212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device and lead frame used for the same
#7802Resin molded semiconductor device and manufacturing method thereof
#7803Quad flat non-leaded semiconductor package and fabrication method thereof
#7804Circuit board structure and package structure
#7805Integrated circuit including bond wire directly bonded to pad
#7806Lead frame package structure for side-by-side disposed chips
#7807Power semiconductor device packaging
#7808Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height
#7809Semiconductor device packages with electromagnetic interference shielding
#7810Semiconductor package structure and package process
#7811LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER
#7812Image acquisition system and method for the manufacture thereof
#7813Method for manufacturing integrated circuit package system with under paddle leadfingers
#7814Method of manufacturing semiconductor apparatus
#7815THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#7816Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
#7817Chip embedded substrate and method of producing the same
#7818Phosphor materials and related devices
#7819Rigid power module suited for high-voltage applications
#7820Semiconductor memory device
#7821Semiconductor device and method of forming conductive vias with trench in saw street
#7822Package-on-package system with through vias and method of manufacture thereof
#7823Stack package having flexible conductors
#7824Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
#7825Semiconductor device and method of wafer level package integration
#7826Wafer level die integration and method therefor
#7827Semiconductor device having multiple semiconductor elements
#7828Semiconductor equipment and method of manufacturing the same
#7829Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
#7830Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#7831LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
#7832Manufacturing method for electronic devices
#7833Semiconductor device capable of switching operation modes
#7834STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
#7835Method of manufacturing light-emitting device
#7836Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
#7837Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
#7838Light emitting device using filter element
#7839Circuit module
#7840Power semiconductor module
#7841Light emitting device
#7842Light emitting diode and light source module incorporating the same
#7843Integrated circuit package in package system
#7844Method of manufacturing semiconductor device
#7845Semiconductor device and method of manufacturing the same
#7846Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
#7847Semiconductor device
#7848Leadframe package for high-speed data rate applications
#7849Lead frame for semiconductor device
#7850Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe
#7851Lead frame for semiconductor package
#7852SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#7853Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same
#7854Light emitting device
#7855METHOD FOR PREPARING A B-SiAION PHOSPHOR
#7856LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
#7857Process for the wafer-scale fabrication of electronic modules for surface mounting
#7858Method for manufacture of inline integrated circuit system
#7859SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
#7860PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#7861Packaging process to create wettable lead flank during board assembly
#7862OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM
#7863ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
#7864Decorative and functional light-emitting device lighting fixtures
#7865Decorative and functional light-emitting device lighting fixtures
#7866Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR
#7867Image display device and light emission device
#7868LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#7869Wire bonding structure of semiconductor device and wire bonding method
#7870Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
#7871Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
#7872Semiconductor device with improved resin configuration
#7873Semiconductor device
#7874Embedded semiconductive chips in reconstituted wafers, and systems containing same
#7875Semiconductor device including coupling ball with layers of aluminum and copper alloys
#7876Radiate under-bump metallization structure for semiconductor devices
#7877Power semiconductor module
#7878Device and method for manufacturing a device
#7879Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof
#7880Semiconductor device packages including connecting elements
#7881SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE
#7882Semiconductor package
#7883Apparatus for and methods of attaching heat slugs to package tops
#7884Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
#7885LEAD FRAME WITH RECESSED DIE BOND AREA
#7886Stacked chip package with redistribution lines
#7887Semiconductor device and communication method
#7888Semiconductor device and method of forming high-attenuation balanced band-pass filter
#7889Wafer level image sensor packaging structure and manufacturing method of the same
#7890Manufacturing method and structure of a wafer level image sensor module with package structure
#7891Heat dissipation by through silicon plugs
#7892LED DIE STRUCTURE AND METHOD FOR MANUFACTURING THE BOTTOM TERMINAL THEREOF
#7893Optical semiconductor element mounting package, and optical semiconductor device using the same
#7894SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE EMPLOYING THE SUBSTRATE
#7895Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit
#7896SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE EMPLOYING IT
#7897Semiconductor package with through silicon vias
#7898Light emitting device having multiple cavities and light unit having the same
#7899Solar sensor for the detection of the direction of incidence and the intensity of solar radiation
#7900Method for manufacturing wafer scale heat slug system
