212622 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
System on package of a mobile RFID interrogator
#11102STACKED CHIP PACKAGE
#11103Top layers of metal for high performance IC's
#11104Top layers of metal for high performance IC's
#11105Top layers of metal for high performance IC's
#11106Top layers of metal for high performance IC's
#11107Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#11108Semiconductor device having improved contacts
#11109Top layers of metal for high performance IC's
#11110Semiconductor Device
#11111Method of making thermally enhanced substrate-base package
#11112Semiconductor structure and method for forming the same
#11113Stacked die package system
#11114Assembly having stacked die mounted on substrate
#11115System-in-package device
#11116Interconnections resistant to wicking
#11117SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#11118Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
#11119SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
#11120Advanced multilayer coreless support structures and method for their fabrication
#11121Top layers of metal for high performance IC's
#11122Top layers of metal for high performance IC's
#11123Top layers of metal for high performance IC's
#11124Top layers of metal for high performance IC's
#11125Method for manufacturing wiring board
#11126METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#11127Chip stack package and manufacturing method thereof
#11128Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#11129Semiconductor device
#11130Top layers of metal for high performance IC's
#11131Top layers of metal for high performance IC's
#11132Top layers of metal for high performance IC's
#11133Top layers of metal for high performance IC's
#11134Top layers of metal for high performance IC's
#11135Top layers of metal for high performance IC's
#11136Top layers of metal for high performance IC's
#11137Top layers of metal for high performance IC's
#11138Top layers of metal for high performance IC's
#11139Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device
#11140Process to reform a plastic packaged integrated circuit die
#11141Ball grind array package structure
#11142Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the Same
#11143Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
#11144Chip stack, method of fabrication thereof, and semiconductor package having the same
#11145Modular bonding pad structure and method
#11146Method of manufacturing an electronic component package
#11147Package mounted module and package board module
#11148Semiconductor device having a bonding wire and method for manufacturing the same
#11149Stacked package electronic device
#11150SEMICONDUCTOR DEVICE
#11151Semiconductor device stack and method for its production
#11152Leadframe IC packages having top and bottom integrated heat spreaders
#11153Compensation for far end crosstalk in data buses
#11154Separation method of semiconductor device
#11155Wiring board, semiconductor device, and method for manufacturing wiring board
#11156Semiconductor device and method of manufacturing thereof
#11157Interconnect structure and formation for package stacking of molded plastic area array package
#11158Printed wiring board and manufacturing method thereof
#11159Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#11160Top layers of metal for high performance IC's
#11161Top layers of metal for high performance IC's
#11162Top layers of metal for high performance IC's
#11163Top layers of metal for high performance IC's
#11164Top layers of metal for high performance IC's
#11165Top layers of metal for high performance IC's
#11166Top layers of metal for high performance IC's
#11167Top layers of metal for high performance IC's
#11168Top layers of metal for high performance IC's
#11169Top layers of metal for high performance IC's
#11170Integrated circuit package having exposed thermally conducting body
#11171Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
#11172METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#11173Electronic device substrate, electronic device and methods for making same
#11174Electronic device substrate, electronic device and methods for fabricating the same
#11175Heatspreader for single-device and multi-device modules
#11176SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
#11177SEMICONDUCTOR PACKAGE
#11178Dual-sided chip attached modules
#11179Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
#11180Semiconductor device and method of manufacturing the same
#11181No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#11182Top layers of metal for high performance IC's
#11183Method for fabricating three-dimensional all organic interconnect structures
#11184Printed wiring board and its manufacturing method
#11185Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#11186MEMORY ARRANGEMENT
#11187Wiring board
#11188Method for fabricating semiconductor package with multi-layer die contact and external contact
#11189Semiconductor device having a chip stack on a rewiring plate
#11190Semiconductor Device and Method of Fabricating the Same
#11191Top layers of metal for high performance IC's
#11192Top layers of metal for high performance IC's
#11193Top layers of metal for high performance IC's
#11194Top layers of metal for high performance IC's
#11195Top layers of metal for high performance IC's
#11196Top layers of metal for high performance IC's
#11197Stack MCP and manufacturing method thereof
#11198Semiconductor device and chip structure thereof
#11199Electronic device with integrated heat distributor
#11200Heat sink structure for embedded chips and method for fabricating the same
#11201COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#11202Semiconductor device with temperature cycle life improved
#11203Method of fabricating microelectronic devices
#11204INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#11205SEMICONDUCTOR DEVICE
#11206Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same
#11207Process for fabricating chip package structure
#11208Printed circuit board
#11209High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
#11210Hybrid configurable circuit for a configurable IC
#11211Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#11212Methods of forming blind wafer interconnects, and related structures and assemblies
#11213Wafer level stack structure for system-in-package and method thereof
#11214Multiple chip package module and method of fabricating the same
#11215Chip Module Having Solder Balls Coated with a Thin Cast Polymer Barrier Layer for Corrosion Protection and Reworkability, and Method for Producing Same
#11216Heat resistant substrate incorporated circuit wiring board
#11217Method of making wirebond electronic package with enhanced chip pad design
#11218Method for manufacturing stacked package structure
#11219Semiconductor package-on-package system including integrated passive components
#11220Attaching heat sinks to integrated circuit packages
#11221INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#11222Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#11223Memory package structure
#11224Stacked die packages
#11225SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME
#11226PACKAGE-ON-PACKAGE STRUCTURES
#11227Structure of electronic package and printed circuit board thereof
#11228Circuit apparatus and method of fabricating the apparatus
#11229Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber
#11230Selective, hermetically sealed microwave package apparatus and methods
#11231Polymer matrices for polymer solder hybrid materials
#11232PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC
#11233Method for fabricating semiconductor package free of substrate
#11234Carrierless chip package for integrated circuit devices, and methods of making same
#11235Method for fabricating multi-chip semiconductor package
#11236Method of making circuitized substrate with internal organic memory device
#11237Inductor element and method for production thereof, and semiconductor module with inductor element
#11238Integrated circuit devices with stacked package interposers
#11239Thermally enhanced BGA package with ground ring
#11240Utra-thin substrate package technology
#11241Die protection process
#11242Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#11243Ball Grid array package structure
#11244Embedded integrated circuit package-on-package system
#11245Stack structure of semiconductor packages and method for fabricating the stack structure
#11246MULTI-DIE INDUCTOR
#11247Memory circuit having memory chips parallel connected to ports and corresponding production method
#11248Method for manufacturing a programmable system in package
#11249Configurable IC with configurable routing resources that have asymmetric input and/or outputs
#11250Method of manufacturing a through electrode
#11251POP Semiconductor Device Manufacturing Method
#11252Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
#11253Thin semiconductor device package
#11254Multilayer wiring board
#11255Configurable IC's with logic resources with offset connections
#11256Configurable IC with interconnect circuits that also perform storage operations
#11257Variable width management for a memory of a configurable IC
#11258Clock distribution in a configurable IC
#11259Hybrid logic/interconnect circuit in a configurable IC
#11260Embedding memory within tile arrangement of a configurable IC
#11261ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME
#11262Programmable system in package
#11263Stacked integrated circuit package-in-package system
#11264Electronic component device
#11265Electronic component package
#11266Stacked integrated circuit package-in-package system
#11267MULTICHIP PACKAGE SYSTEM
#11268Stacked semiconductor device
#11269Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#11270Adhesive sheet, semiconductor device, and process for producing semiconductor device
#11271Multilayer printed wiring board and component mounting method thereof
#11272Methods of Fabricating Application Specific Integrated Circuit (ASIC) Devices that Include Both Pre-Existing and New Integrated Circuit Functionality and Related ASIC Devices
#11273Stratified underfill in an IC package
#11274Chip carrier and fabrication method
#11275Semiconductor device
#11276Surface structure of flip chip substrate
#11277Semiconductor device and method for fabricating the same
#11278Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device
#11279Hybrid stacking package system
#11280High frequency IC package and method for fabricating the same
#11281Common Assembly Substrate and Applications Thereof
#11282Semiconductor module having discrete components and method for producing the same
#11283Hybrid flip-chip and wire-bond connection package system
#11284Integrated circuit package system with heatspreader
#11285METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS
#11286Packaged system of semiconductor chips having a semiconductor interposer
#11287Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation
#11288Integrated circuit package system with net spacer
#11289Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#11290Multichip package system
#11291Multiple flip-chip integrated circuit package system
#11292Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
#11293Semiconductor device having adhesion increasing film to prevent peeling
#11294Semiconductor device and manufacturing method thereof
#11295Cured mold compound spacer for stacked-die package
#11296Covered devices in a semiconductor package
#11297Semiconductor device fabricating method
#11298Methods of forming semiconductor assemblies
