Integrated circuit package system with heat dissipation enclosure

Integrated circuit package system using heat slug

Semiconductor package system with thermal die bonding

Integrated circuit package system with a heat sink

Integrated circuit package system including shield

Semiconductor package that includes stacked semiconductor die

Method for fabricating semiconductor package with stacked chips

Integrated circuit package to package stacking system

Integrated circuit package system with multi-planar paddle

Semiconductor device, fabrication method therefor, and film fabrication method

Micro lead frame packages and methods of manufacturing the same

Semiconductor device and method of manufacturing the same

Coupling substrate for semiconductor components and method for producing the same

IC card with bonding wire connections of different lengths

IC card

Low profile semiconductor package

IC card

Ultrathin leadframe BGA circuit package

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Board on chip package and method of manufacturing the same

Chip stack structure having shielding capability and system-in-package module using the same

Electronic-part built-in substrate and manufacturing method therefor

Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Implantable microelectronic device and method of manufacture

Substrate frame

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Three-dimensionally integrated electronic assembly

High frequency chip packages with connecting elements

Method and apparatus for attaching a workpiece to a workpiece support

Complex RF device and method for manufacturing the same

Semiconductor heat-transfer method

Semiconductor component and method for production of a semiconductor component

Embedded inductor and application thereof

Embedded inductor element and chip package applying the same

Semiconductor device with improved encapsulation

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device with reduced package cross-talk and loss

Closed loop thermally enhanced flip chip BGA

Integrated chip device in a package

Multi-chip package structure

Lead frame having outer leads coated with a four layer plating

Method for applying a structure of joining material to the back surfaces of semiconductor chips

CHIP PACKAGE METHOD

Encapsulation of a chip module

Re-enforced ball-grid array packages for semiconductor products

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor insulation structure

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Semiconductor package with position member

Chip package having with asymmetric molding and turbulent plate downset design

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same

Package for high frequency waves containing high frequency electronic circuit

Semiconductor device

Universal chip package structure

Manufacturing method for semiconductor device

Arrangement of conductive pads on grid array package and on circuit board

Electronic apparatus

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Integrated circuit package system

Lead frame package structure with high density of lead pins arrangement

Microelectronic interconnect substrate and packaging techniques

CHIP PACKAGE STRUCTURE

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Method of forming a molded array package device having an exposed tab and structure

Integrated circuit package system with multi-surface die attach pad

Die package and method for making the same

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Flash memory card

Cavity chip package

Package with barrier wall and method for manufacturing the same

Package of leadframe with heatsinks

Semiconductor manufacturing method

Method of forming an electrical contact

Method for manufacturing an adhesive substrate with a die-cavity sidewall

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Optical module with can package

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

Semiconductor package with internal shunt resistor

Integrated circuit protruding pad package system

Integrated circuit package system with adhesive restraint

Image sensing device package structure

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Method of forming an electrical contact

Semiconductor device having metallic plate with groove

External contact material for external contacts of a semiconductor device and method of making the same

Integrated circuit package and method of manufacture thereof

Semiconductor device with operation mode set by external resistor

Motor driving inverter circuit module, motor driving apparatus having the motor driving inverter circuit module, and inverter integrated circuit package

Method and apparatus for decoupling conductive portions of a microelectronic device package

High density interconnect assembly comprising stacked electronic module

Semiconductor package and manufacturing method thereof

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Resin mold type semiconductor device

Semiconductor package with a conductive post and wiring pattern

Die pad for semiconductor packages and methods of making and using same

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Solid image pickup unit and camera module

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor multi-chip package including two semiconductor memory chips having different memory densities

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Land grid array semiconductor device packages

Printed circuit board assembly with strain-alleviating structures

Test carrier for semiconductor components having conductors defined by grooves

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Power semiconductor device having lines within a housing

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for producing an electronic component or module and a corresponding component or module

Thermally enhanced cavity down ball grid array package

Heat-conducting packaging of electronic circuit units

Semiconductor component comprising an interposer substrate

Power semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Leadframe package with dual lead configurations

Semiconductor connection component

Semiconductor device and capacitance regulation circuit

Semiconductor device and capacitance regulation circuit

Method and apparatus for fine pitch solder joint

Semiconductor device and a manufacturing method of the same

Semiconductor chip and multi-chip package

Thin IC package for improving heat dissipation from chip backside

Stackable single package and stacked multi-chip assembly

Package frame and semiconductor package using the same

Semiconductor device

Circuit board and manufacturing method thereof

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Board-on-chip package and stack package using the same

SEMICONDUCTOR DEVICE

Integrated circuit package and method of assembling the same

Stack package implementing conductive support

Jig structure for manufacturin a stacked memory card

Enhanced multi-die package

Radio frequency over-molded leadframe package

Semiconductor device and method of manufacturing the same

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Scalable subsystem architecture having integrated cooling channels

Radio frequency power amplifier module

Semiconductor package

Dual BGA alloy structure for improved board-level reliability performance

Method of fabricating self-assembled electrical interconnections

Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Substrate based IC-package

Copper substrate with feedthroughs and interconnection circuits

Semiconductor package and manufacturing method thereof

Package structure having recession portion on the surface thereof and method of making the same

