212674 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Glasses, e.g. amorphous oxides, nitrides or fluorides
ELECTRONIC DEVICE WITH A REINFORCING LAYER
#2CHIP PACKAGE STRUCTURE
#3Tamper-proof electronic packages with stressed glass component substrate(s)
#4Tamper-proof electronic packages with stressed glass component substrate(s)
#5Chip scale package and related methods
#6Manufacturing method of glass-sealed package, and glass substrate
#7Electronic device and method of manufacturing the same
#8Electronic device and method of manufacture the same