Method and apparatus for forming angled vias in an integrated circuit package substrate

PCB, manufacturing method thereof and semiconductor package implementing the same

Method for manufacturing wiring board

Memory package

Package structure with embedded chip and method for fabricating the same

Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same

Method of providing a heat spreader

Stacked DRAM memory chip for a dual inline memory module (DIMM)

Electronic component with a housing package

Thin film capacitor for reducing power supply noise

Multi-chip module

Method of making wafer level ball grid array

Flip chip package with anti-floating structure

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Heat dissipating semiconductor package and fabrication method thereof

Multi-layer interconnection circuit module and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor package structure and method for fabricating the same

Semiconductor device

Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Semiconductor device comprising a memory portion and a peripheral circuit portion

Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer

Electronic component and a panel

Manufacture method of a flexible multilayer wiring board

Electronic parts packaging structure and method of manufacturing the same

Method of manufacturing a device-incorporated substrate

Chain extension for thermal materials

Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure

Manufacturing method of chip integrated substrate

Three-dimensional device fabrication method

Methods for fabricating stiffeners for flexible substrates

Liquid metal thermal interface material system

Method for encasing plastic array packages

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability

Semiconductor device, having a through electrode semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode

Packaging structure with a plurality of drill holes formed directly below an underfill layer

Thermal expansion compensating flip chip ball grid array package structure

Method for fabricating semiconductor package having conductive bumps on chip

Semiconductor package and fabrication method thereof

Semiconductor device and method of fabricating the same

Stacked-type semiconductor package

Multi-level semiconductor module and method for fabricating the same

Ball assignment schemes for integrated circuit packages

Liquid metal thermal interface material system

Semiconductor package and manufacturing method thereof

Method of making a circuitized substrate

Capacitor having an anodic metal oxide substrate

Method for fabricating semiconductor components with conductive vias

Semiconductor package substrate with embedded chip and fabrication method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Methods for assembling a stack package for high density integrated circuits

Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

Semiconductor component having plate and stacked dice

Semiconductor device

Multi-chip module

Semiconductor device and method for manufacturing the same

Heat stud for stacked chip package

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Semiconductor device with improved heat dissipation

Microelectronic assemblies incorporating inductors

Semiconductor device

Package unit, printed board having the same, and electronic apparatus having the printed board

Package for a semiconductor device

Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

Structure of embedded active components and manufacturing method thereof

Method for stacking BGA packages and structure from the same

Multilayered circuit substrate, semiconductor device and method of producing same

Apparatus and methods for cooling semiconductor integrated circuit package structures

Semiconductor component package

Multi-chip package and method of fabricating the same

Multi-chip package using an interposer

Semiconductor device and method of fabricating the same

Optical device

ESD protection apparatus for an electrical device

Structure of electronic package and method for fabricating the same

Semiconductor chip package having an adhesive tape attached on bonding wires

Techniques for microchannel cooling

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Fabrication method of semiconductor integrated circuit device

Process for fabricating chip embedded package structure

Forming a stress compensation layer and structures formed thereby

Heat-dissipating device

Fluidic cooling systems and methods for electronic components

System-in-package type semiconductor device

Heat dissipating packages structure and method for fabricating the same

Semiconductor integrated circuit chip packages having integrated microchannel cooling modules

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM

Substrate design to improve chip package reliability

Wiring board having connecting wiring between electrode plane and connecting pad

Modular construction component with encapsulation

Semiconductor module with conductive element between chip packages

Multi-chip semiconductor package

Multi-chip package

Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Member for semiconductor device

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Cooling system for a semiconductor device and method of fabricating same

Micro lead frame packages and methods of manufacturing the same

Injection molded metal bonding tray for integrated circuit device fabrication

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Radar-transceiver for microwave and millimetre applications

Crosspoint switch with switch matrix module

Semiconductor package device and method for fabricating the same

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor device having flip-chip package and method for fabricating the same

Chip package with grease heat sink

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Multi chip package

Stepped integrated circuit packaging and mounting

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Integrated circuit die configuration for packaging

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Die stacking scheme

Methods of manufacturing interposers with flexible solder pad elements

Semiconductor package substrate with embedded resistors and method for fabricating the same

Resin molding equipment and resin molding method

Cavity-down Package and Method for Fabricating the same

System to control effective series resistance of decoupling capacitor

Semiconductor device and method for fabricating the same

Flip chip BGA process and package with stiffener ring

Electronic component comprising external surface contacts and a method for producing the same

Circuitized substrate with trace embedded inside ground layer

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Cavity-down thermally enhanced package

Multi-package module with heat spreader

Semiconductor package with heat sink and method for fabricating same

Semiconductor module, process for producing the same, and film interposer

Semiconductor device and a method for manufacturing of the same

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Fan out type wafer level package structure and method of the same

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Assessing micro-via formation PCB substrate manufacturing process

Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument

Integrated inductor and method of fabrication

Chip package, chip packaging, chip carrier and process thereof

Electronic component with cavity fillers made from thermoplast and method for production thereof

