H01L2924/16586 - CPC Classification Index

ClassID:

212672 ⎘

H01L2924/16586 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material

Sub-classes:

H01L2924/16587 » Ceramics, e.g. crystalline carbides, nitrides or oxides 2
H01L2924/16588 » Glasses, e.g. amorphous oxides, nitrides or fluorides 8

Recent Application in this class:

20130293428

2013-11-07

Microelectronic wireless transmission device

20130221500

2013-08-29

System-in-package with integrated socket