Chip package with asymmetric molding

Method and system for customized radio frequency shielding using solder bumps

Manufacturing process for chip package without core

Method and apparatus for attaching microelectronic substrates and support members

Low profile, chip-scale package and method of fabrication

Method and apparatus for attaching microelectronic substrates and support members

Security apparatus

Ball grid array package and substrate within

Electronic component and electronic configuration

Electronic device and carrier substrate for same

High-frequency device including high-frequency switching circuit

Bumped die and wire bonded board-on-chip package

Semiconductor module

Chip package without core and stacked chip package structure thereof

Packaging of a microchip device

Micro-package, multi-stack micro-package, and manufacturing method therefor

Package structure for a semiconductor device incorporating enhanced solder bump structure

Structure and method for producing multiple size interconnections

Semiconductor package having dual interconnection form and manufacturing method thereof

High frequency package device with internal space having a resonant frequency offset from frequency used

SEMICONDUCTOR MULTI-CHIP PACKAGE

Advanced leadframe having predefined bases for attaching passive components

Cavity ball grid array apparatus having improved inductance characteristics

Method for producing a circuit module

Method and System for Applying an Adhesive Substance on an Electronic Device

Substrate warpage control and continuous electrical enhancement

Method of reducing warpage in an over-molded IC package

Semiconductor device

Stacked semiconductor package

BUMP FOR OVERHANG DEVICE

Anti-warp heat spreader for semiconductor devices

Semiconductor device and method of manufacturing the same

System and method for venting pressure from an integrated circuit package sealed with a lid

Apparatus having reduced warpage in an over-molded IC package

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Semiconductor die package and method for making the same

Die package with asymmetric leadframe connection

System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects

Methods of operating electronic devices, and methods of providing electronic devices

Ultrathin semiconductor circuit having contact bumps

Method of manufacturing a semiconductor device

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Three dimensional device integration method and integrated device

Stacked die in die BGA package

Heat-dissipating semiconductor package and fabrication method thereof

Mounting and adhesive layer for semiconductor components

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor device

Multi-chip device and method for producing a multi-chip device

Stacked memory card and method for manufacturing the same

Lead frame for semiconductor package

Semiconductor device having firmly secured heat spreader

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor device and system having semiconductor device mounted thereon

Chip-on-board assemblies

Semiconductor device and circuit board

Component with sensitive component structures and method for the production thereof

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module with built-in component

Module having stacked chip scale semiconductor packages

Package structure of chip and the package method thereof

Chip-package structure and fabrication process thereof

Method for recording identification information on semiconductor chip, and imaging device

Wiring board, method for manufacturing same, and semiconductor package

Semiconductor module

Method and system for wavelength specific thermal irradiation and treatment

Soldered assemblies and methods of making the same

Ball grid array package with thermally-enhanced heat spreader

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Microelectronic loop packages

Leadless semiconductor package

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Electronic circuit protection device

Semiconductor package and fabrication method thereof

Assembly structure and method for chip scale package

Stacked chip security

Lead frame with attached components

Curable silicone rubber composition and semiconductor device

Method of fabricating wiring board and method of fabricating semiconductor device

Surface mount type semiconductor device and method of manufacturing the same

Method of forming overhang support for a stacked semiconductor device

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Epoxy bump for overhang die

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Taped semiconductor device and method of manufacture

Semiconductor device

Varied-thickness heat sink for integrated circuit (IC) package

Graded liquid crystal polymer package

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Method for efficiently producing removable peripheral cards

Lead frame, semiconductor device, method for producing semiconductor device, and injection mold

Methods of making integrated circuits

Panel and semiconductor device having a composite plate with semiconductor chips

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

System and method for die attach using a backside heat spreader

Semiconductor package and leadframe therefor having angled corners

Composite material, electrical circuit or electric module

Jig structure for manufacturing an image sensor

Semiconductor integrated circuit device

CHIP PACKAGE STRUCTURE

Methods and apparatuses for encapsulating microelectronic devices

Multi-chip module and methods

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

System-in-a-package based flash memory card

Leadframeless package structure and method

Microelectronic imagers and methods of packaging microelectronic imagers

Wafer-level electro-optical semiconductor manufacture fabrication method

Integrated circuit package including miniature antenna

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Flip chip package having protective cap and method of fabricating the same

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Semiconductor module provided with contacts extending through the package

Lid used in package structure and the package structure having the same

Multi stack packaging chip and method of manufacturing the same

Method for encapsulating a semiconductor device and semiconductor device

Semiconductor device and manufacturing method of the same

Multiple chip package module including die stacked over encapsulated package

Package for receiving electronic parts, and electronic device and mounting structure thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Large die package and method for the fabrication thereof

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

Electronic component and electronic configuration

Microelectronic component and assembly having leads with offset portions

Method of manufacturing a semiconductor apparatus

Multi-chip semiconductor package

Circuit board with built-in electronic component and method for manufacturing the same

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Semiconductor device assemblies with compliant spring contact structures

Fabrication of compliant spring contact structures and use thereof

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Semiconductor die edge reconditioning

Standoffs for centralizing internals in packaging process

Shielding arrangement to protect a circuit from stray magnetic fields

Leadframe with encapsulant guide and method for the fabrication thereof

Method of forming a substrateless semiconductor package