Sealed electronic control device and method of fabricating the same

ELECTRONIC DEVICE HAVING A WIRING SUBSTRATE

Mold compounds in improved embedded-die coreless substrates, and processes of forming same

Modulation circuit with balun shielding

Wafer Level Packaging Using Blade Molding

Semiconductor package and manufacturing method thereof

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Corrugated die edge for stacked die semiconductor package

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Method and system for thin multi chip stack package with film on wire and copper wire

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Embedded 3D interposer structure

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF

Semiconductor device with the leads projected from sealing body

Semiconductor device with lead terminals having portions thereof extending obliquely

Semiconductor device attached to island having protrusion

Semiconductor storage device and manufacturing method thereof

Integrated circuit package system with package stand-off and method of manufacture thereof

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Semiconductor device with heat spreader

SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR

DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE

Wafer scale package for high power devices

SEMICONDUCTOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME

Subscriber identity module (SIM) card

Manufacturing method for semiconductor devices

Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof

Method for positioning chips during the production of a reconstituted wafer

Stacked package and method of manufacturing the same

Optical semiconductor device and method of manufacturing optical semiconductor device

Methods of making a semiconductor device

LED lamp with light-diffusing end cap

Power semiconductor device and power conversion device

Circuit arrangement with shunt resistor

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Semiconductor device and method of integrating balun and RF coupler on a common substrate

MOLDED BEAM FOR OPTOELECTRONIC SENSOR CHIP SUBSTRATE

Integrated circuit packaging system with leadframe and method of manufacture thereof

Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof

Semiconductor package having gap-filler injection-friendly structure

Multi-chip package semiconductor memory device

Pop precursor with interposer for top package bond pad pitch compensation

Packaged semiconductor device having improved locking properties

Electrode pad having a recessed portion

Stack type semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

Semiconductor device

Method of manufacturing an electronic device with a package locking system

Plasma treatment for semiconductor devices

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Semiconductor device, a method of manufacturing the same and an electronic device

Etched surface mount islands in a leadframe package

Lead frame and semiconductor package using the same

Finger sensor including encapsulating layer over sensing area and related methods

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF

Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device

Combined packaged power semiconductor device

Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Light emitting device and lighting system having the same

Fluorescent substance, method of manufacturing the fluorescent substance, and light emitting device using the fluorescent substance

COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME

PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS

Lighting device comprising LEDs with phosphor layers

Light emitting diode and light module having same

SEMICONDUCTOR DEVICE

PLASTIC CARD PACKAGE AND PLASTIC CARD PACKAGE MANUFACTURING METHOD

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Thermally enhanced electronic package

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Nitridosilicates co-doped with zirconium and hafnium

Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad

STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer

Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same

ELECTRICALLY CONNECTING ROUTES OF SEMICONDUCTOR CHIP PACKAGE CONSOLIDATED IN DIE-ATTACHMENT

Semiconductor device

Package on package having improved thermal characteristics

NO LEAD PACKAGE WITH HEAT SPREADER

Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires

WAFER LEVEL DIODE PACKAGE STRUCTURE

Semiconductor package

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

Semiconductor arrangement with a solder resist layer

Light emitting device and lighting system

LIGHT EMITTING DEVICE PACKAGE USING QUANTUM DOT, ILLUMINATION APPARATUS AND DISPLAY APPARATUS

Method for the miniaturizable contacting of insulated wires

Semiconductor device, and manufacturing method therefor

Method of manufacturing semiconductor device

Method for Making Die Assemblies

Power module, power converter device, and electrically powered vehicle

Surface mountable device

High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Stacked package

Multi-chip package with pillar connection

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof

POWER SEMICONDUCTOR DEVICE

Apparatus for thermally enhanced semiconductor package

SEMICONDUCTOR DEVICE

Pad configurations for an electronic package assembly

Semiconductor device and production method thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

Semiconductor module and semiconductor device

SEMICONDUCTOR PACKAGE AND MANUFACTRING METHOD THEREOF

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Integrated circuit packaging system with magnetic film and method of manufacture thereof

Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure

Semiconductor package with a conductive shielding member

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Semiconductor device

Light emitting device and display

AC switch having compound semiconductor MOSFETs

Small low-profile optical proximity sensor

SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPS

Semiconductor device and manufacturing method of the same

Semiconductor package and method of forming the same

Method of using white resin in an electronic device

Method for manufacturing a semiconductor component and structure therefor

Semiconductor package having a cooling fan and method of fabricating the same

Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus

Light emitting device

Semiconductor device, substrate for producing semiconductor device and method of producing them

Method for producing semiconductor components, and corresponding semiconductor component

DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE

Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate

Multi-Chip Package

Integrated circuit package system with embedded die superstructure and method of manufacture thereof

Chip package having a chip combined with a substrate via a copper pillar

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Semiconductor chip package including a lead frame

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor device with substrate-side exposed device-side electrode and method of fabrication

Semiconductor device and method of manufacturing the same

Semiconductor module with electrical switching elements

Light-emitting diode chip package body and method for manufacturing same

Light emitting device and lighting apparatus

Light-emitting-device package and a method for producing the same

LIGHT EMITTING DIODE PACKAGE

Power semiconductor device

Sintering silver paste material and method for bonding semiconductor chip

Manufacturing method for semiconductor integrated device

Method for fabricating chip elements provided with wire insertion grooves

METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor device including semiconductor elements mounted on base plate

Method of forming a semiconductor device

Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader

Optical package and related methods

Semiconductor module device and driving apparatus having the same

Semiconductor module device and driving apparatus having the same

Method for producing chip packages, and chip package produced in this way

Substrate contact opening

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Package systems having interposers with interconnection structures

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

Leadless package system having external contacts

Leadless integrated circuit packaging system and method of manufacture thereof

Integrated circuit packaging system with isolated pads and method of manufacture thereof

Integrated circuit package system with offset stacked die

Chip-exposed semiconductor device and its packaging method

Semiconductor apparatus and power supply circuit

Method for manufacturing group III nitride semiconductor layer, method for manufacturing group III nitride semiconductor light-emitting device, and group III nitride semiconductor light-emitting device, and lamp

Electronic device incorporating the white resin

Nitride-based semiconductor device and method for fabricating the same

Semiconductor light emitting device packages and methods

Semiconductor light emitting device having heat dissipating vias

LIGHT-EMITTING DIODE (LED) STRUCTURE HAVING A WAVELENGTH-CONVERTING LAYER AND METHOD OF PRODUCING

Integrated circuit package system with laminate base

Etch isolation LPCC/QFN strip

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method and apparatus of manufacturing functionally gradient material

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

Semiconductor device manufacturing method

ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Method for manufacturing a semiconductor component

Stacked electronic component and manufacturing method thereof

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Circuitry and Method for Encapsulating the Same

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Chip packaging

Semiconductor device

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Chip package device and manufacturing method thereof

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Leadless package for high current devices

Direct contact leadless package

Stacked-die package for battery power management

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Power Electronic Device Package

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Three-dimensional package structure

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Semiconductor Device with Circuit for Reduced Parasitic Inductance

Semiconductor unit having a power semiconductor and semiconductor apparatus using the same

LED package structure with a fuse for protection from high current

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER

Light emitting element

Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device

Thin film light emitting diode

SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE

Light emitting package structure

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

Semiconductor package having ink-jet type dam and method of manufacturing the same

LED lamp with chip supported by heat-dissipating member

Semiconductor device

IC Chip Coating Material and Vacuum Fluorescent Display Device Using Same

Light-emitting diode device generating light of multi-wavelengths

Fluorescent substance having a controlled impurity doping of zinc and light-emitting device using the same

Stacked die assembly having reduced stress electrical interconnects

Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation

Stacked semiconductor package and method for manufacturing the same

Wafer level package and methods of fabricating the same

Semiconductor device and method for fabricating semiconductor device

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

Integrated circuit packaging system having a cavity

Semiconductor package, semiconductor device, and semiconductor module

Chip unit and stack package having the same

Semiconductor device and power semiconductor device

Pre-molded clip structure

Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof

Die backside standoff structures for semiconductor devices

IC package with capacitors disposed on an interposal layer

Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate

Lead Frame and Method of Producing Lead Frame

SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

Light emitting diode and method for fabricating the same

BALL GRID ARRAY STACK

Multimedia platform

Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer

Microelectronic packages and methods therefor

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

Semiconductor device and a manufacturing method of the same

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and manufacturing method thereof

Etch-back type semiconductor package, substrate and manufacturing method thereof

Build-up package for integrated circuit devices, and methods of making same

TCE compensation for package substrates for reduced die warpage assembly

Layered chip package and method of manufacturing same

Semiconductor device and method of manufacturing the same

Stackable power MOSFET, power MOSFET stack, and process of manufacture

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Lead frame based semiconductor package and a method of manufacturing the same

Package structure enhancing molding compound bondability

LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Light Emitting Diode Package Structure and Manufacturing Method Therefor

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Vertical semiconductor light emitting device including a capacitor

Anisotropic conductive film and light emitting device

Nitride-based semiconductor device and method for fabricating the same

LED wafer with laminated phosphor layer

Stacked lateral overlap transducer (SLOT) based three-axis accelerometer

Micromachined piezoelectric z-axis gyroscope

Micromachined piezoelectric x-axis gyroscope

Micromachined piezoelectric X-Axis gyroscope

Method for manufacturing interposer

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS

Method for manufacturing semiconductor device

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

Stacked semiconductor device

Die package

Light control apparatus for light emitting device and illumination system

Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor device with stacked semiconductor chips

Wafer level semiconductor package and fabrication method thereof

Semiconductor device having double side electrode structure

Chip package

Electronic device package and method of manufacture

Integrated circuits with multiple I/O regions

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Power block and power semiconductor module using same

DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE