Selective area heating for 3D chip stack

High frequency module, board equipped with antenna, and high frequency circuit board

Package structure and method of forming the same

Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture

Semiconductor device package with warpage control structure

Semiconductor package

Fan-out package structure having stacked carrier substrates and method for forming the same

Low CTE interposer

Fine pitch BVA using reconstituted wafer with area array accessible for testing

CARRIER ULTRA THIN SUBSTRATE

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

Making electrical components in handle wafers of integrated circuit packages

Non-volatile memory with stacked semiconductor chips

Semiconductor device manufacturing method

Method for fabricating a semiconductor package

Redistribution layers in semiconductor packages and methods of forming same

Semiconductor device including two or more chips mounted over wiring substrate

Semiconductor device and manufacturing method thereof

Semiconductor package and method for fabricating the same

Copper seed layer and nickel-tin microbump structures

Pad design for reliability enhancement in packages

Double-sided semiconductor package and dual-mold method of making same

Chip package and package substrate

Flexible system integration to improve thermal properties

Semiconductor package

Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same

Test cell for laminate and method

Adjustable heat sink fin spacing

Thermally enhanced package to reduce thermal interaction between dies

Forming embedded circuit elements in semiconductor package assembles and structures formed thereby

Multi-stack package-on-package structures

Semiconductor device

Semiconductor device with thin redistribution layers

Fabrication method of semiconductor package

Shielded package assemblies with integrated capacitor

Multi terminal capacitor within input output path of semiconductor package interconnect

Scalable semiconductor interposer integration

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Semiconductor device and method of manufacturing the same

SSI PoP

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor packages including an adhesive pattern

Semiconductor package device and method of manufacturing the same

Methods of manufacturing semiconductor packages

Electronic package and method for fabricating the same

Electronic package structure with multiple electronic components

Package structure and method for manufacturing thereof

Semiconductor package and method for manufacturing the same

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package

Method for forming a lid structure for a semiconductor device package

Wiring substrate and semiconductor device

Semiconductor device

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

Chip module with stiffening frame and orthogonal heat spreader

Semiconductor package

Semiconductor device and method

Integrated circuit package pad and methods of forming

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

Fan-out semiconductor package

Semiconductor package with core substrate having a through hole

Multi terminal capacitor within input output path of semiconductor package interconnect

Semiconductor device package and a method of manufacturing the same

Memories and memory components with interconnected and redundant data interfaces

Light emitting device using metal substrate for improving heat dissipation efficiency

Vertical shielding and interconnect for SIP modules

Package-on-package (PoP) structure including stud bulbs

Semiconductor packaging structure and method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LPS solder paste based low cost fine pitch pop interconnect solutions

Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package

Standalone interface for stacked silicon interconnect (SSI) technology integration

Molding for large panel fan-out package

Fabrication method of electronic package

Limiting electronic package warpage

Semiconductor device packages and stacked package assemblies including high density interconnections

Memory device comprising programmable command-and-address and/or data interfaces

Method for manufacturing semiconductor device

Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSOCIATED SYSTEMS AND METHODS

Integrated electronic device with transceiving antenna and magnetic interconnection

Chip package having die structures of different heights

Package with thinned substrate

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Substrate designed to provide EMI shielding

Method of fabricating electronic package

Dense redistribution layers in semiconductor packages and methods of forming the same

Semiconductor device

Circuit boards and semiconductor packages including protruding pattern on substrate

Structures and methods for providing electrical isolation in semiconductor devices

Semiconductor package assembly with passive device

Package structure and method of forming the same

Semiconductor packages and methods of packaging semiconductor devices

Electronic device comprising an encapsulating block locally of smaller thickness

Semiconductor device and manufacturing method thereof

Selective metallization of an integrated circuit (IC) substrate

Semiconductor die singulation and structures formed thereby

Packaged semiconductor devices and methods of packaging semiconductor devices

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Dies-on-package devices and methods therefor

Interconnect structure with redundant electrical connectors and associated systems and methods

Package-on-package structure with through molding via

3D semiconductor package interposer with die cavity

Package-on-package assembly with wire bond vias

Integrated fan-out structure and method of forming

Info package with integrated antennas or inductors

Semiconductor device

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module

Electronic device

Integrated circuit package assembly

Surface finishes for interconnection pads in microelectronic structures

Semiconductor package and method of manufacturing the same

Switched power stage with integrated passive components

Package with passivated interconnects

Low Parasitic Surface Mount Circuit Over Wirebond IC

Semiconductor package

Conductive connections, structures with such connections, and methods of manufacture

Package on-package structure

Sensor package structure

Enhanced power distribution to application specific integrated circuits (ASICS)

Thermally enhanced package to reduce thermal interaction between dies

Semiconductor device and method of forming PoP semiconductor device with RDL over top package

Embedded millimeter-wave phased array module

Antenna in embedded wafer-level ball-grid array package

Package structure with dummy feature in passivation layer

Semiconductor device

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

Integrated antenna on interposer substrate

Electronic device

Electronic component built-in substrate and electronic component device

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Magnetic memory device

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

Semiconductor chip package with resilient conductive paste post and fabrication method thereof

Packaged devices with multiple planes of embedded electronic devices

Scalable package architecture and associated techniques and configurations

Integrated circuit package assemblies including a chip recess

Semiconductor package and fabricating method thereof

Enhanced cleaning for water-soluble flux soldering

Lead-Free Solder Ball

Transient electronic device with ion-exchanged glass treated interposer

Circuitized substrate with electronic components mounted on transversal portion thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Switched closed loop read-out methods and systems for resonant sensing platforms

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Interposers with electrically conductive features having different porosities

Method of manufacturing a package-on-package type semiconductor package

Immersion interconnections for semiconductor devices and methods of manufacture thereof

Semiconductor package and manufacturing method of the same

Semiconductor package structure and method for forming the same

Integrated fan-out package and method for fabricating the same

Fan-out semiconductor package

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

Package-on-package type semiconductor device including fan-out memory package

Porous alumina templates for electronic packages

Stacked silicon package assembly having conformal lid

Packaging mechanisms for dies with different sizes of connectors

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Reconstructed wafer based devices with embedded environmental sensors and process for making same

Semiconductor device having stacked semiconductor chips and method for fabricating the same

Manufacturing method of integrated circuit package

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Package structure

Thin film based fan out and multi die package platform

Method of fabricating a microelectronic substrate

Capacitive interconnect in a semiconductor package

Camera module and electronic device

Integrated circuit package including miniature antenna

Semiconductor package

Methods of manufacturing a semiconductor device package including a controller element

Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection

Semiconductor assembly with package on package structure and electronic device including the same

Semiconductor package and method for manufacturing the same

Top-side connector interface for processor packaging

Devices and methods related to singulated radio-frequency devices

Bonding structure and method

Integrated fan-out structure with rugged interconnect

Semiconductor packages including heat spreaders and methods of manufacturing the same

Flexible memory system with a controller and a stack of memory

Chip including over-voltage and surge protection

High reliability housing for a semiconductor package

Warpage control of semiconductor die package

Structure and method of forming a joint assembly

Contact area design for solder bonding

Package substrate with embedded noise shielding walls

Flexible packaging architecture

3DIC packaging with hot spot thermal management features

Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance

SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICATION METHODS AND SEMICONDUCTOR PACKAGES

Semiconductor packaging structure and process

Integrated circuit package configurations to reduce stiffness

Isolation module for use between power rails in an integrated circuit

Non-volatile dual in-line memory module (NVDIMM) multichip package

Device and Method for UBM/RDL Routing

Semiconductor package and fabrication method thereof

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

Semiconductor package assembly

Packaging substrate and method of fabricating the same

Electronic package and method for fabricating the same

3D chip testing through micro-C4 interface

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Semiconductor device having stacked semiconductor chips interconnected via TSV

