212716 ā
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device and metering apparatus
#2102Chip package and a wafer level package
#2103Leadframe and method of manufacturing the same
#2104Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#2105HEAT DISSIPATING STRUCTURE AND MANUFACTURE
#2106Resin molding and sensor device
#2107Process for improved halide materials
#2108Low-profile stacked-die MEMS resonator system
#2109Multi-stacked electronic device with defect-free solder connection
#2110Package-on-package with cavity in interposer
#2111Method for manufacturing interconnect structure
#2112Semiconductor device with electromagnetic interference protection and method of manufacture
#2113Pad design for reliability enhancement in packages
#2114Wiring board, electronic device, and electronic module
#2115Semiconductor device and manufacturing method of the same
#2116Pressing of wire bond wire tips to provide bent-over tips
#2117Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component
#2118IGBT die structure with auxiliary P well terminal
#2119Method for interconnecting stacked semiconductor devices
#2120Electronic component package and method of manufacturing the same
#2121Semiconductor package structure and fabrication method thereof
#2122Method for fabricating semiconductor package and semiconductor package using the same
#2123Semiconductor substrate including embedded component and method of manufacturing the same
#2124HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY
#2125Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#2126Thermal interface material layer and package-on-package device including the same
#2127Manufacturing method of semiconductor device
#2128Devices and methods related to radio-frequency switches having improved on-resistance performance
#2129Manufacturing method for semiconductor package with cantilever pads
#2130Fluoride fluorescent material and method for producing the same as well as light emitting device using the same
#2131Semiconductor device
#2132Extremely high frequency systems and methods of operating the same
#2133SEMICONDUCTOR MODULE
#2134Phosphor and method of manufacturing same, and LED lamp
#2135LIGHT EMITTING DIODE
#2136Semiconductor device including sense insulated-gate bipolar transistor
#2137Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
#2138Light emitting device and manufacturing method thereof
#2139FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE
#2140Semiconductor package and manufacturing method thereof
#2141Packaged semiconductor devices and methods of packaging semiconductor devices
#2142Microelectronic device package having alternately stacked die
#2143Protective film for semiconductors, semiconductor device, and composite sheet
#2144Semiconductor chip
#2145Integrated circuit package substrate
#2146POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS
#2147Semiconductor device with island and associated leads
#2148Wafer level package structure and method of forming same
#2149Fan-out semiconductor package
#2150Circuit board, imaging device, and electronic apparatus
#2151Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
#2152Integrated RF front end system
#2153Semiconductor package and method of manufacturing the semiconductor package
#2154Method for making semiconductor device with sidewall recess and related devices
#2155Semiconductor device
#2156Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
#2157Integrated circuits protected by substrates with cavities, and methods of manufacture
#2158MEMS sensor package systems and methods
#2159Light emitting diode package having series connected LEDs
#2160Light emitting device and method for manufacturing light emitting device
#2161Semiconductor package
#2162Bonding wire for semiconductor device
#2163Ring structures in device die
#2164Semiconductor package structure and method of manufacturing the same
#2165Package substrate and flip-chip package circuit including the same
#2166SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
#2167Semiconductor device
#2168Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps
#2169Manufacturing method of semiconductor device
#2170Sensor device for wearable device generating power-on trigger signal
#2171LED lighting apparatus
#2172Microelectronic system including printed circuit board having improved power/ground ball pad array
#2173LED module
#2174Chip package structure and manufacturing method thereof
#2175Semiconductor package
#2176Method of manufacturing semiconductor device
#2177Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
#2178Chip package structure and manufacturing method thereof
#2179Manufacturing method of package-on-package structure
#2180Shielded EHF connector assemblies
#2181Method for producing optical semiconductor device and optical semiconductor device
#2182Method of manufacturing semiconductor package
#2183Semiconductor device and manufacturing method of the same
#2184Semiconductor device and method of manufacturing the same
#2185Substrate structure, packaging method and semiconductor package structure
#2186Module and method for manufacturing same
#2187Package structure and its fabrication method
#2188Fully molded miniaturized semiconductor module
#2189Semiconductor device and wiring board design method
#2190Fan-out ball grid array package structure and process for manufacturing the same
#2191Thermally conductive semiconductor device and manufacturing method thereof
#2192Semiconductor Substrate
#2193Semiconductor device and method for manufacturing the same
#2194Semiconductor device and method of forming interposer with opening to contain semiconductor die
#2195Primer composition, adhering method, and electric/electronic part
#2196Optoelectronic component with a first potting material covering parts of a first optoelectronic semiconductor chip and a second potting material covering the first potting material
#2197Semiconductor device method of manufacture
