Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating method

Substrate having a functionally gradient coefficient of thermal expansion

Semiconductor apparatus having stacked semiconductor components

Apparatus for improved power distribution in wirebond semiconductor packages

Stacked packaging methods and structures

Method of making a semiconductor device adapted to remove noise from a signal

Electronic component with multilayered rewiring plate and method for producing the same

Interposers for chip-scale packages and intermediates thereof

Method of manufacturing printed wiring board

Manufacturing method of an electronic part built-in substrate

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Attachment of integrated circuit structures and other substrates to substrates with vias

Impedence matching along verticle path of microwave vias in multilayer packages

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Electrode structure of a semiconductor device and method of manufacturing the same

Integrated inductors and compliant interconnects for semiconductor packaging

Substrate for producing semiconductor packages

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

Method and apparatus for manufacturing stacked-type semiconductor device

Stacked wafer scale package

Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages

LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device

Invertible microfeature device packages

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Thermal protection for electronic components during processing

Methods and apparatuses for providing stacked-die devices

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Integrated circuit package including miniature antenna

Low profile, chip-scale package and method of fabrication

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Power gridding scheme

Fine pitch low-cost flip chip substrate

Liquid metal thermal interface for an integrated circuit device

Integrated circuit package with carbon nanotube array heat conductor

Power gridding scheme

Package structure

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Rugged CSP module system and method

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Packaged microelectronic devices and methods for packaging microelectronic devices

Method of fabricating semiconductor device

Method for fabricating semiconductor package with circuit side polymer layer

Manufacturing method of semiconductor device

Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member

Electrical contact encapsulation

Semiconductor device with semiconductor components connected to one another

Silicon chip carrier with conductive through-vias and method for fabricating same

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

Structure with spherical contact pins

Stack type semiconductor apparatus package and manufacturing method thereof

Snap lid camera module

Methods and apparatuses for imprinting substrates

Integrated radio front-end module with embedded circuit elements

Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein

Chip package structure

Method of manufacturing circuit device

Stacked chip electronic package having laminate carrier and method of making same

Image capturing device

Interconnects with interlocks

Semiconductor component having a CSP housing

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Stacked flash memory chip package and method therefor

Methods of forming a multi-chip module having discrete spacers

Semiconductor chip having gettering layer, and method for manufacturing the same

Chip-under-tape package structure and manufacture thereof

Chip structure with redistribution traces

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

Image sensor packaging structure

Electro-optical circuitry having integrated connector and methods for the production thereof

Semiconductor package having a grid array of pin-attached balls

Wafer-leveled chip packaging structure and method thereof

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

Microelectronic component assemblies with recessed wire bonds and methods of making same

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Method for mounting a chip on a base and arrangement produced by this method

Flip chip package capable of measuring bond line thickness of thermal interface material

Heterogeneous organic laminate stack ups for high frequency applications

BGA package board and method for manufacturing the same

Substrate-based BGA package, in particular FBGA package

Semiconductor package and method for its manufacture

Semiconductor package with heat sink

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Optical package for a semiconductor sensor

Electronic module with layer of adhesive and process for producing it

Semiconductor device and power supply unit utilizing the same

Manufacturing method of a semiconductor device, and paste applicator

Encapsulating epoxy resin composition, and electronic parts device using the same

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Substrate for mounting IC chip

Electronic assemblies and systems comprising interposer with embedded capacitors

High wireability microvia substrate

Top layers of metal for high performance IC's

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Circuit device with at least partial packaging and method for forming

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Heat dissipation device for integrated circuits

Device mounting board

Semiconductor chip assembly with metal containment wall and solder terminal

Integrated circuit die with pedestal

Wafer-level assembly method for semiconductor devices

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Semiconductor device and method of manufacturing the same

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Accumulation device with charge balance structure and method of forming the same

Method of manufacturing a wiring board

Method of fabricating wiring board

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Semiconductor device

Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Stacked structure of integrated circuits

BGA package with concave shaped bonding pads

Microelectronic devices

Flip-chip without bumps and polymer for board assembly

Semiconductor chip having pollished and ground bottom surface portions

Molded package for micromechanical devices and method of fabrication

Semiconductor component having stacked, encapsulated dice and method of fabrication

Multi-chip package having heat dissipating path

Stacked semiconductor device and semiconductor memory module

Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

Method for producing a package for an electronic circuit and a substrate for a package

Interconnects with direct metalization and conductive polymer

Method for fabricating an electronic component embedded substrate

Stacked package electronic device

Optoelectronic packaging with embedded window

In-line wire bonding on a package, and method of assembling same

Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions

Through electrode and method for forming the same

Circuit device and manufacturing method thereof

Groundless flex circuit cable interconnect

Package stress management

Semiconductor device

Direct connection multi-chip semiconductor element structure

Semiconductor chip package with thermoelectric cooler

Circular wire-bond pad, package made therewith, and method of assembling same

Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

METAL OXIDE CERAMIC THIN FILM ON BASE METAL ELECTRODE

Patch substrate for external connection

Method for fabricating semiconductor packages

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Semiconductor chip package manufacturing method including screen printing process

