212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Integrated circuit package including miniature antenna
#2402Semiconductor package
#2403Semiconductor device
#2404Magnetic sensor
#2405Power module
#2406Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#2407Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#2408Devices and methods related to singulated radio-frequency devices
#2409Bonding structure and method
#2410Power module
#2411Method for manufacturing semiconductor devices
#2412Light-emitting device
#2413Light-emitting device having a light-transmissive member including particles of at least one first filler and method for manufacturing the same
#2414Light source circuit unit, illuminator, and display
#2415Light emitting device and method of manufacturing the same
#2416Light emitting device
#2417Substrate based light emitter devices, components, and related methods
#2418High reliability housing for a semiconductor package
#2419Methods of assembling a flip chip on a locking dual leadframe
#2420Warpage control of semiconductor die package
#2421Structure and method of forming a joint assembly
#2422Semiconductor device and method of manufacturing the same
#2423Method of making leadframe strip
#24243DIC packaging with hot spot thermal management features
#2425Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance
#2426SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICATION METHODS AND SEMICONDUCTOR PACKAGES
#2427Integrated circuit package configurations to reduce stiffness
#2428Substrate pad structure
#2429AlO/InOgate insulator for HEMT
#2430RFIC device and method for manufacturing resin molded body including RFIC device
#2431UV epoxy resin instillation molding method and application thereof
#2432Power module
#2433Optoelectronic semiconductor device having a side face as mounting side
#2434Non-volatile dual in-line memory module (NVDIMM) multichip package
#2435Insulated circuit board, power module and power unit
#2436Semiconductor package and fabrication method thereof
#2437Semiconductor device and method of manufacture
#2438Packaged semiconductor devices and packaging devices and methods
#2439Semiconductor module and method of manufacturing semiconductor module
#2440Electronic package and method for fabricating the same
#2441Semiconductor package including flip chip mounted IC and vertically integrated inductor
#2442Semiconductor package with wettable flank
#2443Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
#2444Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
#2445Fingerprint sensor and manufacturing method thereof
#2446Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using test socket terminals
#2447Semiconductor device and method of making embedded wafer level chip scale packages
#2448Racetrack layout for radio frequency isolation structure
#2449Light emitting device package, backlight unit, lighting device and its manufacturing method
#2450Proximity detector device with interconnect layers and related methods
#2451Semiconductor device and method of manufacturing the same
#2452Copper structures with intermetallic coating for integrated circuit chips
#2453Double plated conductive pillar package substrate
#2454Semiconductor package
#2455Leadframe with vertically spaced die attach pads
#2456Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#2457Semiconductor device
#2458Magnetic field sensor and method for making same
#2459Light emitting device
#2460Method of fabricating a circuit module
#2461Light emitting device and adaptive driving beam headlamp system
#2462SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2463Electronic device provided with an integral conductive wire and method of manufacture
#2464Semiconductor package with electrical test pads
#2465System-in-package module with memory
#2466Low stress integrated device packages
#2467MEMS grid for manipulating structural parameters of MEMS devices
#2468Package apparatus
#2469Light emitting device and method for manufacturing the same
#2470Supporting substrate for semiconductor device, semiconductor apparatus comprising the same, and method for manufacturing the same
#2471Semiconductor device having die pad
#2472Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device
#2473Integrated interposer solutions for 2D and 3D IC packaging
#2474Applicant screening
#2475Package with vertical interconnect between carrier and clip
#2476Thermal dissipation through seal rings in 3DIC structure
#2477Power amplifier module
#2478Semiconductor device and method for manufacturing the same
#2479Semiconductor device, semiconductor chip, and test method for semiconductor chip
#2480Lighting device
#2481Cooling module
#2482Intelligent autoclose door
#2483Light emitting device
#2484Semiconductor packages
#2485Chip on package structure and method
#2486Locking dual leadframe for flip chip on leadframe packages
#2487Semiconductor device
#2488Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#2489Printed circuit board and semiconductor package
#2490Lead frame surface modifications for high voltage isolation
#2491METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#2492Electronic device and method of manufacturing the electronic device
#2493Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
#2494Method for forming a semiconductor device and a semiconductor device
#2495Optical member, optical semiconductor device, and illumination apparatus
#2496Directly Cooled Substrates for Semiconductor Modules
#2497Manufacturing method of semiconductor package
#2498Power module, power converter device, and electrically powered vehicle
#2499Light emitting device
#2500Thin film light emitting diode
#2501Mechanisms for forming package structure
#2502Methods and structures for packaging semiconductor dies
#2503Semiconductor device and electronic device
#2504MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTRONIC DEVICES
