212708 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550 C
Chip package and a wafer level package
#2Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#3Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition
#4Integrated circuit (IC) package with thick die pad functioning as a heat sink
#5Chip package and a wafer level package
#6Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
#7Quad flat non-leaded semiconductor package with wettable flank