H01L2924/177 - CPC Classification Index

ClassID:

212701 ⎘

H01L2924/177 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Sub-classes:

H01L2924/17701 » the principal constituent melting at a temperature of less than 400 C 1
H01L2924/17717 » the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C 0
H01L2924/17738 » the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C 23
H01L2924/17763 » the principal constituent melting at a temperature of greater than 1550 C 6

H01L2924/177 - CPC Classification

Recent Application in this class:

20240153903

20240096748

20230104156

20120234592

20120126246