Semiconductor package and method of fabricating the same

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Vertically integrated systems

Processes and structures for IC fabrication

Semiconductor device and manufacturing method thereof

Semiconductor device for battery power voltage control

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Semiconductor substrate assembly with embedded resistance element

Multi-chip package and method of formation

EBG structure, semiconductor device, and circuit board

Semiconductor device

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Circuit module and method of producing the same

Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Integrated circuit package including in-situ formed cavity

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Semiconductor device, and method of manufacturing semiconductor device

Wafer scale package for high power devices

Method of fabrication of encapsulated electronics devices mounted on a redistribution layer

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Chip package with passives

Wiring substrate and semiconductor package

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Wire tail connector for a semiconductor device

Semiconductor device having an inductor

Warp compensated electronic assemblies

Semiconductor substrate and semiconductor chip

Group III nitride based flip-chip integrated circuit and method for fabricating

Semiconductor device and radio communication device

Semiconductor device

Semiconductor package and fabrication method thereof

Electronic device

Electronic module allowing fine tuning after assembly

Methods of forming 3-D circuits with integrated passive devices

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Semiconductor device including DC-DC converter

Semiconductor device and electronic device having the same

Chip embedded substrate and method of producing the same

Semiconductor device including a DC-DC converter

Semiconductor device and a method of manufacturing the same

Electrical system and core module thereof

Apparatus related to an improved package including a semiconductor die

Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy

Circuit module and production method therefor

System and method of sensing current in a power semiconductor device

Semiconductor device

Semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Formulation for packaging an electronic device and assemblies made therefrom

Three-dimensional semiconductor architecture

Semiconductor component comprising copper metallizations

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device including electromagnetic absorption and shielding

Isolation structure for stacked dies

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Semiconductor device

Method for manufacturing a semiconductor device having multiple heat sinks

Sensor package

3D IC method and device

Three-dimensional structure in which wiring is provided on its surface

Three-dimensional structure for wiring formation

Display drive circuit including an output terminal

Barrier for through-silicon via

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor package having supporting plate and method of forming the same

Semiconductor wiring patterns

Semiconductor die package and method for making the same

Semiconductor device

Tie bar resonance suppression

Tamper-resistant coating for an integrated circuit

Wireless module

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and method for manufacturing the same

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor device with conductive vias

Semiconductor device and manufacturing method thereof

Multiple die in a face down package

Semiconductor device and method of confining conductive bump material with solder mask patch

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

Embedded chip packages and methods for manufacturing an embedded chip package

Passive component as thermal capacitance and heat sink

Semiconductor device and a method of manufacturing the same

Semiconductor device and production method therefor

Semiconductor device and a method of manufacturing the same

Alkali silicate glass based coating and method for applying

Integrated power module for multi-device parallel operation

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Linked semiconductor module unit and electronic circuit-integrated motor device using same

Compliant printed circuit semiconductor package

Semiconductor package device having passive energy components

Packages with passive devices and methods of forming the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Electronic substrate, semiconductor device, and electronic device

Semiconductor device with discrete blocks

Electronic device and manufacturing method thereof

Semiconductor package for high power devices

Semiconductor device

Semiconductor device and method of manufacturing the same

Systems, methods and devices having stretchable integrated circuitry for sensing and delivering therapy

Semiconductor package having an antenna and manufacturing method thereof

Electronic circuit and semiconductor component

Multilayer ceramic electronic device and method for manufacturing the same

Method of packaging a die

Mount board and electronic device

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Semiconductor structure with thin film resistor and terminal bond pad

Electronic assembly with detachable components

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic modules

Electronic device and method for production

Method of manufacturing electronic device and electronic device

Integrated chip package structure using ceramic substrate and method of manufacturing the same

Bump structure for stacked dies

Semiconductor device and method of forming through vias with reflowed conductive material

Method of manufacturing electronic component module and electronic component module

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device fabrication method capable of scribing chips with high yield

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device bonding with stress relief connection pads

Semiconductor device including a stress buffer material formed above a low-k metallization system

Three-dimensional system-in-package architecture

Production method of high-density SIM card package

High density sensor array without wells

Package-in-package using through-hole via die on saw streets

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Processes and structures for IC fabrication

Semiconductor substrate and semiconductor chip

Semiconductor device

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Power semiconductor device with reduced contact resistance

Manufacturing method and electronic module with new routing possibilities

Packages with passive devices and methods of forming the same

Semiconductor package including stacked semiconductor chips and a redistribution layer

