Circuit board apparatus, circuit component reinforcing method and electronic device

Wiring board with connection electrode formed in opening and semiconductor device using the same

Stackable integrated circuit package system

Chip underfill in flip-chip technologies

Heat sink for semiconductor package

Thermally-enhanced ball grid array package structure and method

Chip stack package

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

Wafer-leveled chip packaging structure and method thereof

Flip chip in package using flexible and removable leadframe

Method of resin sealing electronic part

Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

Memory module with memory stack and interface with enhanced capabilities

Memory module device

Multi-layer board with decoupling function

Integrated circuit package system with bonding lands

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Stacked semiconductor memory device and control method thereof

Semiconductor device

Memory module comprising an electronic printed circuit board and a plurality of semiconductor components and method

Substrate for semiconductor device and semiconductor device

Substrate having a functionally gradient coefficient of thermal expansion

Ball grid array package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic circuit, a semiconductor device and a mounting substrate

Arrangement of non-signal through vias and wiring board applying the same

Semiconductor package including transformer or antenna

Chip package and stacked structure of chip packages

Integrated circuit package system with die on base package

Stacked integrated circuit package-in-package system with recessed spacer

Semiconductor module and method of manufacturing the same

Semiconductor device

Apparatus and methods for high-density chip connectivity

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Microcomputer having memory interface circuits and memory devices on a module board

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Method for manufacturing a substrate with cavity

Semiconductor chip package having an adhesive tape attached on bonding wires

Integrated circuit package system with exposed interconnects

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Image sensor packaging structure and method of manufacturing the same

Structured integrated circuit device

Package on package design a combination of laminate and tape substrate, with back-to-back die combination

Connection structure and method for fabricating the same

Method of fabricating a 3-D package stacking system

Semiconductor device

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Stacked chip semiconductor device and method for manufacturing the same

Coreless substrate and manufacturing thereof

RFIC die and package

Semiconductor device

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Method for fabricating semiconductor package

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device having a bump formed over an electrode pad

Integrated circuit package system including zero fillet resin

Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

Semiconductor device with an improved solder joint

Stacked integrated circuit package system with face to face stack configuration

Semiconductor device package and methods for producing same

Stacked semiconductor device

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Semiconductor device and manufacturing method thereof

Passive impedance equalization of high speed serial links

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Thermal enhanced package

Semiconductor device and method of manufacturing thereof

Wiring board and semiconductor apparatus

Plastic ball grid array package with integral heatsink

Integrated circuit underfill package system

Multi stack package with package lid

Semiconductor package

Waferscale package system

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Multi-chips stacked package

Semiconductor module having a semiconductor chip stack and method

Stack of semiconductor chips

High performance chip carrier substrate

Method of manufacturing multi-layer wiring board

Manufacturing method of semiconductor device

Methods for fabricating stiffeners for flexible substrates

Dual path acoustic data coupling system and method

Acoustic data coupling system and method

Semiconductor device and manufacturing method of them

Method of making zinc-aluminum alloy connection

Apparatus for solder crack deflection

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Low profile semiconductor system having a partial-cavity substrate

Integrated circuit package system including wide flange leadframe

Semiconductor integrated circuit device and test method thereof

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Methods for fabricating chip-scale packages having carrier bonds

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Components, methods and assemblies for multi-chip packages

Glass material for radio-frequency applications

Nonvolatile memory system

Pixel circuit, active matrix apparatus and display apparatus with first and second reference potentials applied to source, and gate of drive transistor

Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Semiconductor package and fabricating method thereof

Integrated circuit having second substrate to facilitate core power and ground distribution

Substrate and semiconductor device

Interconnects with interlocks

Thermally enhanced semiconductor package and method of producing the same

Thermal interconnect and interface systems, methods of production and uses thereof

Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

Semiconductor module comprising semiconductor chips and method for producing the same

Managed memory component

Semiconductor package structure and fabrication method thereof

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor package

Differential transmission line structure and wiring substrate

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Semiconductor device and fabrication method thereof

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

Method of manufacturing wiring substrate

Semiconductor device package and method for manufacturing same

Method for fabricating a flip chip system in package

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Adhesion method using gray-scale photolithography

Printed circuit board and method of manufacturing semiconductor package using the same

Managed memory component

Semiconductor device and electronic component module using the same

Method for fabricating semiconductor package with build-up layers formed on chip

Inter-stacking module system

Semiconductor device having a plurality of semiconductor constructs

Method and system for innovative substrate/package design for a high performance integrated circuit chipset

SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME

Structure of Ball Grid Array package

Semiconductor device

Integrated circuit package system including stacked die

Connecting module having passive components

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Managed memory component

Integrated circuit package system with pedestal structure

Multi-chip ball grid array package and method of manufacture

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Multi-chip package system

Edge interconnects for die stacking

Integrated circuit package system including honeycomb molding

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Managed memory component

Interconnected IC packages with vertical SMT pads

Semiconductor device having SOI structure

Semiconductor device

Interconnect circuitry, multichip module, and methods of manufacturing thereof

PACKAGE WARPAGE CONTROL

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

Chip package dielectric sheet for body-biasing

Semiconductor device having a heatsink plate with bored portions

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Hidden plating traces

STRUCTURE AND PROCESS OF CHIP PACKAGE

Stacked-type chip package structure

Low stress stacked die packages

Electrical ground method for ball stack package

Multichip leadframe package

Camera module fabrication method including the step of removing a lens mount and window from the mold

Wiring board and a semiconductor device using the same

Method of substrate manufacture that decreases the package resistance

Microelectronic assemblies having very fine pitch stacking

System to wirebond power signals to flip-chip core

Semiconductor device and method of manufacturing the same

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Structure with semiconductor chips embeded therein

Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency

Semiconductor device

Multi-layer interconnection circuit module and manufacturing method thereof

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Techniques for packaging multiple device components

Semiconductor package and manufacturing method therefor

Stack-type semiconductor package and manufacturing method thereof

Plating bar design for high speed package design

Circuit board, semiconductor device, and manufacturing method of circuit board

Semiconductor device and electronic control unit using the same

Method of making circuitized substrate with split conductive layer and information handling system utilizing same

METHOD FOR MANUFACTURING WIRING BOARD

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components

Stackable molded packages and methods of making the same

Method of manufacturing semiconductor device

Semiconductor device

Physically highly secure multi-chip assembly

Method and power control structure for managing plurality of voltage islands

Integrated circuit package to provide high-bandwidth communication among multiple dice

Multi-stacked package and method of manufacturing the same

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Heat spreader and package structure utilizing the same

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device, and inspection method thereof

Stack package of ball grid array type

Semiconductor device and manufacturing method of the same

Packaging method of a plurality of chips stacked on each other and package structure thereof

Device package

ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

METHODS AND APPARATUSES FOR IMPRINTING SUBSTRATES

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Pixel circuit, active matrix apparatus and display apparatus with first and second reference potentials applied to source and gate of drive transistor

Printed circuit board having embedded electronic components and manufacturing method thereof

Chip package structure

Forming compliant contact pads for semiconductor packages

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

System-in-package structure

Semiconductor device

Microelectronic devices having a curved surface and methods for manufacturing the same

Stacked semiconductor device

Semiconductor package having increased resistance to electrostatic discharge

Multiple stacked die window csp package and method of manufacture

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Underfill film having thermally conductive sheet

Chip package and coreless package substrate thereof

Package module with alignment structure and electronic device with the same

Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same

Apparatus, unit and method for testing image sensor packages

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and system for increasing yield of vertically integrated devices

Method and system for hermetically sealing packages for optics

Method for packaging microelectronic devices

Liquid metal thermal interface material system

Method and apparatus for stabilizing RF power amplifiers

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor device

Metal core, package board, and fabricating method thereof

Stacked type semiconductor memory device and chip selection circuit

Chip package structure

Semiconductor components having through wire interconnects (TWI)

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Digital camera module

Semiconductor device and manufacturing method thereof

Photonic device with integrated hybrid microlens array

Thin circuit board

Method of making semiconductor package having exposed heat spreader

Method for packaging a semiconductor device

Built-in capacitor type wiring board and method for manufacturing the same

Radio-frequency system in package including antenna

Multi chip module

Semiconductor device

Circuit substrate and method of manufacture

Semiconductor/printed circuit board assembly, and computer system

SEMICONDUCTOR DEVICE

Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof

Multilayered wiring board and method for fabricating the same

Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device

Electronic structure with components connected by way of solderable connecting elements and method

Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Flip-chip semiconductor device manufacturing method

Low Profile Stacking System and Method

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Integrated circuit package with improved power signal connection

Semiconductor device and method of manufacturing the same

Packaged device and method of forming same

Interconnecting element between semiconductor chip and circuit support and method

Stackable semiconductor package and method for its fabrication

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

Low Profile Stacking System and Method

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

Scaling of functional assignments in packages

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor devices including voltage switchable materials for over-voltage protection

Semiconductor assembly having substrate with electroplated contact pads

Integrated circuit package system with heat sink

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

Silicon based package

Method of manufacturing a semiconductor device

Enhancing shock resistance in semiconductor packages

Reversible leadless package and methods of making and using same

Method and apparatus for forming a DMD window frame with molded glass

Semiconductor device

Data storage device and refreshing method for use with such device

Semiconductor product and method for forming a semiconductor product

Integrated circuit package system with channel

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device