#11299Semiconductor device manufacturing method
#11300Flexible interconnect pattern on semiconductor package
#11301Reducing layer count in semiconductor packages
#11302Flip chip bonding structure
#11303Circuit board and electronic apparatus having the same
#11304Adjustable thickness thermal interposer and electronic package utilizing same
#11305Circuit device
#11306Stacked integrated circuit package system with connection protection
#11307Method and architecture for power management of an electronic device
#11308UNIVERSAL CHIP PACKAGE STRUCTURE
#11309SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#11310Ball grid array housing having a cooling foil
#11311Flip chip bonded package applicable to fine pitch technology
#11312High-performance semiconductor package
#11313Semiconductor device and manufacturing method thereof
#11314Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer
#11315Multi-chip package for reducing parasitic load of pin
#11316Semiconductor package stack with through-via connection
#11317Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#11318Stacked integrated circuit
#11319Integrated circuit die with pedestal
#11320Folding chip planar stack package
#11321Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#11322Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#11323Multilayer printed circuit board
#11324Method of packaging integrated circuit devices using preformed carrier
#11325Reactive foil assembly
#11326Semiconductor device
#11327Device for avoiding parasitic capacitance in an integrated circuit package
#11328RF and MMIC stackable micro-modules
#11329Chip package
#11330Stacked semiconductor device
#11331Stack package utilizing through vias and re-distribution lines
#11332Semiconductor package structure
#11333Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#11334Semiconductor device
#11335Optoelectronic semiconductor device and light signal input/output device
#11336Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
#11337Signal transmission structure, package structure and bonding method thereof
#11338Multilayer interconnection substrate, semiconductor device, and solder resist
#11339Stacked integrated circuit package-in-package system
#11340Method of manufacturing wafer level stack package
#11341Manufacturing method of a semiconductor device
#11342Manufacturing method of semiconductor device
#11343Microelectronic devices and methods for manufacturing microelectronic devices
#11344Method for producing semiconductor components
#11345Flip-chip type semiconductor device
#11346Carrierless chip package for integrated circuit devices, and methods of making same
#11347LAMINATED IC PACKAGING SUBSTRATE AND INTER-CONNECTOR STRUCTURE THEREOF
#11348Integrated circuit package system
#11349Semiconductor package with heat spreader
#11350Low profile semiconductor package-on-package
#11351Multichip package system
#11352Integrated circuit package on package system
#11353Integrated circuit package-in-package system
#11354Semiconductor device
#11355Semiconductor package containing multi-layered semiconductor chips
#11356Leadless leadframe implemented in a leadframe-based BGA package
#11357Chip package and wafer treating method for making adhesive chips
#11358Chip packaging structure for improving reliability
#11359Image sensor package structure
#11360Semiconductor device and manufacture method thereof
#11361Method for manufacturing semiconductor device
#11362MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
#11363Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems
#11364Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
#11365Integrated circuit package on package system
#11366Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods
#11367Board on chip package and manufacturing method thereof
#11368Stacked microelectronic device assemblies
#11369Integrated device having a plurality of chip arrangements and method for producing the same
#11370Stacked integrated circuits package system with passive components
#11371Die stack system and method
#11372Gold-bumped interposer for vertically integrated semiconductor system
#11373Integrated circuit package system
#11374Integrated circuit package in package system
#11375Chip carrier with reduced interference signal sensitivity
#11376Semiconductor device
#11377Integrated circuit leaded stacked package system
#11378Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#11379Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#11380Methods of making microelectronic assemblies
#11381Ball grid array substrate having window and method of fabricating same
#11382NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
#11383Integrating a heat spreader with an interface material having reduced void size
#11384Stacked semiconductor device and device stacking method
#11385SEMICONDUCTOR DEVICE WITH BATTERY
#11386Semiconductor device having capacitors for reducing power source noise
#11387PACKAGE WARPAGE CONTROL
#11388Microelectonic packages and methods therefor
#11389Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means
#11390Chip-size package structure and method of the same
#11391Thin film capacitor device used for a decoupling capacitor and having a resistor inside
#11392Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#11393MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#11394Method of providing a via opening in a dielectric film of a thin film capacitor
#11395Capacitor attachment method
#11396Method for manufacturing semiconductor device
#11397Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications
#11398Semiconductor device and method of manufacturing semiconductor device
#11399Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
#11400Stackable integrated circuit package system with multiple interconnect interface