#7901SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#7902Semiconductor device and manufacturing method of the same
#7903Method of forming package-on-package and device related thereto
#7904PHOSPHOR, METHOD OF COATING THE SAME, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS
#7905Chipstack package and manufacturing method thereof
#7906METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING COMPRESSION MOLDING
#7907Illumination device for display device, and display device
#7908Semiconductor device and method for manufacturing the same
#7909Semiconductor device
#7910SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7911SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#7912Semiconductor packages having warpage compensation
#7913Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
#7914Semiconductor device
#7915Semiconductor device and semiconductor device manufacturing method
#7916Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#7917Semiconductor device
#7918SEMICONDUCTOR DEVICE
#7919Semiconductor device
#7920Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure
#7921Integrated circuit packaging system with leads and method of manufacture thereof
#7922Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
#7923Semiconductor device package having a jumper chip and method of fabricating the same
#7924Integrated circuit packaging system with interconnect and method of manufacture thereof
#7925Integrated circuit packaging system with stacking option and method of manufacture thereof
#7926Integrated circuit protruding pad package system and method for manufacturing thereof
#7927Integrated circuit packaging system with leadframe and method of manufacture thereof
#7928Semiconductor memory device and manufacturing the same
#7929Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#7930Semiconductor device and lead frame
#7931Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#7932Method for fabrication of a semiconductor device and structure
#7933Method for fabrication of a semiconductor device and structure
#7934Light emitting device, light emitting device package and lighting system
#7935SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE
#7936LIGHT-EMITTING DEVICE
#7937Light emitting device and light emitting device package
#7938Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
#7939Method of attaching die to circuit board with an intermediate interposer
#7940Method for filling multi-layer chip-stacked gaps
#7941Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
#7942Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
#7943Methods for protecting a die surface with photocurable materials
#7944Electronic circuit module component and method of manufacturing electronic circuit module component
#7945LED lamp
#7946Enhanced color rendering index emitter through phosphor separation
#7947Molded power-supply module with bridge inductor over other components
#7948Electric power conversion apparatus
#7949System-in-package using embedded-die coreless substrates, and processes of forming same
#7950MULTI-FUNCTION CARD DEVICE
#7951Packaged electronic device having metal comprising self-healing die attach material
#7952Semiconductor package with stacked chips and method for manufacturing the same
#7953Under-Bump Metallization Structure for Semiconductor Devices
#7954Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof
#7955Integrated circuit package system with package stacking and method of manufacture thereof
#7956Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
#7957Stacked dual chip package and method of fabrication
#7958Integrated circuit packaging system with lead frame and method of manufacture thereof
#7959Multi-layer lead frame package and method of fabrication
#7960SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#7961PHOTOELECTRIC CONVERSION FILM-STACKED SOLID-STATE IMAGING DEVICE WITHOUT MICROLENSES, ITS MANUFACTURING METHOD, AND IMAGING APPARATUS
#7962Stacked die package for MEMS resonator system
#7963MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
#7964Semiconductor device
#7965Vertical MOSFET with through-body via for gate
#7966Light emitting diode and method of fabricating the same
#7967Semiconductor chip assembly with post/base heat spreader with thermal via
#7968Light Emitting Diode Package Structure and Manufacturing Method Thereof
#7969Fabrication method for resin-encapsulated semiconductor device
#7970Semiconductor device and manufacturing method of the same
#7971Semiconductor device and automotive ac generator
#7972SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7973Light emitting device
#7974Light emitting device package and lighting system
#7975Method of sensing magnitude of current through semiconductor power device
#7976Method of manufacturing electronic device and electronic device
#7977Layered chip package with wiring on the side surfaces
#7978ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#7979METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#7980Process for fabricating electronic components using liquid injection molding
#7981QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#7982Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#7983Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#7984Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#7985Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#7986PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE
#7987Lead frame for semiconductor device and method of manufacturing of the same
#7988Leadframe based multi terminal IC package
#7989Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#7990Quad flat non-leaded semiconductor package
#7991Package having spaced apart heat sink
#7992SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR
#7993Semiconductor device and method of forming insulating layer around semiconductor die
#7994Semiconductor packaging and fabrication method using connecting plate for internal connection
#7995Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#7996Semiconductor device and multi-layered wiring substrate
#7997Light-emitting device
#7998Light emitting diode wafer-level package with self-aligning features
