ClassID:

212673

H01L2924/16587 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Ceramics, e.g. crystalline carbides, nitrides or oxides

Recent Application in this class: