212622 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Microelectronic package having a passive microelectronic device disposed within a package body
#2102Integrated circuit package with microstrip routing and an external ground plane
#2103Interposer substrate and method of fabricating the same
#2104BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE
#2105Soldering material
#2106Wireless communications with dielectric medium
#2107Display unit
#2108Semiconductor device
#2109Semiconductor device and manufacturing method thereof
#2110Packages with interposers and methods for forming the same
#2111Semiconductor device and method of manufacturing thereof
#2112Circuit boards and semiconductor packages including the same
#2113Semiconductor device and method for manufacturing the same
#2114Through-hole electrode substrate
#2115Manufacturing method of semiconductor device, inspection device of semiconductor device, and semiconductor device
#2116Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#2117Extending multichip package link off package
#2118Semiconductor package device and method of manufacturing the same
#2119Method of embedding WLCSP components in E-WLB and E-PLB
#2120Semiconductor structure and manufacturing method thereof
#2121Semiconductor packages and methods of forming same
#2122System-in-package with double-sided molding
#2123Method of manufacturing semiconductor package
#2124Electronic component package and method of manufacturing the same
#2125SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2126Lateral vias for connections to buried microconductors and methods thereof
#2127Package with embedded heat dissipation features
#2128SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#2129Composition for removing silicone resins and method of thinning substrate by using the same
#2130Thermally enhanced fully molded fan-out module
#2131Assembly of wafer stacks
#2132Semiconductor device and method for manufacturing semiconductor device
#2133Stackable microelectronic package structures
#2134Semiconductor device and method of forming a 3D interposer system-in-package module
#2135Fabrication method of semiconductor package with stacked semiconductor chips
#2136Routing design of dummy metal cap and redistribution line
#2137Warpage balancing in thin packages
#2138Semiconductor device
#2139Semiconductor package with improved heat dissipation
#2140Semiconductor device and manufacturing method thereof
#2141Combined structure of flexible semiconductor device package and method of transporting the flexible semiconductor device
#2142Synchronous dynamic random access memory (SDRAM) and memory controller device mounted in single system in package (SIP)
#2143Semiconductor packages having asymmetric chip stack structure
#2144Chip package having die structures of different heights and method of forming same
#2145Semiconductor device
#2146Substrate structure, electronic package having the same, and method for fabricating the same
#2147Microelectronic elements with post-assembly planarization
#2148Memory bandwidth aggregation using simultaneous access of stacked semiconductor memory die
#2149Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#2150Method and system for packing optimization of semiconductor devices
#2151Semiconductor package
#2152PRINTED CIRCUIT BOARD AND MOBILE TERMINAL MOUNTED THE SAME
#2153Antenna apparatus and method
#2154Stackable electronic package and method of fabricating same
#2155Inorganic interposer for multi-chip packaging
#2156Stacked semiconductor die assemblies with die support members and associated systems and methods
#2157Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#2158Dual-sided module with land-grid array (LGA) footprint
#2159Method of fabricating packaging substrate
#2160PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
#2161Embedded trace substrate structure and semiconductor package structure including the same
#2162Substrate, semiconductor package structure and manufacturing process
#2163Methods and apparatus for package with interposers
#2164CONDUCTIVE BALL
#2165Communication between integrated circuit packages using a millimeter-wave wireless radio fabric
#2166Semiconductor device with optically-transmissive layer and manufacturing method thereof
#2167Fan-out semiconductor package
#2168Methods of forming integrated circuit package with thermally conductive pillar
#2169Method of fabricating packaging structure
#2170Integrated circuit package
#2171Semiconductor package assembly
#2172Substrate-less stackable package with wire-bond interconnect
#2173PoP device
#2174FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2175Multilayer board and electronic device
#2176Semiconductor storage device
#2177Molding compound including a carbon nano-tube dispersion
#2178Stand-off block
#2179Blade computing system with wireless communication between blades within a blade enclosure
#2180Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#2181Integrated circuit structures with recessed conductive contacts for package on package
#2182Method for preparing a semiconductor apparatus
#2183Three-layer package-on-package structure and method forming same
#2184Warpage control in package-on-package structures
#2185Semiconductor device and manufacturing method thereof
#2186Systems and methods for electromagnetic interference shielding
#2187Fan-out semiconductor package and method of manufacturing the same
#2188Semiconductor package and method for fabricating the same
#2189Coaxial vias
#2190Semiconductor device and manufacturing method thereof
#2191Method for manufacturing semiconductor device
#2192Electronic component and electronic component manufacturing method
#2193Semiconductor device and method of manufacture
#2194Patch on interposer package with wireless communication interface
#2195Backside redistribution layer (RDL) structure
#2196Eliminate sawing-induced peeling through forming trenches
#2197Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
#2198Semiconductor structure with conductive structure
#21993D semiconductor device, fabrication method and system
#2200Resin, composition, cured film, method for manufacturing cured film and semiconductor device
#2201Electronic device with integrated circuit chip provided with an external electrical connection network
#2202Microelectronic package with wireless interconnect
#2203Semiconductor device, manufacturing method thereof, and electronic apparatus
#2204Semiconductor device and manufacturing method thereof
#2205Methods of forming connector pad structures, interconnect structures, and structures thereof
#2206Method of manufacturing semiconductor package
#2207Electronic package and method for fabricating the same
#2208Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#2209Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer
#2210Structures and methods for shielding magnetically sensitive components
#2211Semiconductor memory device and structure
#2212Advanced node cost reduction by ESD interposer
#2213Semiconductor structure and manufacturing method thereof
#2214Electronic device and semiconductor device
#2215Substrates, assembles, and techniques to enable multi-chip flip chip packages
#22163D thin profile pre-stacking architecture using reconstitution method
#2217Semiconductor device and semiconductor module
#2218Chip-on-substrate packaging on carrier
#2219Printed circuit board and electronic equipment
#2220Package with tilted interface between device die and encapsulating material
#2221System and method for laser assisted bonding of semiconductor die
#2222Package-on-package structures and methods for forming the same
#2223Packaging mechanisms for dies with different sizes of connectors
#2224Integrated circuit package having wirebonded multi-die stack
#2225Packages with metal line crack prevention design
#2226Wire bonding method and apparatus for electromagnetic interference shielding
#2227Fan-out semiconductor package
#2228Semiconductor package with heat-dissipating structure and method of manufacturing the same
#2229Three dimensional integrated circuit (3DIC) with support structures
#2230Semiconductor device, chip module, and semiconductor module
#2231Integrated passive device package and methods of forming same
#2232THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEATSINK
#2233Semiconductor laser device, photoelectric converter, and optical information processing unit
#2234SEMICONDUCTOR CHIP PACKAGE WITH CAVITY
#2235Module and manufacturing method thereof
#2236Electronic device package
#2237Heat removal between top and bottom die interface
#2238High-frequency module
#2239Manufacturing method of package structure
#2240Packaged chip and signal transmission method based on packaged chip
#2241Bent-bridge semiconductive apparatus
#2242Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#2243Semiconductor device having through-silicon-via and methods of forming the same
#2244Chip package structure and manufacturing method thereof
#2245Apparatus and manufacturing method
#2246Packaged semiconductor devices and methods of packaging semiconductor devices
#2247Molding structure for wafer level package
#2248Microelectronic package structures including redistribution layers
#2249Semiconductor packaging method, semiconductor package and stacked semiconductor packages
#2250Low cost package warpage solution
#2251Integrated circuit package mold assembly
#2252Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#2253Printed circuit board and electric device
#2254Semiconductor device
#2255Semiconductor device including plural semiconductor chips
#2256Systems and methods for bonding semiconductor elements
#2257Semiconductor package manufacturing method
#2258Semiconductor package device and method of manufacturing the same
#2259Semiconductor device
#2260FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
#2261Counter-flow expanding channels for enhanced two-phase heat removal
#2262IR assisted fan-out wafer level packaging using silicon handler
#2263Composite electronic component and board having the same
#2264Thin-film capacitor manufacturing method, integrated circuit mounting substrate, and semiconductor device equipped with the substrate
#2265Semiconductor device having a protruding interposer edge face
#2266Imaging device comprising photoelectric conversion element, operating method thereof, and electronic device
#2267Semiconductor packages including heat transferring blocks and methods of manufacturing the same
#2268Semiconductor package
#2269Packaging devices and methods for semiconductor devices
#2270Inductive connection structure for use in an integrated circuit
#2271Wiring structure, semiconductor package structure and semiconductor process
#2272Semiconductor memory device and a chip stack package having the same
#2273Fan-out structure and method of fabricating the same
#2274Microelectronic device having an air core inductor
#2275Package structure with dummy die
#2276Wireless package with antenna connector and fabrication method thereof
#2277Wiring substrate and semiconductor device
#2278Method of forming conductive bumps for cooling device connection
#2279Multi-die memory device
#2280Optical transmission module
#2281Semiconductor package having mold layer with curved corner and method of fabricating same
#2282Semiconductor memory device including stacked chips and memory module having the same
#2283Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive
#2284Semiconductor device and method
#2285Fabrication method of electronic package having embedded package block
#2286Molding structure for wafer level package
#2287Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
#2288Packaged semiconductor assemblies and methods for manufacturing such assemblies
#2289Redistribution layer structures for integrated circuit package
#2290Fabrication method of semiconductor substrate
#2291Semiconductor device
#2292Semiconductor package device and method of manufacturing the same
#2293Semiconductor device packages with direct electrical connections and related methods
#2294Chip package
#2295Semiconductor device with recess and method of making
#2296Manufacturing method and wiring substrate with through electrode
#2297Automated place-and-route method for HBM-based IC devices
#2298Diene/dienophile couples and thermosetting resin compositions having reworkability
#2299Three dimensional integrated circuit electrostatic discharge protection and prevention test interface
#2300Package-on-package with cavity in interposer
#2301Method for forming package structure including intermetallic compound