#7999Electronic circuit device
#8000COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
#8001Carrier system with multi-tier conductive posts and method of manufacture thereof
#8002SURFACE PROTECTION TAPE FOR DICING AND METHOD FOR PEELING AND REMOVING SURFACE PROTECTION TAPE FOR DICING
#8003Enhanced integrated circuit package
#8004Method for singulating electronic components from a substrate
#8005Method of fabricating multi-chip package structure
#8006DICING DIE-BONDING FILM
#8007Non-uniform diffuser to scatter light into uniform emission pattern
#8008LED lamp incorporating remote phosphor and diffuser with heat dissipation features
#8009LED based pedestal-type lighting structure
#8010Multi-surface IC packaging structures
#8011Dummy wafers in 3DIC package assemblies
#8012Bump-on-lead flip chip interconnection
#8013MULTI-CHIP INTEGRATED CIRCUIT
#8014Semiconductor package with embedded die and its methods of fabrication
#8015Stacked semiconductor chips with separate encapsulations
#8016Thin package system with external terminals and method of manufacture thereof
#8017Semiconductor device capable of switching operation mode and operation mode setting method therefor
#8018COL package having small chip hidden between leads
#8019Stacked semiconductor packages
#8020INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
#8021Semiconductor device and method of forming wafer level multi-row etched lead package
#8022Integrated circuit package stacking system with shielding and method of manufacture thereof
#8023Chip package and method for fabricating the same
#8024Stacked semiconductor package having discrete components
#8025Semiconductor device
#8026SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8027Light emitting device
#8028SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
#8029Light emitting device and light unit having the same
#8030Increasing contrast in electronic color displays via surface texturing of LEDs
#8031Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces
#8032METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#8033SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE
#8034Processing method for package substrate
#8035Optical coupler and producing method thereof
#8036Jacketed LED assemblies and light strings containing same
#8037High Frequency Power Supply Module Having High Efficiency and High Current
#8038Die bond film, dicing die bond film, and semiconductor device
#8039Semiconductor device with hollow structure
#8040Semiconductor die having a redistribution layer
#8041Manufacturing method for semiconductor package
#8042CHIP PACKAGE
#8043Semiconductor package and manufacturing method thereof
#8044Thermal vias in an integrated circuit package with an embedded die
#8045Integrated circuit packaging system with encapsulation connector and method of manufacture thereof
#8046Semiconductor device and method of manufacturing a semiconductor device
#8047SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8048Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer
#8049Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
#8050Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#8051LED multi-chip bonding die and light strip using the same
#8052Manufacturing method of combined sensor
#8053Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package
#8054SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#8055Method of manufacture of an integrated circuit package
#8056Light emitting device
#8057Electronic component
#8058Resin-sealed electronic control device and method of fabricating the same
#8059Resin-sealed electronic control device and method of fabricating the same
#8060Current sensors and methods
#8061Wireless communication system
#8062PACKAGE DEVICE AND FABRICATION METHOD THEREOF
#8063Device including an encapsulated semiconductor chip and manufacturing method thereof
#8064Wirebondless wafer level package with plated bumps and interconnects
#8065Semiconductor device and method of forming IPD in fan-out level chip scale package
#8066Thermal interface material design for enhanced thermal performance and improved package structural integrity
#8067Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#8068Method of manufacturing a semiconductor device
#8069Power device packages having thermal electric modules using peltier effect and methods of fabricating the same
#8070Semiconductor device assemblies
#8071LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
#8072Integrated circuit packaging system with shield and method of manufacture thereof
#8073Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
#8074Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
#8075Illuminating device
#8076Semiconductor device and penetrating electrode testing method
#8077Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#8078Adaptive patterning for panelized packaging
#8079System on a chip with on-chip RF shield
#8080METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#8081SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#8082Selective removal of gold from a lead frame
#8083Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#8084Method of manufacturing wafer level package including coating resin over the dicing lines
#8085Manufacturing method of semiconductor device
#8086Integrated circuit packaging system and method of manufacture thereof
#8087Semiconductor device and manufacturing method therefor
#8088Method of manufacturing layered chip package
#8089Phosphor-centric control of color of light
#8090Led lead frame structure
#8091Light-emitting device and lighting apparatus provided with the same
#8092PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
#8093Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
#8094Lead frame ball grid array with traces under die
#8095Land grid array package capable of decreasing a height difference between a land and a solder resist
#8096Semiconductor device and electronic device
#8097Integrated circuit package with enlarged die paddle
#8098Semiconductor storage device and manufacturing method thereof
#8099Method for manufacturing semiconductor device
#8100Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same