High temperature, stable SiC device interconnects and packages having low thermal resistance

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor chip stack package having dummy chip

Lead-frame-based semiconductor package and lead frame thereof

Lead frame routed chip pads for semiconductor packages

Leadframe and semiconductor package made using the leadframe

Support device for monolithically integrated circuits

Multi-function card device

Wire loop, semiconductor device having same and wire bonding method

Shielded semiconductor device

Method of manufacturing a cavity package

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor package and fabrication method of the same

Semiconductor device package and manufacturing method thereof

Electronic device

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Structure of substrate

Semiconductor package having passive component disposed between semiconductor device and substrate

Method for manufacturing semiconductor device having a pair of heat sinks

Lead frame for semiconductor device

FBGA and COB package structure for image sensor

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Semiconductor package device having reduced mounting height and method for manufacturing the same

Low cost lead-free preplated leadframe having improved adhesion and solderability

Semiconductor device

Wire bonds having pressure-absorbing balls

Adhesive of folder package

Method of manufacturing a semiconductor device

Method for cutting lead terminal of package type electronic component

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

Light-emitting device, and illumination apparatus and display apparatus using the light-emitting device

Jacketed LED assemblies and light strings containing same

Stacked electronic component and manufacturing method thereof

Semiconductor device with mechanism for leak defect detection

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Copper interconnect

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

High power light emitting diode device

Multi-chip package structure

Stack chip package

Accessible electronic storage apparatus

Stacked-type semiconductor device

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Semiconductor integrated circuit device and method of manufacturing the same

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Semiconductor package and lead frame therefor

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method of the same

Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes

Diode housing

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Semiconductor device and manufacturing method therefor

Pressure sensor with integrated structure

Method of marking a low profile packaged semiconductor device

Method for making a neo-layer comprising embedded discrete components

Package that integrates passive and active devices with or without a lead frame

Methods of forming semiconductor packages

Arrangement of luminescent materials, wavelength-converting casting compound and light source

Leadframe and packaged light emitting diode

Light emitting device

Surface acoustic wave element

Resin casting mold and method of casting resin

Power semiconductor package

Carrier with metal bumps for semiconductor die packages

Circuit device with circuit board and semiconductor chip mounted thereon

PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Multi lead frame power package

Ball grid array substrate having window and method of fabricating same

Semiconductor device with a substrate having a spiral shaped coil

Manufacturing method of a quad flat no-lead package structure

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Multi-chip package structure

Multi-chip package structure

Packaged electronic devices, and method for making same

Methods of making and using a floating lead finger on a lead frame

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

PCB, manufacturing method thereof and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Method for re-routing lithography-free microelectronic devices

Memory package

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Optical element, optical module, and optical transmission device

Electronic component with a housing package

Housing for power semiconductor modules

Multi-chip module

Method of making wafer level ball grid array

Flip chip package with anti-floating structure

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Multi-chip module having bonding wires and method of fabricating the same

High density package interconnect wire bond strip line and method therefor

Flash preventing substrate and method for fabricating the same

Semiconductor package, manufacturing method thereof and IC chip

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Electrical-interference-isolated transistor structure

Semiconductor package having improved adhesion and solderability

Electronic component and a panel

Ceramic composite material for light conversion and use thereof

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Transparent optical component for light emitting/receiving elements

Wireless communication system

Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure

Methods for fabricating stiffeners for flexible substrates

Carrier-free semiconductor package and fabrication method thereof

Method of fabrication of stacked semiconductor devices

Semiconductor memory device and defect remedying method thereof

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Light-emitting diode, led light, and light apparatus

Packaging structure with a plurality of drill holes formed directly below an underfill layer

Semiconductor package and fabrication method thereof

Semiconductor device and method of fabricating the same

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

Memory module having interconnected and stacked integrated circuits

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Lead frame assemblies and decoupling capacitors

Sharp corner lead frame

Electronic microcircuit having internal light enhancement

Semiconductor device and method of manufacturing the same

Memory cards and method of fabricating the memory cards

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Method of manufacturing a light emitting device

Surface acoustic wave device package

Multi-chip module

Semiconductor device and method for manufacturing the same

Semiconductor device

Heat stud for stacked chip package

Semiconductor chip and tab package having the same

connection arrangement for micro lead frame plastic packages

Simplified multichip packaging and package design

Semiconductor device

Integrated circuit including silicon wafer with annealed glass paste

Methods for aligning semiconductor fabrication molds and semiconductor substrates

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Package for a semiconductor device

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Method for two-stage transfer molding device to encapsulate MMC module

Multilayered circuit substrate, semiconductor device and method of producing same