#2198Semiconductor package device and method of manufacturing the same
#2199Multi-phase common contact package
#2200Electronic module and method for encapsulation thereof
#2201Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
#2202Method of manufacturing a semiconductor power package
#2203Magnetic field sensor and method for making same
#2204Light emitting device, and method for manufacturing thereof
#2205Solution for reducing poor contact in InFO package
#2206Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#2207Semiconductor device
#2208Method of manufacturing semiconductor package
#2209Single or multi chip module package and related methods
#2210Tapeless leadframe package with underside resin and solder contact
#2211Semiconductor package
#2212Package structures
#2213Chip carrier configured for delamination-free encapsulation and stable sintering
#2214Lead and lead frame for power package
#2215Molded resin-sealed power semiconductor device
#2216Semiconductor device
#2217Leadframe having organic, polymerizable photo-imageable adhesion layer
#2218Electronic device, electronic device apparatus, electronic apparatus, and moving object
#2219High-frequency module
#2220Light-emitting module
#2221High-frequency module
#2222Compound semiconductor substrate and fabrication method therefor, compound semiconductor device and fabrication method therefor, power supply apparatus and high-output amplifier
#2223Semiconductor module
#2224SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#2225Semiconductor device
#2226Semiconductor device
#2227Power module and fabrication method for the same
#2228Semiconductor module including semiconductor package and semiconductor package
#2229PHOSPHOR AND LIGHT EMITTING DEVICE
#2230UV-C water purification device
#2231Protection schemes for MEMS switch devices
#2232Semiconductor package including antenna substrate and manufacturing method thereof
#2233Electronic device package and fabricating method thereof
#2234Package structure and method of forming the same
#2235Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
#2236Three-dimensional stacked integrated circuit devices and methods of assembling the same
#2237Package with passive devices and method of forming the same
#2238Semiconductor package
#2239Land structure for semiconductor package and method therefor
#2240Fine pitch BVA using reconstituted wafer with area array accessible for testing
#2241Encapsulated semiconductor package and method of manufacturing thereof
#2242Electrical interconnect structure for an embedded electronics package
#2243Light emitting diode component
#2244LIGHT EMITTING DIODES AND METHODS
#2245Non-volatile memory with stacked semiconductor chips
#2246Method for fabricating a semiconductor package
#2247Semiconductor device including two or more chips mounted over wiring substrate
#2248Pad design for reliability enhancement in packages
#2249Semiconductor device and method of manufacturing semiconductor device
#2250Double-sided semiconductor package and dual-mold method of making same
#2251Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
#2252Interposer, semiconductor package structure, and semiconductor process
#2253Chip package and package substrate
#2254Method of manufacturing a semiconductor device comprising a semiconductor chip mounted over a metal plate having an inclined surface
#2255Methods for producing semiconductor devices
#2256Method of producing nitride fluorescent material, nitride fluorescent material, and light-emitting device using the same
#2257Semiconductor device and method of manufacturing the same
#2258SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
#2259Semiconductor device with thin redistribution layers
#2260SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2261Fabrication method of semiconductor package
#2262Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
#2263Leadframe package with stable extended leads
#2264Power module
#2265Board having electronic element, method for manufacturing the same, and electronic element module including the same
#2266Light-emitting diode, light-emitting diode package, and lighting system including same
#2267Electronic package structure with multiple electronic components
#2268Semiconductor package and method for manufacturing the same
#2269Wire bond wires for interference shielding
#2270Semiconductor chip package having a repeating footprint pattern
#2271Semiconductor device
#2272Semiconductor package
#2273Semiconductor device and method
#2274Integrated circuit package pad and methods of forming
#2275Semiconductor device and method of manufacturing the same
#2276Sensor assembly
#2277Powerstage attached to inductor
#2278Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
#2279Process for manufacturing a surface-mount semiconductor device having exposed solder material
#22803D printed hermetic package assembly and method
#2281Memories and memory components with interconnected and redundant data interfaces
#2282Battery protecting apparatus
#2283Semiconductor package
#2284Stack device having voltage compensation
#2285Intelligent power module and manufacturing method thereof
#2286Package-on-package (PoP) structure including stud bulbs
#2287Semiconductor device
#2288Semiconductor integrated circuit device
#2289SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2290LPS solder paste based low cost fine pitch pop interconnect solutions
#2291Single-shot encapsulation
#2292Fan-out semiconductor package
#2293Method of manufacturing a semiconductor device
#2294Cavity package with composite substrate
#2295Semiconductor device with lead terminals having portions thereof extending obliquely
#2296Method of manufacturing semiconductor device
#2297Memory device comprising programmable command-and-address and/or data interfaces
#2298Wafer level package for a MEMS sensor device and corresponding manufacturing process
#2299Power semiconductor module and electric power conversion device