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed

SEMICONDUCTOR PACKAGE

Semiconductor package having internal shunt and solder stop dimples

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSON

Semiconductor device with wireless communication

Through-silicon via with low-K dielectric liner

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME

Radiation-shielded semiconductor device

Electrical device with protruding contact elements and overhang regions over a cavity

Semiconductor package

Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP

Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

Semiconductor integrated circuit device and method of manufacturing same

Package systems including passive electrical components

Semiconductor package having supporting plate and method of forming the same

Multiple die in a face down package

Power overlay structure with leadframe connections

Fabrication method of packaging substrate having through-holed interposer embedded therein

Semiconductor device

Structure and method for power field effect transistor

Semiconductor device comprising through-electrode interconnect

TCE compensation for package substrates for reduced die warpage assembly

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor device and a method of manufacturing the same

Substrate for semiconductor package and semiconductor package having the same

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device having antenna element and method of manufacturing same

SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and apparatus for measuring analytes using large scale FET arrays

Power module and method for manufacturing the same

Ball-limiting-metallurgy layers in solder ball structures

Methods of forming a metal pattern

Semiconductor device and method for manufacturing the same

Planar interconnect structure for hybrid circuits

WAFER LEVEL EMBEDDED AND STACKED DIE POWER SYSTEM-IN-PACKAGE PACKAGES

Three-dimensional package structure

Method for Predetermined Component Placement to a Target Platform

Method for Predetermined Component Placement to a Target Platform

Two-sided semiconductor structure

Through wafer vias and method of making same

Manufacturing method including deformation of supporting board to accommodate semiconductor device

Electromagnetic shielding structures for selectively shielding components on a substrate

Power module package and system module having the same

Stack frame for electrical connections and the method to fabricate thereof

Group III nitride based flip-chip integrated circuit and method for fabricating

Semiconductor device including a core substrate and a semiconductor element

Component-embedded substrate

Method of making an electronic circuit device

Curing low-k dielectrics for improving mechanical strength

Semiconductor device

Semiconductor device including Schottky barrier diode

Electronic component module

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Connecting and bonding adjacent layers with nanostructures

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Power Semiconductor Module with Embedded Chip Package

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

Liner formation in 3DIC structures

Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance

EMBEDDED CHIP PACKAGE

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Method of producing semiconductor module and semiconductor module

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Electronic Component-Embedded Board and Method of Manufacturing the Same

Methods for forming a micro electro-mechanical device

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Isolation structure

Gate pullback at ends of high-voltage vertical transistor structure

POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF

Semiconductor device and manufacturing method of the same

Method of making a semiconductor device having a functional capping

Formation of alpha particle shields in chip packaging

Semiconductor device and manufacturing method thereof

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

Semiconductor device and radio communication device

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device and a method of manufacturing the same

Packaged electronic devices having die attach regions with selective thin dielectric layer

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

Wafer bonding apparatus

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Integrated circuit micro-module

Mosfet package

Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package

Semiconductor device and method of confining conductive bump material with solder mask patch

On-Chip RF shields with front side redistribution lines

RFID integrated circuit with integrated antenna structure

Semiconductor module having deflecting conductive layer over a spacer structure

Semiconductor device having a vertical interconnect structure using stud bumps

Embedded semiconductor die package and method of making the same using metal frame carrier

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Integrated shunt resistor with external contact in a semiconductor package

Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer

Semiconductor device and wiring board

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

Using backside passive elements for multilevel 3D wafers alignment applications

Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices

Semiconductor die package and method for making the same

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus

Semiconductor package with semiconductor core structure and method of forming same

Vertically integrated systems

Semiconductor device and method for manufacturing the same

Method for producing an integrated circuit and resulting film chip

Electronic component and corresponding production method

Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Radio-frequency packaging with reduced RF loss

Networking packages based on interposers

Semiconductor device for battery power voltage control

Semiconductor device with wireless communication

Semiconductor wiring patterns

Semiconductor device including a DC-DC converter with schottky barrier diode

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

Semiconductor device including a DC-DC converter

Semiconductor device and a method of manufacturing the same

System and method for integrated waveguide packaging

MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor devices and methods of controlling temperature thereof

Solder interconnect pads with current spreading layers

DIE DOWN DEVICE WITH THERMAL CONNECTOR

Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts

Semiconductor device and method of forming passive devices

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Connecting and bonding adjacent layers with nanostructures

SEMICONDUCTOR DEVICE

LEAD-FREE HIGH TEMPERATURE COMPOUND

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Wiring method and device

Glass thick film embedded passive material

Packaging or mounting a component

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die