212622 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
#13202Method and apparatus for forming structures proximate to workpieces
#13203Multi-layer interconnection circuit module and manufacturing method thereof
#13204Low warpage flip chip package solution-channel heat spreader
#13205Method and apparatus for decoupling conductive portions of a microelectronic device package
#13206Multi-chip package with high-speed serial communications between semiconductor die
#13207Embedded chip semiconductor without wire bondings
#13208Overhang support for a stacked semiconductor device, and method of forming thereof
#13209Array capacitors in interposers, and methods of using same
#13210Semiconductor package and system module
#13211Top layers of metal for high performance IC's
#13212Package design using thermal linkage from die to printed circuit board
#13213Semiconductor device having a gettering layer
#13214Method and apparatus for synthesizing high-frequency signals for wireless communications
#13215Semiconductor device and fabrication process therefor
#13216Heat spreader for thermally enhanced semiconductor package
#13217Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#13218Semiconductor component having multiple stacked dice
#13219Image sensor with a protection layer
#13220Structure of image sensor module and a method for manufacturing of wafer level package
#13221Camera module having a threaded lens barrel and a ball grid array connecting device
#13222Method for producing a BGA chip module and BGA chip module
#13223Method for manufacturing an adhesive substrate with a die-cavity sidewall
#13224Method of making assemblies having stacked semiconductor chips
#13225Device mounting board
#13226System in-package test inspection apparatus and test inspection method
#13227Integrated circuit package with improved power signal connection
#13228Process for fabricating chip package structure
#13229Fan out type wafer level package structure and method of the same
#13230Multilayer printed wiring board
#13231Method of manufacturing multi-stack package
#13232Method of forming a multi-die semiconductor package
#13233Method of making contact pin card system
#13234Interface module-mounted LSI package
#13235Capacitor-embedded substrate
#13236Semiconductor chip package
#13237Microelectronic assembly having a redistribution conductor over a microelectronic die
#13238Component built-in module and method for producing the same
#13239Semiconductor device
#13240CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
#13241Semiconductor device, magnetic sensor, and magnetic sensor unit
#13242Semiconductor device and multilayer substrate therefor
#13243BGA semiconductor device having a dummy bump
#13244Semiconductor device and printed circuit board
#13245Semiconductor packages, and methods of forming semiconductor packages
#13246Compliant contact pin assembly and card system
#13247Compliant contact pin assembly and card system
#13248Compliant contact pin assembly and card system
#13249Semiconductor device, method for producing the same, circuit board, and electronic apparatus
#13250Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
#13251Stacked die BGA or LGA component assembly
#13252Semiconductor device with stacked semiconductor chips of the same type
#13253Multi-chip module with embedded package and method for manufacturing the same
#13254CHIP PACKAGING STRUCTURE
#13255Semiconductor device with improved design freedom of external terminal
#13256Modifying a semiconductor device to provide electrical parameter monitoring
#13257Power semiconductor switching devices and power semiconductor devices
#13258Thin film forming apparatus and thin film forming method
#13259Methods of forming a contact pin assembly
#13260Method of connecting base materials
#13261Method for manufacturing semiconductor device
#13262Adhesive of folded package
#13263Method of embedding passive component within via
#13264Heat curable adhesive composition, article, semiconductor apparatus and method
#13265Chip package structure and process for fabricating the same
#13266Wafer level mounting frame for ball grid array packaging, and method of making and using the same
#13267Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#13268Electronic package with optimized lamination process
#13269Semiconductor package with heat dissipating structure and method of manufacturing the same
#13270Chip package structure and chip packaging process
#13271Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
#13272Thermal dissipation in integrated circuit systems
#13273Heat spreader lid cavity filled with cured molding compound
#13274Jet-dispensed stress relief layer in contact arrays, and processes of making same
#13275Semiconductor device package having buffered memory module and method thereof
#13276CHIP PACKAGE STRUCTURE
#13277Circuit device
#13278Semiconductor package having a high-speed signal input/output terminal
#13279Spacer die structure and method for attaching
#13280Dielectric composition for forming dielectric layer for use in circuitized substrates
#13281Encapsulating epoxy resin composition, and electronic parts device using the same
#13282Method of manufacturing radiating plate and semiconductor apparatus using the same
#13283Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
#13284Method of making chip package with grease heat sink
#13285Stress-compensation layers in contact arrays, and processes of making same
#13286Capillary underfill channel
#13287Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
#13288Semiconductor device assemblies and packages including multiple semiconductor device components
#13289Semiconductor flip-chip package and method for the fabrication thereof
#13290Sacrificial component
#13291Die down semiconductor package
#13292Semiconductor substrate with interconnections and embedded circuit elements
#13293Wiring board mounting a capacitor
#13294Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#13295Semiconductor device of a charge storage type
#13296Semiconductor BGA package having a segmented voltage plane and method of making
#13297Device mounting board and semiconductor apparatus using device mounting board
#13298Spacer die structure and method for attaching