#2505Power module and power conversion apparatus having a warpage suppression portion
#2506Semiconductor package having a metal paint layer
#2507Wafer level embedded heat spreader
#2508Semiconductor device
#2509Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#2510Thermosetting resin composition and method of producing same
#2511Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#2512Stack-type semiconductor package
#2513Multi-chip fan out package and methods of forming the same
#2514Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
#2515Bonding package components through plating
#2516Semiconductor packages and methods for forming semiconductor package
#2517Semiconductor package structure, package on package structure and packaging method
#2518Wiring board, electronic device, and electronic module
#2519Electronic package including cavity defined by resin and method of forming same
#2520Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#2521Embedded chip packages and methods for manufacturing an embedded chip package
#2522Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole
#2523Semiconductor device
#2524Bonding structure between semiconductor device package
#2525Semiconductor device and manufacturing method thereof
#2526Thin stack packages
#2527Method of manufacturing semiconductor device
#2528Package on package structure and method for forming the same
#2529Semiconductor package having an EMI shielding layer
#2530Alignment mark design for packages
#2531Device with pillar-shaped components
#2532Power semiconductor device
#2533Semiconductor device and an electronic device
#2534Package-on-package assembly with wire bonds to encapsulation surface
#2535Thermosonically bonded connection for flip chip packages
#2536Buried electrical debug access port
#2537Multi-die pressure sensor package
#2538Microelectronic package with illuminated backside exterior
#2539Thermosetting resin composition
#2540Curable heat radiation composition
#2541Phosphor and light-emitting equipment using phosphor
#2542VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#2543Printed circuit board and semiconductor package including the same
#2544Method of manufacturing light emitting device
#2545Integrated system and method of making the integrated system
#2546Package-on-package semiconductor device
#2547Package process and package structure
#2548Overlapping stacked die package with vertical columns
#2549Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#2550Semiconductor device and method for manufacturing same
#2551Semiconductor module including a case and base board
#2552Molding wafer chamber
#2553Method of manufacturing semiconductor device
#2554SYSTEM AND METHOD FOR MANUFACTURING A FABRICATED CARRIER
#2555Method for producing fluorescent material, fluorescent material, and light emitting device using the same
#2556Coated manganese-activated complex fluoride phosphors
#2557Resin composition
#2558Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
#2559Light emitting device, package, and methods of manufacturing the same
#2560Hollow metal pillar packaging scheme
#2561Package on package (PoP) bonding structures
#2562LED MODULE AND LED MODULE MOUNTING STRUCTURE
#2563Semiconductor device and method of forming embedded wafer level chip scale packages
#2564Dual lead frame semiconductor package and method of manufacture
#2565Semiconductor device and semiconductor device mounting structure having conductor plates
#2566High power semiconductor package subsystems
#2567Sensor chip package assembly and electronic device having sensor chip package assembly
#2568Package assembly for embedded die and associated techniques and configurations
#2569Power semiconductor module
#2570Semiconductor device including a passive component formed in a redistribution layer
#2571Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
#2572Power semiconductor module and cooler
#2573Spatially selective roughening of encapsulant to promote adhesion with functional structure
#2574CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
#2575Electronic device
#2576Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#2577Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
#2578Optoelectronic component
#2579Semiconductor device comprising PN junction diode and schottky barrier diode
#2580Semiconductor device with metal patterns having convex and concave sides
#2581EMI/RFI shielding for semiconductor device packages
#2582Semiconductor package assembly with redistribution layer (RDL) trace
#2583Stacked chip-on-board module with edge connector
#2584POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
#2585Resin-encapsulated semiconductor device
#2586Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
#2587Testing apparatus and manufacturing apparatus for testing light emitting device package
#2588Power amplifier modules with bonding pads and related systems, devices, and methods
#2589Light emitting device
#2590Light source package and display device including the same
#2591Optical sensor device
#2592Semiconductor device having a boundary structure, a package on package structure, and a method of making
#2593Semiconductor device
#2594Electronic components having three-dimensional capacitors in a metallization stack
#2595Semiconductor devices having through electrodes and methods for fabricating the same
#2596Semiconductor device and method of manufacturing semiconductor device
#2597Integrated circuit package with sensor and method of making
#2598Fluorescent material, light emitting device, and method for producing fluorescent material
#2599Method of producing nitride fluorescent material, nitride fluorescent material, and light emitting device using the same
#2600Transistor layout with low aspect ratio
#2601Integrated circuit package and methods of forming same