#2302Integrated circuit (IC) devices with varying diameter via layer
#2303Semiconductor device with electromagnetic interference protection and method of manufacture
#2304Semiconductor device package including filling mold via
#2305Pad design for reliability enhancement in packages
#2306Semiconductor device
#2307Semiconductor device and semiconductor integrated system
#2308Fingerprint sensor device and method
#2309Pressing of wire bond wire tips to provide bent-over tips
#2310Semiconductor package
#2311Method for interconnecting stacked semiconductor devices
#2312Semiconductor package including package substrate and chip stack in which a lower chip has a respective dummy pad by which each upper chip is connected to the package substrate
#2313Electronic component package and method of manufacturing the same
#2314Semiconductor package structure and fabrication method thereof
#2315Method for fabricating semiconductor package and semiconductor package using the same
#2316Semiconductor substrate including embedded component and method of manufacturing the same
#2317HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY
#2318Thermal interface material layer and package-on-package device including the same
#2319Manufacturing method of semiconductor device
#2320Manufacturing method for semiconductor package with cantilever pads
#2321FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE
#2322Semiconductor package and manufacturing method thereof
#2323Image processing device having an integrated circuit chip, a first memory chip and a second memory chip, and control method therefor
#2324Package structures and methods of forming the same
#2325Packaged semiconductor devices and methods of packaging semiconductor devices
#2326Protective film for semiconductors, semiconductor device, and composite sheet
#2327Semiconductor chip
#2328Packaged integrated circuit device with cantilever structure
#2329Integrated circuit package substrate
#2330Wafer level package structure and method of forming same
#2331Handler bonding and debonding for semiconductor dies
#2332Fan-out semiconductor package
#2333Package MEMS switch and method
#2334Memory system topologies including a buffer device and an integrated circuit memory device
#2335Fabrication method of substrate having electrical interconnection structures
#2336Circuit board, imaging device, and electronic apparatus
#2337Semiconductor package and method of manufacturing the semiconductor package
#2338High-frequency module
#2339Semiconductor structure and manufacturing method thereof
#2340Stacked electronics package and method of manufacturing thereof
#2341Semiconductor package and semiconductor manufacturing process
#2342Integrated circuits protected by substrates with cavities, and methods of manufacture
#2343Three dimension integrated circuits employing thin film transistors
#2344Methods of forming package-on-package structures
#2345Ring structures in device die
#2346Semiconductor package structure and method of manufacturing the same
#2347Module assembly
#2348Producing wafer level packaging using leadframe strip and related device
#2349Semiconductor device and process for fabricating the same
#2350Manufacturing method of semiconductor device
#2351Electronic-component mount substrate, electronic device, and electronic module
#2352Microelectronic system including printed circuit board having improved power/ground ball pad array
#2353Semiconductor laser device, photoelectric converter, and optical information processing unit
#2354Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
#2355Chip package structure and manufacturing method thereof
#2356Semiconductor package and semiconductor device using the same
#2357Semiconductor package
#2358Substrateless integrated circuit packages and methods of forming same
#2359Multi-layer leadless semiconductor package and method of manufacturing the same
#2360Manufacturing method of package-on-package structure
#2361Heterogeneous miniaturization platform
#2362Shielded EHF connector assemblies
#2363Method of manufacturing semiconductor package
#2364Semiconductor device and manufacturing method of the same
#2365Semiconductor package with three-dimensional antenna
#2366Land side and die side cavities to reduce package z-height
#2367Semiconductor device and wiring board design method
#2368Semiconductor device and method of forming interposer with opening to contain semiconductor die
#2369Data storage device having multi-stack chip package and operating method thereof
#2370Semiconductor device
#2371Semiconductor device method of manufacture
#2372Semiconductor package with improved bandwidth
#2373Manufacturing method of semiconductor device and semiconductor device thereof
#2374Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers
#2375Circuit board with bridge chiplets
#2376Interconnections for a substrate associated with a backside reveal
#2377Semiconductor package device and method of manufacturing the same
#2378Direct-bonded native interconnects and active base die
#2379Inspection method, inspection system, and method of fabricating semiconductor package using the same
#2380Solution for reducing poor contact in InFO package
#2381Method of producing an interposer-chip-arrangement for dense packaging of chips
#2382Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#2383Dual-sided radio-frequency package with overmold structure
#2384Method of manufacturing semiconductor package
#2385Semiconductor package and fabricating method thereof
#23863D IC bump height metrology APC
#2387Complex cavity formation in molded packaging structures
#2388Method and apparatus for providing a transistor
#2389Method for generation of electrical power within a three-dimensional integrated structure and corresponding link device
#2390Fan-out sensor package and camera module including the same
#2391Integrated circuit package assembly with wire end above a topmost component
#2392Fan-out semiconductor package
#2393Fan-out semiconductor package
#2394Fan-out semiconductor package
#2395Semiconductor device
#2396Carrier base material-added wiring substrate
#2397Semiconductor device, system in package, and system in package for vehicle
#2398Semiconductor package assembly
#2399Flip chip ball grid array with low impedence and grounded lid
#2400Systems and methods for bonding semiconductor elements