#13299Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#13300Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#13301Circuit board for connecting an integrated circuit to a support and IC BGA package using same
#13302Tape automated bonding with strip carrier frame assembly
#13303Low fabrication cost, high performance, high reliability chip scale package
#13304Lower profile flexible substrate package for electronic components
#13305Phase change material containing fusible particles as thermally conductive filler
#13306Extended thin film capacitor (TFC)
#13307Switched-capacitor power supply system and method
#13308Adhesion by plasma conditioning of semiconductor chip surfaces
#13309Semiconductor device
#13310Semiconductor device package having a semiconductor element with resin
#13311Multichip semiconductor package
#13312Semiconductor device and manufacturing metthod thereof
#13313Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#13314Chip package and process thereof
#13315Semiconductor package with build-up structure and method for fabricating the same
#13316Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
#13317Semiconductor device and method of manufacturing the same
#13318Semiconductor device with plate-shaped component
#13319Semiconducting device with folded interposer
#13320Circuit device
#13321Vertically stacked semiconductor device
#13322Semiconductor chip package
#13323Circuit device and manufacturing method thereof
#13324Multilayer integrated circuit for RF communication and method for assembly thereof
#13325Chip circuit comprising an inductor
#13326Integrated circuit module package and assembly method thereof
#13327Method of creating solder bar connections on electronic packages
#13328Bumpless die and heat spreader lid module bonded to bumped die carrier
#13329Top layers of metal for high performance IC's
#13330Methods for forming electrical connections and resulting devices
#13331Method for fabricating window ball grid array semiconductor package
#13332Semiconductor device package and method of production and semiconductor device of same
#13333Semiconductor chip packaging method with individually placed film adhesive pieces
#13334Intermediate substrate
#13335System and method for attenuating electromagnetic interference
#13336Semiconductor device and method of manufacturing the same
#13337Multi-flip chip on lead frame on over molded IC package and method of assembly
#13338Method for manufacturing wiring board and semiconductor device
#13339Semiconductor apparatus
#13340Signal transmitting device with vias and solder balls
#13341Semiconductor device
#13342Stacked electronic part
#13343Thin semiconductor package including stacked dies
#13344Stacked semiconductor packages
#13345Circuit device and manufacturing method thereof
#13346Semiconductor package having step type die and method for manufacturing the same
#13347Board-on-chip packages
#13348Wiring board and process for producing the same
#13349Connector
#13350Wafer level semiconductor package with build-up layer and method for fabricating the same
#13351Heat sink with built-in heat pipes for semiconductor packages
#13352Flexible substrate and electronic equipment
#13353Top layers of metal for high performance IC's
#13354Semiconductor device and manufacturing method thereof
#13355Semiconductor device and method for manufacturing the same
#13356Semiconductor package without bonding wires and fabrication method thereof
#13357Semiconductor device, semiconductor package, and method for testing semiconductor device
#13358Multi-chip package
#13359Semiconductor package with heat sink and method for fabricating the same and stiffener
#13360Two solder array structure with two high melting solder joints
#13361Semiconductor stack package and memory module with improved heat dissipation
#13362Semiconductor device and manufacturing method thereof
#13363Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#13364Method and apparatus for joining semiconductor
#13365Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
#13366Absolute power detector
#13367Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
#13368Circuit component with bump formed over chip
#13369Semiconductor device having a multi-chip stacked structure and reduced thickness
#13370Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#13371Integrated circuit with re-route layer and stacked die assembly
#13372Multi-chip package including at least one semiconductor device enclosed therein
#13373Stacked packages and systems incorporating the same
#13374Semiconductor package free of substrate and fabrication method thereof
#13375Semiconductor package free of substrate and fabrication method thereof
#13376Semiconductor package free of substrate and fabrication method thereof
#13377Compliant contact pin assembly, card system and methods thereof
#13378Methods of fabrication of package assemblies for optically interactive electronic devices
#13379Integrated circuit packaging using electrochemically fabricated structures
#13380Via structure of packages for high frequency semiconductor devices
#13381Flip chip semiconductor die internal signal access system and method
#13382Semiconductor device
#13383Semiconductor package free of substrate and fabrication method thereof
#13384Low fabrication cost, high performance, high reliability chip scale package
#13385Apparatus for encapsulating a multi-chip substrate array
#13386Semiconductor package
#13387Semiconductor device
#13388Packaging substrates for integrated circuits and soldering methods
#13389Semiconductor module and method of manufacturing thereof
#13390Chip package structure
#13391Integrated circuit structure having a flip-chip mounted photoreceiver
#13392Method of surface mounting a semiconductor device
#13393Multiple die package
#13394Chip package structure
#13395Method of manufacturing multi-layer printed circuit board
#13396Intrinsic thermal enhancement for FBGA package
#13397Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
#13398Substrate for carrying a semiconductor chip and a manufacturing method thereof
#13399Semiconductor package for lowering electromagnetic interference and method for fabricating the same
#13400Photosensitive semiconductor package with support member and method for fabricating the same