RFID tag in a substrate

Semiconductor device, method and apparatus for fabricating the same

Semiconductor component package

Multi-chip package using an interposer

Package structure of memory card and packaging method for the structure

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Trenched MOSFETS with part of the device formed on a (110) crystal plane

Insulating substrate and semiconductor device having a thermally sprayed circuit pattern

Electronic device and method of manufacturing the same

Semiconductor chip package having an adhesive tape attached on bonding wires

Techniques for microchannel cooling

Method and apparatus for integrating a surface acoustic wave filter and a transceiver

Fabrication method of semiconductor integrated circuit device

Method of making light emitting device with silicon-containing encapsulant

Hybrid card

Led-based illumination unit

BGA package having substrate with exhaust hole

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Modular construction component with encapsulation

Semiconductor packages with asymmetric connection configurations

Flip-chip component

Multi-chip package

Integrated circuit package system with leadframe substrate

Marking method and sheet for both protective film forming and dicing

Micro lead frame packages and methods of manufacturing the same

Fabricating surface mountable semiconductor components with leadframe strips

Electronic component module having electronic component with piezoelectric device

Semiconductor package device and method for fabricating the same

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor device having flip-chip package and method for fabricating the same

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Staggered wirebonding configuration

Multi chip package

Electronic device package and electronic equipment

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Stepped integrated circuit packaging and mounting

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having post-mold nickel/palladium/gold plated leads

Multi-chip package

Method for making a surface acoustic wave device package

Semiconductor device

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Method for reducing semiconductor die warpage

Thermal enhance package and manufacturing method thereof

Methods of manufacturing interposers with flexible solder pad elements

Method of manufacturing a wafer assembly

Phosphor blends for green traffic signals

Semiconductor device and method for manufacturing same

Cavity-down Package and Method for Fabricating the same

Semiconductor device and method for fabricating the same

Electronic component comprising external surface contacts and a method for producing the same

Multi-chip stack package

Circuitized substrate with trace embedded inside ground layer

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Semiconductor device and method of fabricating the same

Cavity-down thermally enhanced package

Semiconductor package with heat sink and method for fabricating same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor module, process for producing the same, and film interposer

Semiconductor device and a method for manufacturing of the same

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Flexible leaded stacked semiconductor package

Chip package having flat transmission surface of transparent molding compound and method for manufacturing the same

Semiconductor device and manufacturing process thereof

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Manufacturing method of solid-state image sensing device

Low thermal resistance LED package

LED module and method of packaging the same

Method for fabricating semiconductor package with short-prevented lead frame

Chip package, chip packaging, chip carrier and process thereof

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Packaged device and method of forming same

Molded high density electronic packaging structure for high performance applications

Audio amplifier assembly

Multilayer semiconductor device

Semiconductor device and method for producing the same

IC (integrated circuit) card

Thermally enhanced molded package for semiconductors

IC substrate and manufacturing method thereof and semiconductor element package thereby

Cavity-down multiple-chip package

Physical quantity sensor and manufacturing method therefor

Vacuum sealed surface acoustic wave pressure sensor

Circuit carrier and production thereof

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Method for fabricating quad flat non-leaded package

Packaging method for an electronic element

Mixture of alkaline earth metal thiogallate green phosphor and sulfide red phosphor for phosphor-converted LED

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Integrated circuit package employing a heat-spreader member

Heat dissipating package structure and method for fabricating the same

Package structure module of bump posited type lead frame

Multichip leadframe package

Device and method for emitting output light using quantum dots and non-quantum fluorescent material

Package structure of light-emitting device

Flexible circuit board processing method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method for the same

Method of manufacturing an LED

Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

Memory card structure and manufacturing method thereof

Folded substrate with interposer package for integrated circuit devices

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Semiconductor component with plastic housing, and process for producing the same

Memory card structure

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Die attach paddle for mounting integrated circuit die

Integrated circuit package employing a flexible substrate

Lead frame and physical amount sensor

Semiconductor light-emitting element assembly with a composite substrate

Semiconductor light emitting device

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Curable organopolysiloxane composition and a semiconductor device made with the use of this composition

Optical system using LED coupled with phosphor-doped reflective materials

Power semiconductor module

Light emitting device with controlled thickness phosphor

Semiconductor light emitting device having mixed light emission

White lamps with enhanced color contrast

Mold compound interlocking feature to improve semiconductor package strength

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Copper interconnect

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Method of forming a stacked semiconductor package

Semiconducting device that includes wirebonds

Semiconductor lead frame, semiconductor package having the same, and method of plating the same

Semiconductor device

Lead frame and semiconductor package therefor

Active device bases, leadframes utilizing the same, and leadframe fabrication methods

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Lead frame and light receiving module comprising it

Led lamp for light source

Semiconductor package including light emitter and IC