Method for fabricating semiconductor packages

Electronic device package

Encapsulating compound having reduced dielectric constant

Universal energy conditioning interposer with circuit architecture

Apparatus of antenna with heat slug and its fabricating process

Method and structure for manufacturing improved yield semiconductor packaged devices

Arrangement for increasing the reliability of substrate-based BGA packages

Semiconductor device

Bottom heat spreader

Semiconductor package with exposed heat sink and the heat sink thereof

Encapsulated device with heat isolating structure

Semiconducting device having stacked dice

Forming buried via hole substrates

Substrate-based die package with BGA or BGA-like components

Microelectronic packages and methods therefor

Method of embedding semiconductor element in carrier and embedded structure thereof

High-frequency circuit

Semiconductor package including a semiconductor device, and method of manufacturing the same

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Circuit apparatus provided with asperities on substrate surface

Components with posts and pads

Systems and methods for building tamper resistant coatings

Circuit board

Semiconductor device and manufacturing method thereof

Heat spreader in integrated circuit package

Extended thin film capacitor (TFC)

Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip

Thermal interposer for thermal management of semiconductor devices

Unmolded package for a semiconductor device

Method for manufacturing wafer level chip stack package

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Semiconductor die package with internal bypass capacitors

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Ground plane for integrated circuit package

Apparatus for providing capacitive decoupling between on-die power and ground conductors

Stacking system and method

Multi-frequency noise suppression capacitor set

Semiconductor package with heat sink

Printed wiring board

Semiconductor device and manufacturing method therefor

Thermal interposer for thermal management of semiconductor devices

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Image sensor package and fabrication method

Semiconductor device, manufacturing method and apparatus for the same

Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method

Chip scale package with open substrate

Manufacturing method of semiconductor device

Image pickup device and production method thereof

Transfer molding of integrated circuit packages

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Contact pin assembly and contactor card

Compliant contact pin assembly and card system

Multi-chip module package structure

Semiconductor package

Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material

Method and apparatus for reducing thermal resistance in a vertical heat sink assembly

Lead-free bonding systems

Electronic device cooling apparatus and method for cooling electronic device with temperature prediction

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Pixel circuit, active matrix apparatus and display apparatus

Optimized driver layout for integrated circuits with staggered bond pads

Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Semiconductor device

Ball grid array solder joint reliability

Semiconductor device having adhesion increasing film to prevent peeling

Stacked semiconductor package having adhesive/spacer structure and insulation

Ball grid array housing having a cooling foil

Conductor device and method of manufacturing thereof

Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing

Buried array capacitor and microelectronic structure incorporating the same

Carrier for stacked type semiconductor device and method of fabricating the same

System-in-package (SIP) structure and fabrication thereof

Adhesive/spacer island structure for stacking over wire bonded die

Multilayer electronic component and method for producing the same

Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith

Selective deposition system and method for initiating deposition at a defined starting surface

Manufacturing method of semiconductor device

Integrated circuit packages with reduced stress on die and associated methods

Top layers of metal for high performance IC's

Manufacturing methods for semiconductor structures having stacked semiconductor devices

Method of fabricating a built-in chip type substrate

Package warpage control

Wiring substrate and method of fabricating the same

Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier

Method for manufacturing circuit device

Integrated circuit package with optimized mold shape

Multilayer printed wiring board and multilayer printed circuit board

Semiconductor device including amplifier and frequency converter

Semiconductor package, method of production of same, and semiconductor device

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Semiconductor device and manufacturing process therefor

Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment

Intermediate substrate

Semiconductor device and a method of manufacturing the same

Semiconductor device and method for manufacturing the same

Layout structure for providing stable power source to a main bridge chip substrate and a motherboard

Circuit device with dummy elements

Fingerprint sensor package

Wire bonding method and apparatus for integrated circuit

Semiconductor device with a floating gate electrode that includes a plurality of particles

Selective packaging of tested semiconductor devices

Circuit device and manufacturing method thereof

Top layers of metal for high performance IC's

Package with barrier wall and method for manufacturing the same

Integrated ball and via package and formation process

Semiconductor device and interposer

Semiconductor molding method and structure

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package

Chip heat sink device and method

Semiconductor device mounting structure

Semiconductor device

Semiconductor device and manufacturing process thereof

High-frequency chip packages

Semiconductor device, method for mounting the same, and method for repairing the same

Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement

Image sensor package module with a leadless leadframe between chips

Substrate, semiconductor device, and substrate fabricating method

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Packaging of a microchip device

Method of manufacturing semiconductor device

Method of making a heatsink device

Chemical-enhanced package singulation process

Microelectronic devices and methods for packaging microelectronic devices

Semiconductor package and method for fabricating the same

Semiconductor chip package and method for fabricating the same

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

Integrated passive devices

Windowed package for electronic circuitry

Mold gates and tape substrates including the mold gates

Semiconductor device and manufacturing method therefor

Chip embedded package structure

Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly

Systems for degating packaged semiconductor devices with tape substrates

Method of forming an array of semiconductor packages

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Die package

Stacked multi-chip package

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Wiring board and semiconductor package using the same