#2300Semiconductor device having switching element suppressing potential variation
#2301Semiconductor module and method for manufacturing the same
#2302Light-emitter mounting package, light-emitting device, and light-emitting module
#2303Hollow metal pillar packaging scheme
#2304Method for manufacturing semiconductor device
#2305INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSOCIATED SYSTEMS AND METHODS
#2306Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2307Semiconductor device and method for manufacturing same
#2308Semiconductor device and manufacturing method thereof
#2309Method of fabricating electronic package
#2310Semiconductor chip package having heat dissipating structure
#2311Power module and motor drive circuit
#2312Remapped packaged extracted die with 3D printed bond connections
#2313Semiconductor device
#2314Leadframe and chip package comprising a leadframe
#2315Optoelectronic semiconductor component
#2316Semiconductor illuminating device
#2317LIGHT SOURCE ASSEMBLY WITH IMPROVED COLOR UNIFORMITY
#2318Terahertz CMOS sensor
#2319Solder material for semiconductor device
#2320Semiconductor packages and methods of packaging semiconductor devices
#2321Method and apparatus for making integrated circuit packages
#2322Fan-out package and methods of forming thereof
#2323Semiconductor device packages
#2324Double-encapsulated power semiconductor module and method for producing the same
#2325Packaged semiconductor devices and methods of packaging semiconductor devices
#2326Embedded semiconductive chips in reconstituted wafers, and systems containing same
#2327Sawn leadless package having wettable flank leads
#2328Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#23293D semiconductor package interposer with die cavity
#2330Package-on-package assembly with wire bond vias
#2331Systems and methods for bonding semiconductor elements
#2332Info package with integrated antennas or inductors
#2333FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#2334Signal pin arrangement for multi-device power module
#2335Light emitting device and method of manufacturing the same, and display device
#2336Semiconductor device and method of manufacture
#2337Integrated circuit package assembly
#2338Fan out semiconductor device including a plurality of semiconductor die
#2339Stretchable electronics fabrication method with strain redistribution layer
#2340SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR INTEGRATED CIRCUIT MODULES
#2341Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package
#2342Semiconductor package
#2343Package on-package structure
#2344Bottom package exposed die MEMS pressure sensor integrated circuit package design
#2345Fingerprint identification module and method for manufacturing the same
#2346Electromagnetic signal focusing structures
#2347Light-emitting diode (LED), LED package and apparatus including the same
#2348Package assembly
#2349Semiconductor device and method of forming PoP semiconductor device with RDL over top package
#2350Package structure with dummy feature in passivation layer
#2351Lead frame and method of fabricating the same
#2352Electronic components with integral lead frame and wires
#2353Semiconductor device with solders of different melting points and method of manufacturing
#2354Semiconductor device and measurement device
#2355Method of manufacturing a circuit device
#2356Magnetic memory device
#2357Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same
#2358Light emitting device and method of manufacturing the light emitting device
#2359Method for manufacturing light-emitting device
#2360Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#2361Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#2362Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#2363Semiconductor device
#2364Mechanisms for forming bonding structures
#2365Semiconductor device including interconnected package on package
#2366Lead-Free Solder Ball
#2367Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board
#2368Semiconductor device
#2369Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#2370Packing method for semiconductor device
#2371LED package with integrated features for gas or liquid cooling
#2372PāN separation metal fill for flip chip LEDs
#2373Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#2374Fabrication of radio-frequency devices with amplifier voltage limiting features
#2375Method of manufacturing a package-on-package type semiconductor package
#2376Semiconductor package and manufacturing method of the same
#2377Tamper detection for a chip package
#2378Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#2379Package-on-package type semiconductor device including fan-out memory package
#2380Isolation between semiconductor components
#2381Semiconductor device
#2382Packaging mechanisms for dies with different sizes of connectors
#2383SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
#2384Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz
#2385Electrically conductive composition
#2386Reconstructed wafer based devices with embedded environmental sensors and process for making same
#2387Mechatronic component and method for the production thereof
#2388Apparatus and methods for actively-controlled trigger and latch release thyristor
#2389Light emitting device
#2390Light-emitting element and light-emitting diode
#2391Light-emitting apparatus
#2392Bonding wire for semiconductor device
#2393Electronic part embedded substrate and method of producing an electronic part embedded substrate
#2394Semiconductor packages and methods of fabrication thereof
#2395Thin film based fan out and multi die package platform
#2396SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
#2397Field emission devices and methods of making thereof
#2398SYSTEM AND METHOD FOR MANUFACTURING A CAVITY DOWN FABRICATED CARRIER
#2399Semiconductor sensor assembly for harsh media application
#2400Camera module and electronic device