same

SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor package and fabrication method thereof

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Semiconductor device

Integrated circuit package system including wafer level spacer

Build-up printed wiring board substrate having a core layer that is part of a circuit

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Auto connection assignment system and method

Memory systems and memory modules

Method of forming a semiconductor device

Structure of high performance combo chip and processing method

PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Superfine-circuit semiconductor package structure

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Integrated circuit package-in-package system

Package mounted module

Integrated circuit packaging system with ultra-thin die

Semiconductor package, method of production of same, printed circuit board, and electronic apparatus

Semiconductor device

Method for fabricating a wafer level package with device wafer and passive component integration

Wafer-level bonding for mechanically reinforced ultra-thin die

Wafer-level assembly of heat spreaders for dual IHS packages

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

Integrated microelectronic package temperature sensor

Structure and method of making lidded chips

Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

Integrated circuit incorporating wire bond inductance

Semiconductor device, wiring board, and manufacturing method thereof

Flip-chip package structure with stiffener

Semiconductor device comprising chip on chip structure

Stacked, interconnected semiconductor packages

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

Semiconductor package having embedded passive elements and method for manufacturing the same

Stack package with vertically formed heat sink

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Semiconductor package having optimal interval between bond fingers for reduced substrate size

System-in-package structure

Heat spreader as mechanical reinforcement for ultra-thin die

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

SINGLE PACKAGE DETECTOR AND DIGITAL CONVERTER INTEGRATION

Structure and method of making lidded chips

Method for producing an organic substrate with integral thermal dissipation channels

Die configurations and methods of manufacture

Manufacturing method package substrate

System and apparatus for power distribution for a semiconductor device

High-frequency module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stack

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having heat spreader with center opening

Package Using Selectively Anodized Metal and Manufacturing Method Thereof

Compliant integrated circuit package substrate

Microelectronic package including temperature sensor connected to the package substrate and method of forming same

Semiconductor apparatus with decoupling capacitor

In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

Semiconductor device, manufacturing method and apparatus for the same

Heat spreader for use in conjunction with a semiconducting device and method of manufacturing same

Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Manufacturing method of semiconductor device

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

Methods for manufacturing a sensor assembly

Stacked semiconductor device

IC packages with internal heat dissipation structures

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Circuit module for use in digital television receiver for receiving digital television broadcasting wave signal

Micro power converter and method of manufacturing same

Integrated circuit and method for writing information

Integrated circuit (IC) package stacking and IC packages formed by same

Top layers of metal for high performance IC's

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Printed circuit board for package of electronic components and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME

Carbon dioxide gettering method for a chip module assembly

Printed circuit board and circuit structure for power supply

Thermal improvement for hotspots on dies in integrated circuit packages

Carrier for stacked type semiconductor device and method of fabricating the same

Nested integrated circuit package on package system

MULTI-CHIP PACKAGE STRUCTURE

Semiconductor device having a multi-layered semiconductor substrate

Stacked packages and microelectronic assemblies incorporating the same

Chip system architecture for performance enhancement, power reduction and cost reduction

Semiconductor Device and Method for Manufacturing the Same

Light emitting diode module

Semiconductor device and method for manufacturing same

Package-on-package system

Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device

Coreless cavity substrates for chip packaging and their fabrication

Top layers of metal for high performance IC's

Fabrication method of semiconductor integrated circuit device

Stacked Chips with Underpinning

Phase change material containing fusible particles as thermally conductive filler

Semiconductor memory apparatus

Magnetic shielding for magnetic random access memory

Wiring Board and Semiconductor Device

Thermally enhanced memory module

Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Computer systems having an interposer including a flexible material