Anti-tamper module

Integrated structure with CPU and north bridge chip

Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Packaged device and method of forming same

Substrate structure with embedded chip of semiconductor package and method for fabricating the same

Chip-size package structure and method of the same

Molded high density electronic packaging structure for high performance applications

Array capacitor with resistive structure

Method and system for an improved power distribution network for use with a semiconductor device

Multilayer semiconductor device

Semiconductor device and method for producing the same

Thermally enhanced molded package for semiconductors

Cavity-down multiple-chip package

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Packaging method for an electronic element

Heat dissipating package structure and method for fabricating the same

Fine pitch grid array type semiconductor device

Memory card module with an inlay design

Multichip leadframe package

Method of manufacturing of thin based substrate

Laser processing unit, laser processing method, and method for manufacturing semiconductor device

Semiconductor device and its manufacturing method

Folded substrate with interposer package for integrated circuit devices

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Package stack and manufacturing method thereof

Attachment of integrated circuit structures and other substrates to substrates with vias

Semiconductor package structure with microstrip antennan

Integrated circuit package employing a flexible substrate

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

Method of manufacturing a substrate with through electrodes

Semiconductor device and method of manufacturing thereof

Semiconductor electrical connection structure and method of fabricating the same

Three dimensional package type stacking for thinner package application

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

CPU power delivery system

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Method of forming a stacked semiconductor package

Cavity-down stacked multi-chip package

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Apparatus of antenna with heat slug and its fabricating process

Semiconductor package including light emitter and IC

Semiconductor device and method for producing same

Wiring pattern formation method, wiring pattern, and electronic device

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Radio frequency module and manufacturing method thereof

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Package stress management

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Method for manufacturing wafer level chip scale package structure

Input/output routing on an electronic device

Reactive gettering in phase change solders to inhibit oxidation at contact surfaces

Die down ball grid array package

Multi-terminal device and printed wiring board

Electronic device

Control circuitry in stacked silicon

Chip package

Three dimensional package and packaging method for integrated circuits

Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same

Top layers of metal for integrated circuits

Top layers of metal for integrated circuits

Semiconductor device and method for manufacturing the same

Semiconductor package having a heat slug and manufacturing method thereof

Structure and method of high performance two layer ball grid array substrate

Packaging method, packaging structure and package substrate for electronic parts

Structural design for flip-chip assembly

Solder foil, semiconductor device and electronic device

Method of manufacturing capacitor device

System and method for high performance heat sink for multiple chip devices

IC PACKAGE HAVING GROUND IC CHIP AND METHOD OF MANUFACTURING SAME

Semiconductor device having a switch circuit

Heat dissipation for chip-on-chip IC packages

Electronic package having a folded package substrate

Semiconductor device

Assembly for stacked BGA packages

Materials, structures and methods for microelectronic packaging

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Heat spreader for non-uniform power dissipation

Solder interconnection array with optimal mechanical integrity

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Wafer stacking package method

Method of forming a wafer backside interconnecting wire

Circuit board with a thin-film layer configured to accommodate a passive element

Semiconductor device and a method of assembling a semiconductor device

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

Semiconductor packages

Semiconductor device and manufacturing method thereof

Method of fabricating a semiconductor die package having improved inductance characteristics

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Methods of forming semiconductor packages

Packaging with metal studs formed on solder pads

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

Semiconductor device with temperature control mechanism

Chip carrier with oxidation protection layer

Routing power and ground vias in a substrate

Stackable ball grid array

Multi-chip package structure

Semiconductor device

Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted

Semiconductor packages

Integrated circuit package with open substrate

Top layers of metal for high performance IC's

Module assembly and method for stacked BGA packages

Method and apparatus for a stacked die configuration

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Package having dummy package substrate and method of fabricating the same

Using the wave soldering process to attach motherboard chipset heat sinks

Integrated antenna type circuit apparatus

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Module assembly for stacked BGA packages

Substrate-based housing component with a semiconductor chip

Package having dummy package substrate and method of fabricating the same

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor package and laminated semiconductor package

Through-substrate interconnect fabrication methods

Wiring substrate and semiconductor device using the same

Manufacturing method of stack-type semiconductor device

Methods for packaging image sensitive electronic devices

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Semiconductor chip packages and methods for fabricating the same

Method of manufacturing semiconductor device

Optical semiconductor module and semiconductor device including the same

Magnetic shielding for magnetic random access memory card

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

Control of breakdown voltage for microelectronic packaging

Methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Low temperature PB-free processing for semiconductor devices

Flip chip ball grid array package with constraint plate

Top layers of metal for high performance IC's

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor device having a heat-dissipation member

Transistor performance enhancement using engineered strains

Structure and process of semiconductor package with an exposed heatsink

Structures and methods for heat dissipation of semiconductor integrated circuits

Semiconductor and method for producing a semiconductor

Wiring board providing impedance matching