Stacked-die packages with silicon vias and surface activated bonding

METHOD FOR FABRICATING A CIRCUIT

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

Structure of dielectric layers in built-up layers of wafer level package

Heat dissipating chip structure and fabrication method thereof and package having the same

Semiconductor Package With Rigid And Flexible Circuits

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of Manufacturing a Semiconductor Packages and Packages Made

Semiconductor package on package having plug-socket type wire connection between packages

Semiconductor device having improved wiring

Thermal spacer for stacked die package thermal management

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

Inverted lead frame in substrate

Microelectronic packages having improved input/output connections and methods therefor

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, MOUNTING STRUCTURE OF MULTI-CHIP MODULE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE

Method of fabricating a shielded stacked integrated circuit package system

Semiconductor device having through vias

Method for incorporating existing silicon die into 3D integrated stack

Trenched shield gate power semiconductor devices and methods of manufacture

System-in-package having reduced influence between conductor and antenna and method of designing the same

Multilayer wiring board and power supply structure to be embedded in multilayer wiring board

Printed wiring board

Method of manufacturing multi-layer printed circuit board

Integrated circuit device mounting with folded substrate and interposer

Top layers of metal for high performance IC's

METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP

Semiconductor package, manufacturing method thereof and IC chip

Electronic package

Memory Module Including A Plurality Of Integrated Circuit Memory Devices And A Plurality Of Buffer Devices In A Matrix Topology

Circuit board and manufacturing method thereof

Printed circuit board

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Interposer and electronic device using the same

Ceramic package substrate with recessed device

Circuit device with at least partial packaging and method for forming

Three-dimensional package and method of making the same

Stress management in BGA packaging

SEMICONDUCTOR DEVICE

Semiconductor package

CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP

Semiconductor assembly for improved device warpage and solder ball coplanarity

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Stacked package and method for manufacturing the package

Integrated circuit package system with thermo-mechanical interlocking substrates

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate

Semiconductor device package diepad having features formed by electroplating

Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles

Multipurpose decapsulation holder and method for a ball grid array package

Integrated Circuit Packaging Using Electrochemically Fabricated Structures

Printed circuit board

Manufacturing method of semiconductor device

Methods of making power semiconductor devices with thick bottom oxide layer

Die positioning for packaged integrated circuits

Semiconductor device and fabrication method thereof

Chip scale package structure with metal pads exposed from an encapsulant

METHOD OF MANUFACTURING MULTI-STACK PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Liquid metal thermal interface material system

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Stacked die in die BGA package

Method for manufacturing semiconductor device and semiconductor device

Direct via wire bonding and method of assembling the same

Method of manufacturing hybrid structure of multi-layer substrates

Semiconductor device and method of manufacturing the same

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Semiconductor device

Integrated circuit package with improved power signal connection

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stackable integrated circuit package system

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Multi-layer semiconductor package

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Carrierless chip package for integrated circuit devices, and methods of making same

Power semiconductor devices having termination structures and methods of manufacture

Method for fabricating an interposer

Packaged microelectronic devices and methods for packaging microelectronic devices

Semiconductor chip package and method for fabricating the same

Reverse build-up process for fine bump pitch approach

Epoxy resin composition and semiconductor package including the same

Microchip assembly including an inductor and fabrication method

Using the wave soldering process to attach motherboard chipset heat sinks

Semiconductor device

Method and apparatus for performing shifting in an integrated circuit

Epoxy resin composition for encapsulating semiconductor and semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Semiconductor device including microstrip line and coplanar line

Semiconductor device and method of manufacturing the same

Interconnects with Direct Metalization and Conductive Polymer

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

System-in-package (SiP) and method of manufacturing the same

Semiconductor device having elastic solder bump to prevent disconnection

Stacked die package

High I/O semiconductor chip package and method of manufacturing the same

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Carbon dioxide gettering for a chip module assembly

Semiconductor device

Semiconductor device and printed circuit board

Carrier structure embedded with semiconductor chip

Flip chip semiconductor die internal signal access system and method

Flip-chip mounting resin composition and bump forming resin composition

Method manufacturing wiring substrate

Compact chip package macromodels for chip-package simulation

Method for decapsulating package

Packaging substrate and manufacturing method thereof

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

Multilayer wiring board and its manufacturing method

Optically connectable circuit board with optical component(s) mounted thereon

Circuit board including stubless signal paths and method of making same

Bonding structures and methods of forming bonding structures

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

Semiconductor device with no base member and method of manufacturing the same

Heat dissipating semiconductor package and fabrication method therefor

Thermally enhanced semiconductor package

Integrated circuit package system with pedestal structure

SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION

STACKED CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Semiconductor device package

Member for semiconductor device and production method thereof

Collective and synergistic MRAM shields

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

Top layers of metal for integrated circuits

Interposer, semiconductor chip mounted sub-board, and semiconductor package

WAFER SCALE THIN FILM PACKAGE

Mold array process for chip encapsulation and substrate strip utilized

METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT

Semiconductor chip module

Information handling system utilizing circuitized substrate with split conductive layer

Flexible interconnect cable for an electronic assembly

Embedding memory within tile arrangement of an integrated circuit

Ball grid array package assembly with integrated voltage regulator

CONDUCTOR POLYMER COMPOSITE CARRIER WITH ISOPROPERTY CONDUCTIVE COLUMNS

Methods for manufacturing thermally enhanced flip-chip ball grid arrays

MULTI-CHIP STRUCTURE

Self-aligned through vias for chip stacking

BGA package with encapsulation on bottom of substrate

Heatplates for heatsink attachment for semiconductor chips

Embedded chip package with improved heat dissipation performance and method of making the same