#2602Thermal performance structure for semiconductor packages and method of forming same
#2603Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#2604Alignment mark design for packages
#2605Method of integrating capacitors on lead frame in semiconductor devices
#2606Semiconductor package having multi-phase power inverter with internal temperature sensor
#2607Semiconductor device including a clip
#2608Method for singulating packaged integrated circuits and resulting structures
#2609Multi-chip structure and method of forming same
#2610Cascode amplifier having feedback circuits
#2611Semiconductor package incorporating redistribution layer interposer
#2612Method of manufacturing printed circuit board
#2613Electronic component mounting structure
#2614Light emitting device
#2615Light emitting apparatus, illumination apparatus and display apparatus
#2616Semiconductor device and method of forming interconnect substrate for FO-WLCSP
#2617Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages
#2618Method for reinforcing conductor tracks of a circuit board
#2619Semiconductor module and semiconductor driving device
#2620Semiconductor package with plurality of leads and sealing resin
#2621Integrated clip and lead and method of making a circuit
#2622Antenna module and circuit module
#2623Carrier, carrier leadframe, and light emitting device
#2624Light-emitting apparatus
#2625Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#2626Light emitting device and backlight including the light emitting device
#2627Semiconductor device and electronic apparatus including a first semiconductor chip including an insulated gate bipolar transistor and a second semiconductor chip including a diode
#2628Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#2629Package structure and method for forming the same
#2630Substrate structure
#2631Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#2632Semiconductor chip with fracture detection
#2633Power conversion device
#2634LED package
#2635Semiconductor device with thin redistribution layers
#2636Resin-encapsulated semiconductor device
#2637Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels
#2638Chip component
#2639Oxynitride fluorescent material, method for preparing same, and light emitting device package using same
#2640Device for molding semiconductor package
#2641Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
#2642Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
#2643Light-emitting device
#2644Sawing underfill in packaging processes
#2645Semiconductor device
#2646Light emitting apparatus
#2647Compact opto-electronic modules and fabrication methods for such modules
#2648Integrated device package comprising a real time tunable inductor implemented in a package substrate
#2649Multi-chip package system and methods of forming the same
#2650Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
#2651Semiconductor packages having redistribution substrate
#2652Semiconductor device and method for manufacturing semiconductor device to prevent separation of terminals
#2653Semiconductor device
#2654Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
#2655Package structure to enhance yield of TMI interconnections
#2656Lead frame and semiconductor device
#2657Package assembly with gathered insulated wires
#2658Mold release film, process for its production, and process for producing semiconductor package
#2659Thermosetting composition, and method for manufacturing thermoset resin
#2660Light emitting device package
#2661Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#2662Power and ground design for through-silicon via structure
#2663Mechanisms for forming post-passivation interconnect structure
#2664Carrier-free semiconductor package and fabrication method
#2665Method and materials for warpage thermal and interconnect solutions
#2666Fluoride phosphor, method of manufacturing the same, and light emitting device
#2667Layered Polymer Structures And Methods
#2668Packaged LEDs with phosphor films, and associated systems and methods
#2669Semiconductor device and portable apparatus using the same
#2670Bonding wire for semiconductor device
#2671Via structure for packaging and a method of forming
#2672Leadless electronic packages for GAN devices
#2673Semiconductor device and method of controlling warpage in reconstituted wafer
#2674Power semiconductor device
#2675Printed adhesion deposition to mitigate integrated circuit package delamination
#2676Opening in the pad for bonding integrated passive device in InFO package
#2677Semiconductor device and method for manufacturing semiconductor device
#2678Semiconductor module
#2679Semiconductor package
#2680Semiconductor device and semiconductor device manufacturing method
#2681Semiconductor device and method of forming inductor over insulating material filled trench in substrate
#2682Semiconductor package
#2683Power semiconductor arrangement
#2684Structure for die probing
#2685Scalable high-bandwidth connectivity
#2686Methods for magnetic sensor having non-conductive die paddle
#2687Light emitting device having different types of phosphor material
#2688Flipped die stacks with multiple rows of leadframe interconnects
#2689High-speed semiconductor modules
#2690Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
#2691Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad
#2692Semiconductor device
#2693Semiconductor devices with improved thermal and electrical performance
#2694Semiconductor device
#2695Semiconductor devices comprising getter layers and methods of making and using the same
#2696Method of fabricating low-profile footed power package
#2697Methods and apparatus for isolation barrier with integrated magnetics for high power modules
#2698Light-emitting device and illuminating apparatus
#2699MEMS sensor with side port and method of fabricating same
#2700Integrated circuit structure and method for reducing polymer layer delamination