Method for electromagnetic shielding and thermal management of active components

Data storage device having multi-stack chip package and operating method thereof

Multi-stack package-on-package structures

Double plated conductive pillar package substrate

CTE compensation for wafer-level and chip-scale packages and assemblies

Low loss substrate for high data rate applications

Method of fabricating an interposer

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Stacked wafer-level packaging devices

Crosstalk reduction in electrical interconnects

Poly silicon based interface protection

Semiconductor device utilizing an adhesive to attach an upper package to a lower die

Electronic device provided with an integral conductive wire and method of manufacture

Film, method for its production, and method for producing semiconductor element using the film

Semiconductor die assemblies with heat sink and associated systems and methods

System-in-package module with memory

Three-dimensional flash NOR memory system with configurable pins

Package-on-package device with supplemental underfill and method for manufacturing the same

Three-layer Package-on-Package structure and method forming same

Stackable semiconductor package and manufacturing method thereof

Integrated interposer solutions for 2D and 3D IC packaging

Applicant screening

Thermal dissipation through seal rings in 3DIC structure

Photonic interposer with wafer bonded microlenses

Analog input digital boundary scan cell, comparator, and analog switches

METHOD FOR EMBEDDING SILICON DIE INTO A STACKED PACKAGE

Assembly of wafer stacks

Semiconductor packages

Chip on package structure and method

Thermocompression for semiconductor chip assembly

Substrate structure having chamfers

Microelectronic bond pads having integrated spring structures

Substrate designed to provide EMI shielding

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Underfill dispensing using funnels

Structures and methods for reliable packages

Manufacturing method of semiconductor package

3D semiconductor structure and device

Mechanisms for forming package structure

Contact pad for semiconductor device

Vertical interconnects for self shielded system in package (SiP) modules

Semiconductor device that includes a molecular bonding layer for bonding of elements

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Semiconductor package and manufacturing method thereof

Bonding package components through plating

Semiconductor packages and methods for forming semiconductor package

Semiconductor package structure, package on package structure and packaging method

Electro-magnetic interference (EMI) shielding techniques and configurations

Embedded buffer circuit compensation scheme for integrated circuits

Embedded chip packages and methods for manufacturing an embedded chip package

Semiconductor device and manufacturing method thereof

Thin stack packages

Method of manufacturing semiconductor device

Package on package structure and method for forming the same

Method of manufacturing semiconductor device

Fan-out semiconductor package for packaging semiconductor chip and capacitors

Semiconductor package having an EMI shielding layer

Alignment mark design for packages

Method of fabricating semiconductor package structure

Fan-out wafer level packaging structure

Package-on-package assembly with wire bonds to encapsulation surface

Buried electrical debug access port

Microelectronic package with illuminated backside exterior

Printed circuit board and semiconductor package including the same

Image sensing device with cap and related methods

Semiconductor package

Semiconductor package assembly

Package-on-package semiconductor device

Package process and package structure

Antenna cavity structure for integrated patch antenna in integrated fan-out packaging

Package-on-package type package including integrated circuit devices and associated passive components on different levels

Package substrate with embedded circuit

MICROELECTRONIC INTERCONNECT ADAPTOR

Package structures and methods for forming the same

Fan-out semiconductor package

Method of manufacturing semiconductor device

Hybrid carbon-metal interconnect structures

Dual-layer dielectric in memory device

Semiconductor device using EMC wafer support system and fabricating method thereof

Package on package (PoP) bonding structures

Package integrated with a power source module

Package assembly for embedded die and associated techniques and configurations

Semiconductor packages with embedded bridge interconnects

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME

System and method for bonding package lid

Shielded electronic device module and method of measuring shielding thereof

Redistribution film for IC package

Integrated circuitry systems