#13401Wiring substrate, manufacturing method thereof, and semiconductor device
#13402Packaged systems with MRAM
#13403Multilayer wiring board
#13404Optimized power delivery to high speed, high pin-count devices
#13405Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#13406Semiconductor device and method of manufacturing the same
#13407Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#13408Semiconductor device and fabrication method for the same
#13409Semiconductor package free of substrate and fabrication method thereof
#13410Thin-film capacitor device, mounting module for the same, and method for fabricating the same
#13411Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
#13412SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
#13413Semiconductor component having stiffener, stacked dice and circuit decals
#13414Semiconductor device with capacitor
#13415Stack MCP
#13416Thermally enhanced metal capped BGA package
#13417Method for fabricating semiconductor component with stiffener and circuit decal
#13418Process for producing semiconductor device, semiconductor device, circuit board and electronic equipment
#13419Miniaturized chip scale package structure
#13420Method for preparing integrated circuit modules for attachment to printed circuit substrates
#13421Integrated circuit redistribution package
#13422Method for manufacturing semiconductor device
#13423Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#13424METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVICE PACKAGING
#13425Electronic component and fabricating method
#13426Optically interactive device package array
#13427Electronic component and fabricating method
#13428High density vertically stacked semiconductor device
#13429Electronic component and fabricating method
#13430Wire-bonding method and semiconductor package using the same
#13431Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#13432Method for assembling a ball grid array package with two substrates
#13433Semiconductor package with passive device integration
#13434Selective deposition system and method for initiating deposition at a defined starting surface
#13435Three-dimensional semiconductor package, and spacer chip used therein
#13436Fabrication method of semiconductor package with photosensitive chip
#13437Semiconductor package
#13438Signal line circuit device
#13439Semiconductor part for component mounting, mounting structure and mounting method
#13440Flip-chip adaptor package for bare die
#13441Semiconductor device including semiconductor element mounted on another semiconductor element
#13442Solder alloy and semiconductor device
#13443Method and apparatus for high electrical and thermal performance ball grid array package
#13444Microelectronic adaptors, assemblies and methods
#13445Circuit carrier and package structure thereof
#13446Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#13447Semiconductor device, its fabrication method and electronic device
#13448Substrate for packaging semiconductor chip and method for manufacturing the same
#13449Die-wafer package and method of fabricating same
#13450Power semiconductor devices and methods of manufacture
#13451Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#13452Semiconductor device and manufacturing method of them
#13453Method of fabrication of semiconductor integrated circuit device
#13454Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#13455Adhesion by plasma conditioning of semiconductor chip
#13456Package structure having semiconductor device embedded within wiring board
#13457Semiconductor device
#13458Semiconductor device
#13459Area array packages with overmolded pin-fin heat sinks
#13460Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#13461Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
#13462Semiconductor device having conducting portion of upper and lower conductive layers
#13463Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#13464Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#13465Multiple die-spacer for an integrated circuit
#13466Semiconductor device
#13467Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
#13468Semiconductor package with photosensitive chip and fabrication method thereof
#13469Optical sensor module with semiconductor device for drive
#13470Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
#13471Semiconductor device and method of fabricating the same
#13472Structure and method for temporarily holding integrated circuit chips in accurate alignment
#13473Printed circuit board and method for manufacturing printed circuit board
#13474Methods and apparatus for automotive radar sensors
#13475Integrated circuit device with multiple chips in one package
#13476Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
#13477Semiconductor apparatus
#13478Thin semiconductor package including stacked dies
#13479Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#13480LSI package provided with interface module
#13481Partially populated ball grid design to accommodate landing pads close to the die
#13482Semiconductor device including semiconductor elements mounted on base plate
#13483Integrated circuit packages with sandwiched capacitors
#13484Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
#13485Methods of making microelectronic assemblies
#13486Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#13487Method for manufacturing semiconductor device with plural semiconductor chips
#13488Fabrication method of semiconductor integrated circuit device
#13489Interconnect circuitry, multichip module, and methods for making them
#13490RF power amplifier and method for packaging the same
#13491Cooling devices and methods of using them
#13492Cooling devices and methods of using them
#13493Method for producing ceramic substrate and electronic component module using ceramic substrate
#13494Semiconductor chip package
#13495Semiconductor device and manufacturing method for the same
#13496Semiconductor device having capacitors for reducing power source noise
#13497Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
#13498Semiconductor chip heat transfer
#13499Semiconductor device and manufacturing method for the same
#13500Semiconductor device and supporting plate