Wafer level package with die receiving cavity and method of the same

Semiconductor package having structure for warpage prevention

Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package

Semiconductor package having improved heat spreading performance

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME

ELECTRONIC DEVICE

Method of making multi-chip package with high-speed serial communications between semiconductor dice

Method for manufacturing electronic component, and electronic component

Systems and arrangements to assess thermal performance

Method of testing a multichip

PATTERN FILM, METHOD OF MANUFACTURING THE PATTERN FILM, AND PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE PATTERN FILM

Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuit

Flip chip and wire bond semiconductor package

Integrated circuit chips with fine-line metal and over-passivation metal

Electronic assembly with hot spot cooling

Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same

Semiconductor package

Integration using package stacking with multi-layer organic substrates

Semiconductor device package

Multi stack package and method of fabricating the same

Melting temperature adjustable metal thermal interface materials and application thereof

Device for controlling a vehicle

Method for fabricating semiconductor package free of substrate

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Structure of image sensor module and method for manufacturing of wafer level package

Multilayered printed wiring board with a multilayered core substrate

OPTICALLY CONNECTABLE CIRCUIT BOARD WITH OPTICAL COMPONENT(S) MOUNTED THEREON

Optically connectable circuit board with optical component(s) mounted thereon

Wiring board and method of manufacturing the same

Multi-configuration processor-memory substrate device

Combined heat sink multi-configuration processor memory substrate device

Method of using a camera module

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Package structure and package substrate thereof

Semiconductor assembly with one metal layer after base metal removal

Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

Fan out type wafer level package structure and method of the same

Semiconductor module including components in plastic casing

Stacked integrated circuit package-in-package system

CHIP PACKAGE

Sensor-type semiconductor package and fabrication

PRINTED CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR DEVICE PACKAGE, AND METHOD OF TESTING AND FABRICATING SEMICONDUCTOR DEVICE PACKAGE USING THE SAME

Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof

Substrate with lossy material insert

Method of making multi-chip electronic package with reduced line skew

Method of manufacturing a circuit board

Variable width writing to a memory of an IC

Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

Resilient carrier assembly for an integrated circuit

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Low fabrication cost, high performance, high reliability chip scale package

Packaged microelectronic devices and methods for packaging microelectronic devices

Packaging with base layers comprising alloy 42

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer stacked package having vertical heat emission path and method of fabricating the same

Method and apparatus of power ring positioning to minimize crosstalk

Structure of package on package and method for fabricating the same

Insertion-type semiconductor device and fabrication method thereof

Die-up integrated circuit package with grounded stiffener

Semiconductor device and method of manufacturing the same

Ball grid array package structure

Semiconductor device, method of manufacturing the same

Semiconductor element, semiconductor device and mounting board

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Ultra-thin oxide bonding for S1 to S1 dual orientation bonding

Resin composition for semiconductor encapsulation and semiconductor device

Chip packaging process

Semiconductor chip package manufacturing method and structure thereof

Stacked die with a recess in a die BGA package

Stacked chip package and method for forming the same

Ball grid array package and method thereof

Low profile ball grid array (BGA) package with exposed die and method of making same

Embedded capacitors for reducing package cracking

Method of treating the surface of copper and copper

Partial Solder Mask Defined Pad Design

Semiconductor package and fabrication process thereof

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Cooled Integrated Circuit

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Passive placement in wire-bonded microelectronics

Encapsulation type semiconductor device and manufacturing method thereof

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

Epoxy compositions

Method for fabricating heat dissipating package structure

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Semiconductor package and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

Semiconductor integrated circuit device

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

SIP package with small dimension

CHIP PACKAGE STRUCTURE

Package on package and method thereof

Micro BGA package having multi-chip stack

Semiconductor device having recessed connector portions

Semiconductor package preventing generation of static electricity therein

Materials, structures and methods for microelectronic packaging

Integrated Circuit with Back Side Conductive Paths

Film type package for fingerprint sensor

3D chip arrangement including memory manager

ELECTRONIC APPARATUS

Method for producing a semiconductor component and substrate for carrying out the method

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wiring board

Thermally Enhanced BGA Packages and Methods

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device

Edge connect wafer level stacking

Stacked structures and methods of fabricating stacked structures

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Wiring board and semiconductor device

Electronic device including a nickel-palladium alloy layer

Memory system topologies including a buffer device and an integrated circuit memory device

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Substrate slot design for die stack packaging

Electronic device and method of manufacturing the same

Electronic device and method of manufacturing the same

Electronic device and method of manufacturing the same

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Die arrangement and method for producing a die arrangement

Circuit board arrangement and method for producing a circuit board arrangement

Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same

Sensor-type package and fabrication method thereof

Device mounting board and semiconductor module

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Circuit arrangement

Elimination of RDL using tape base flip chip on flex for die stacking

Semiconductor device and manufacturing method thereof

Electronic device and method for production

Semiconductor device and method of manufacturing the same

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Semiconductor device and method for manufacturing the same

Multiple integrated circuit die package with thermal performance

Semiconductor package and semiconductor system in package using the same

Interposer and method for manufacturing the same

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Fabrication method of semiconductor integrated circuit device

Set of resin compositions for preparing system-in-package type semiconductor device